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XC7Z030-2FBG484E

Xilinx

XC7Z030-2FBG484E by Xilinx

XC7Z030-2FBG484E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, suitable for various applications requiring high-performance processing capabilities.

Median Price

$374.490

Lifecycle Status

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Mouser Electronics

USA . 4 parts In-Stock

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Nova Conductors

Japan . 27 parts In-Stock

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Vyrian

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Semicontronic

India . 261 parts In-Stock

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$4.000

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$3.900

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$3.880

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Modulus Dynamics

Lithuania . 243 parts In-Stock

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$8.262

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AZTECH Wire

Italy . 504 parts In-Stock

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One Stop Electronics

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MARBEL Systems

Belgium . 3,585 parts In-Stock

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Texas Native Microelectronics

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Ampacity Inc.

Singapore . 1,209 parts In-Stock

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Kenton Components

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Qasali Group International

UK . 4,962 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,904 parts In-Stock

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Corohmni

South Africa . 161 parts In-Stock

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Advanced Electronics

New Zealand . 1,800 parts In-Stock

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Vigor

Singapore . 280 parts In-Stock

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Continental Prestige Electronics

USA . 5,661 parts In-Stock

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Argo Parts USA

USA . 4,656 parts In-Stock

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Lixinc

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Supply Digital

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Netroflash

USA . 1,000 parts In-Stock

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Kepictronics

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Lucentia Tech

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Overview

Elevate your electronic designs with the XC7Z030-2FBG484E by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality Other Function uPs,uCs & Peripheral ICs that are perfect for a wide range of applications. With a package style of GRID ARRAY and a terminal pitch of 1mm, this system on chip offers exceptional performance and reliability. Experience the value and benefits of this innovative product, from its maximum supply voltage of 1.05V to its minimum operating temperature of 0°C. Take your projects to the next level with the XC7Z030-2FBG484E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy and compact mounting on circuit boards.

Maximum Supply Voltage: 1.05 V

Support for a maximum supply voltage of 1.05 V ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the PCB.

No. of Terminals: 484

Having a large number of terminals allows for connection to multiple external components and peripherals.

Package Style (Meter): GRID ARRAY

Grid array package style provides better thermal performance and electrical connectivity.

Minimum Supply Voltage: 0.95 V

Support for a minimum supply voltage of 0.95 V ensures low power consumption and efficient operation.

Maximum Operating Temperature: 100 °C

High maximum operating temperature of 100°C allows for reliable performance in demanding environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C ensures stable operation in cold conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure placement on the PCB.

Maximum Seated Height: 2.54 mm

Low maximum seated height of 2.54 mm allows for compact and slim designs.

Width: 23 mm

Compact width of 23 mm helps in fitting the product in tight spaces.

Length: 23 mm

Compact length of 23 mm helps in fitting the product in tight spaces.

Peripheral IC Type: SYSTEM ON CHIP

Integration of various functions into a single chip reduces board space requirement and simplifies design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and ease of soldering.

Nominal Supply Voltage: 1 V

Support for a nominal supply voltage of 1 V ensures stable and efficient operation.

Terminal Pitch: 1 mm

Fine terminal pitch of 1 mm allows for high-density mounting on the PCB.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z030-2FBG484E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B484

Length:

23 mm

No. of Terminals:

484

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA484,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XC7Z030-2FBG484E Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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