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AX8052F131-3-TB05

Onsemi

AX8052F131-3-TB05 by Onsemi

AX8052F131-3-TB05 by Onsemi is a 28-terminal IC with max supply voltage of 3.6V and min of 2.2V, operating b/w -40 to 85 °C. It's a CMOS System on Chip suitable for industrial applications due to its compact size (7x5mm) and no-lead terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,518 parts In-Stock

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Digiode

USA . 473 parts In-Stock

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473

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AZTECH Wire

Italy . 274 parts In-Stock

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$17.520

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Native Components

USA . 118 parts In-Stock

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Northwest PG Solutions

USA . 1,028 parts In-Stock

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$19.525

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Kulean Microsystems

USA . 6,737 parts In-Stock

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Problanco Electronics

Mexico . 5,759 parts In-Stock

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TANS Electronics

Latvia . 4,555 parts In-Stock

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SupplyDigital Components

Austria . 3,655 parts In-Stock

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UHIMA Technologies

Türkiye . 849 parts In-Stock

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Corphita

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Corohmni

South Africa . 120 parts In-Stock

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Overview

Unleash the power of innovation with the AX8052F131-3-TB05 by Onsemi! This cutting-edge System on Chip (SoC) is designed to deliver unparalleled performance and reliability for a wide range of applications. From IoT devices to wireless communication systems, this versatile chip carrier offers unmatched value and efficiency. With a wide operating temperature range and advanced CMOS technology, customers can trust in the quality and precision that Onsemi brings to every product. Upgrade your projects today with the AX8052F131-3-TB05 and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good durability and protection for the IC, ensuring long term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options, making it suitable for a wide range of applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, maximizing component density.

No. of Terminals: 28

Higher number of terminals allows for more connectivity options and functionality in the IC.

Minimum Supply Voltage: 2.2 V

Low minimum supply voltage ensures compatibility with a variety of power sources, including batteries.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh environments and extended usage.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold conditions without sacrificing performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel, palladium, and gold terminal finish provides good conductivity and corrosion resistance, ensuring stable and reliable connections.

Terminal Position: QUAD

Quad terminal position allows for easier soldering and assembly on the PCB, reducing production time and cost.

Maximum Seated Height: 1 mm

Low maximum seated height minimizes the overall profile of the IC, allowing for more compact and streamlined designs.

Width: 5 mm

Narrow width of the IC allows for efficient use of space on the PCB, ideal for applications with limited board real estate.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and rework processes, guaranteeing strong and reliable connections.

Length: 7 mm

Optimal length of the IC provides a good balance between component density and ease of handling during assembly.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions typically found in industrial environments.

Peripheral IC Type: SYSTEM ON CHIP

System on chip design integrates multiple functions into a single IC, reducing component count and overall system complexity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy efficient and reliable in noisy environments.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and reduces the risk of lead contamination in the manufacturing process.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage at 3V provides consistent performance and compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high density mounting on the PCB, enabling compact and efficient system design.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AX8052F131-3-TB05 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.35X.55

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

AX8052F131-3-TB05 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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