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XC7Z045-3FFG676E

Xilinx

XC7Z045-3FFG676E by Xilinx

XC7Z045-3FFG676E by Xilinx is a CMOS system-on-chip with 676 terminals and a package size of 27mm x 27mm. It operates at a voltage range of 0.95V to 1.05V and has a max temperature rating of 100°C. This versatile IC is commonly used in various applications requiring high-performance processing capabilities.

Median Price

$2,980.700

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Mouser Electronics

USA . 3 parts In-Stock

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Digiode

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VNN

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Nova Conductors

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AZTECH Wire

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Modulus Dynamics

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Aztec Data Supply Inc.

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Texas Native Microelectronics

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Kenton Components

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$205.981

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$191.563

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Qasali Group International

UK . 2,749 parts In-Stock

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Microchip USA

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One Stop Electronics

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Corphita

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Aranea Global

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Argo Parts USA

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Continental Prestige Electronics

USA . 1,826 parts In-Stock

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Advanced Electronics

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Supply Digital

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Overview

Experience the power of the XC7Z045-3FFG676E by Xilinx, a cutting-edge System on Chip (SoC) that will revolutionize your applications. With its high-quality manufacturing by Xilinx, a leader in the industry, this versatile device offers incredible value and countless benefits. Whether you're designing complex embedded systems, advanced signal processing, or industrial automation solutions, the XC7Z045-3FFG676E delivers unparalleled performance and reliability. Its compact design and extensive terminal options make it perfect for any project. Embrace the future of technology with the XC7Z045-3FFG676E and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to breakage, making this product a reliable choice.

Surface Mount: YES

With the surface mount feature, this product can be easily mounted onto PCBs, saving space and making it suitable for compact designs.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage allows for efficient and reliable power delivery, making this product suitable for demanding applications.

Package Shape: SQUARE

The square package shape provides uniformity and ease of integration, making this product suitable for various design layouts.

No. of Terminals: 676

With a large number of terminals, this product allows for versatile connectivity options, suitable for complex system configurations.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved electrical and thermal performance, making this product ideal for high-performance applications.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures efficient power consumption, making this product energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance even in extreme temperatures.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature enables this product to function reliably in cold environments, making it suitable for various applications.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The terminal finish of tin/silver/copper provides excellent electrical conductivity and corrosion resistance, ensuring long-term reliability of the product.

Terminal Position: BOTTOM

The terminal position at the bottom allows for easy and convenient PCB mounting, enhancing the overall usability of this product.

Maximum Seated Height: 3.24 mm

With a compact maximum seated height, this product can be easily integrated into space-constrained designs, making it ideal for applications with limited space.

Width: 27 mm

The width of 27 mm provides a suitable size for integration into various electronic devices, ensuring flexibility in design options.

Length: 27 mm

The length of 27 mm offers a compact form factor, making this product compatible with a wide range of applications requiring small dimensions.

Peripheral IC Type: SYSTEM ON CHIP

The peripheral IC type of system on chip provides integrated functionality and improved performance, making this product a versatile and efficient choice for various applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high-speed operation, making this product energy-efficient and suitable for high-performance requirements.

Terminal Form: BALL

With the terminal form of ball, this product offers reliable electrical connections and facilitates high-speed data transmission, making it suitable for demanding applications.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V ensures stable and optimal power delivery, making this product suitable for precise and accurate operation.

Terminal Pitch: 1 mm

With a small terminal pitch of 1 mm, this product allows for high-density PCB layouts, making it suitable for space-constrained designs.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that this product has a good resistance to moisture, ensuring long-term reliability even in humid environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z045-3FFG676E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Length:

27 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.24 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z045-3FFG676E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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