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MCIMX6X4EVM10AC

NXP Semiconductors

MCIMX6X4EVM10AC by NXP Semiconductors

MCIMX6X4EVM10AC by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 529 terminals. It operates b/w -20 to 105°C and has a supply voltage range of 1.35V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.

Median Price

$29.150

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 511 parts In-Stock

1+ parts

$48.190

100+ parts

$35.136

1k+ parts

$33.733

10k+ parts

-

511

$48.190

$35.136

$33.733

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Flip Electronics (Authorized)

USA . 427 parts In-Stock

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-

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427

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Verical

USA . 336 parts In-Stock

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$27.511

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336

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$27.511

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Rochester

USA . 96 parts In-Stock

1+ parts

-

100+ parts

$29.150

1k+ parts

$26.080

10k+ parts

$24.540

96

-

$29.150

$26.080

$24.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,238 parts In-Stock

1+ parts

$26.904

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3,238

$26.904

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Nova Conductors

Japan . 77 parts In-Stock

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$31.620

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77

$31.620

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Vyrian

USA . 4,160 parts In-Stock

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4,160

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Chip Stock

USA . 3,400 parts In-Stock

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3,400

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Anansix

USA . 1,165 parts In-Stock

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ComSIT Distribution GmbH

Germany . 464 parts In-Stock

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464

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DigiKey Marketplace

USA . 427 parts In-Stock

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427

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Flip Electronics

USA . 277 parts In-Stock

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277

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 337 parts In-Stock

1+ parts

$22.930

100+ parts

-

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337

$22.930

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Semicontronic

India . 337 parts In-Stock

1+ parts

$22.930

100+ parts

$22.357

1k+ parts

$22.242

10k+ parts

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337

$22.930

$22.357

$22.242

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Corphita

USA . 290 parts In-Stock

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$25.488

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290

$25.488

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$30.450

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$28.927

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$28.927

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500

$30.450

$28.927

$28.927

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Aztec Data Supply Inc.

USA . 1,424 parts In-Stock

1+ parts

$39.660

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1,424

$39.660

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Corohmni

South Africa . 75 parts In-Stock

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$45.011

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75

$45.011

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Microchip USA

USA . 2,642 parts In-Stock

1+ parts

$104.100

100+ parts

$102.290

1k+ parts

$101.380

10k+ parts

$100.480

2,642

$104.100

$102.290

$101.380

$100.480

Lixinc

USA . 8,592 parts In-Stock

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Continental Prestige Electronics

USA . 3,257 parts In-Stock

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Argo Parts USA

USA . 2,974 parts In-Stock

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UNI Independent Distributors

Spain . 2,690 parts In-Stock

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2,690

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Netroflash

USA . 2,000 parts In-Stock

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100+ parts

$30.988

1k+ parts

$30.039

10k+ parts

$29.407

2,000

-

$30.988

$30.039

$29.407

Overview

Discover the cutting-edge technology and superior quality of the MCIMX6X4EVM10AC by NXP Semiconductors. Designed to meet the demands of various applications in the Other Function uPs,uCs & Peripheral ICs category, this product offers unmatched performance and reliability. With a focus on innovation and customer satisfaction, NXP Semiconductors ensures that this product delivers exceptional value and benefits to users. Explore the endless possibilities and experience the advantages that this state-of-the-art device brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external elements, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability makes it easy to integrate into circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.5 V

Can operate at a maximum supply voltage of 1.5V, making it suitable for a wide range of applications without risking damage.

Package Shape: SQUARE

Square shape allows for efficient use of space on circuit boards and makes the product visually appealing.

No. of Terminals: 529

Having a high number of terminals allows for enhanced connectivity options and flexibility in circuit design.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style makes the product suitable for high-density applications with precise positioning requirements.

Minimum Supply Voltage: 1.35 V

Ability to operate at a minimum supply voltage of 1.35V offers energy efficiency and flexibility in power options.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature of -20°C allows for operation in a wide range of temperature conditions.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure mounting on circuit boards.

Maximum Seated Height: 1.52 mm

Low maximum seated height allows for a compact and streamlined design.

Width: 19 mm

Compact width of 19mm enables efficient layout and integration into tight spaces.

Maximum Time At Peak Reflow Temperature (s): 40

Withstanding the peak reflow temperature for up to 40 seconds ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable and stable solder joints during assembly.

Length: 19 mm

With a length of 19mm, the product maintains a square shape for easy integration into layouts.

Peripheral IC Type: SoC

System on Chip (SoC) integration offers a compact and efficient solution for multiple functions in a single package.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and compatibility with digital systems.

Terminal Form: BALL

Ball terminal form allows for reliable connections and easy mounting on circuit boards.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm enables high-density mounting and precise connections in compact designs.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level 3 indicates moderate sensitivity to moisture, requiring standard handling precautions during storage and assembly.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6X4EVM10AC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

529

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.52 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6X4EVM10AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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