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NT3H2111W0FHK

NXP Semiconductors

NT3H2111W0FHK by NXP Semiconductors

NT3H2111W0FHK by NXP Semiconductors is a surface mount microprocessor circuit with 8 terminals. It operates at a supply voltage range of 1.67V to 3.6V and can withstand temperatures from -40°C to 105°C. This chip carrier package is commonly used in industrial applications requiring NFC functionality.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,539 parts In-Stock

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3,539

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ComSIT Distribution GmbH

Germany . 3,203 parts In-Stock

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Anansix

USA . 1,842 parts In-Stock

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Vyrian

USA . 1,519 parts In-Stock

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Nova Conductors

Japan . 21 parts In-Stock

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AZTECH Wire

Italy . 547 parts In-Stock

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$5.532

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547

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Semicontronic

India . 944 parts In-Stock

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$11.000

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$10.725

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$10.670

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944

$11.000

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$10.670

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Ampacity Inc.

Singapore . 1,592 parts In-Stock

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$14.000

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One Stop Electronics

USA . 1,198 parts In-Stock

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$19.000

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Corohmni

South Africa . 368 parts In-Stock

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$28.493

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368

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Aztec Data Supply Inc.

USA . 4,729 parts In-Stock

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$58.750

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$58.750

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Kepictronics

USA . 13,615 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,900 parts In-Stock

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Lixinc

USA . 6,342 parts In-Stock

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Continental Prestige Electronics

USA . 6,076 parts In-Stock

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Argo Parts USA

USA . 4,064 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 1,665 parts In-Stock

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UNI Independent Distributors

Spain . 436 parts In-Stock

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436

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Experience the ultimate in quality and innovation with the NT3H2111W0FHK by NXP Semiconductors. As a leader in semiconductor technology, NXP Semiconductors delivers exceptional products that exceed industry standards. The NT3H2111W0FHK is a versatile microprocessor circuit that opens endless possibilities for your applications. With its compact size and advanced features, this product offers unparalleled value, benefits, and advantages to customers. Unlock new levels of connectivity, security, and performance with the NT3H2111W0FHK by NXP Semiconductors.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

This high maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in design.

Package Shape: SQUARE

Square packages are typically more space-efficient and allow for easier arrangement on the PCB.

No. of Terminals: 8

Having 8 terminals provides enough connectivity options for various functions without being overly complex.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer good thermal performance and are well-suited for high-density PCB designs.

Minimum Supply Voltage: 1.67 V

The low minimum supply voltage allows for operation in systems with limited power availability or battery-powered applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this product suitable for industrial applications where thermal conditions can be demanding.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance even in harsh environmental conditions.

Terminal Position: QUAD

Quad terminal positions provide mechanical stability and easy soldering during assembly.

Maximum Seated Height: 0.5 mm

The low seated height allows for a sleek and compact design, ideal for space-constrained applications.

Width: 1.6 mm

The small width dimension contributes to the overall compactness of the product, facilitating integration into tight spaces.

Length: 1.6 mm

The small length dimension further enhances the product's compact form factor, making it suitable for miniaturized systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in a wide range of temperature conditions typically found in industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced processing capabilities and is suitable for a wide range of digital applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a variety of logic levels, making the product energy-efficient and versatile.

Terminal Form: NO LEAD

No-lead terminals offer improved electrical performance, better thermal conductivity, and reduced solder joint stress, enhancing reliability and longevity.

Nominal Supply Voltage: 1.8 V

The 1.8V nominal supply voltage is commonly used in modern electronic devices, ensuring compatibility with standard power sources.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs NT3H2111W0FHK attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-XQCC-N8

Length:

1.6 mm

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.67 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Width:

1.6 mm

Peripheral IC Type:

Trade Compliance

NT3H2111W0FHK Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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