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CC1310F32RSMT

Texas Instruments

CC1310F32RSMT by Texas Instruments

CC1310F32RSMT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C, with a supply voltage range of 1.8-3.8 V. This MICROPROCESSOR CIRCUIT is ideal for industrial applications requiring low power consumption and compact design.

Median Price

$6.420

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 339 parts In-Stock

1+ parts

$0.797

100+ parts

$0.759

1k+ parts

-

10k+ parts

-

339

$0.797

$0.759

-

-

Texas Instruments

USA . 24,420 parts In-Stock

1+ parts

$5.961

100+ parts

$5.223

1k+ parts

$2.951

10k+ parts

-

24,420

$5.961

$5.223

$2.951

-

Mouser Electronics

USA . 949 parts In-Stock

1+ parts

$6.880

100+ parts

$5.310

1k+ parts

$4.220

10k+ parts

-

949

$6.880

$5.310

$4.220

-

DigiKey

USA . 2 parts In-Stock

1+ parts

$6.880

100+ parts

-

1k+ parts

$4.651

10k+ parts

$4.447

2

$6.880

-

$4.651

$4.447

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,135 parts In-Stock

1+ parts

$0.757

100+ parts

-

1k+ parts

-

10k+ parts

-

1,135

$0.757

-

-

-

Nova Conductors

Japan . 21 parts In-Stock

1+ parts

$3.041

100+ parts

-

1k+ parts

-

10k+ parts

-

21

$3.041

-

-

-

Vyrian

USA . 7,609 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,609

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,362 parts In-Stock

1+ parts

$0.680

100+ parts

-

1k+ parts

-

10k+ parts

-

6,362

$0.680

-

-

-

Semicontronic

India . 6,354 parts In-Stock

1+ parts

$0.680

100+ parts

$0.663

1k+ parts

$0.660

10k+ parts

-

6,354

$0.680

$0.663

$0.660

-

Corphita

USA . 3,715 parts In-Stock

1+ parts

$0.717

100+ parts

-

1k+ parts

-

10k+ parts

-

3,715

$0.717

-

-

-

Continental Prestige Electronics

USA . 6,479 parts In-Stock

1+ parts

$3.041

100+ parts

-

1k+ parts

-

10k+ parts

$2.980

6,479

$3.041

-

-

$2.980

Argo Parts USA

USA . 3,738 parts In-Stock

1+ parts

$3.041

100+ parts

-

1k+ parts

-

10k+ parts

-

3,738

$3.041

-

-

-

Parana Technologies

USA . 1,043 parts In-Stock

1+ parts

$19.910

100+ parts

-

1k+ parts

$19.862

10k+ parts

-

1,043

$19.910

-

$19.862

-

DigiPath Technology Company

USA . 2,351 parts In-Stock

1+ parts

$21.924

100+ parts

-

1k+ parts

-

10k+ parts

-

2,351

$21.924

-

-

-

ChromeModa Solutions

Germany . 2,983 parts In-Stock

1+ parts

$22.371

100+ parts

$18.344

1k+ parts

-

10k+ parts

-

2,983

$22.371

$18.344

-

-

IDEA Electronic Components Group

UK . 779 parts In-Stock

1+ parts

$22.371

100+ parts

$21.252

1k+ parts

$20.134

10k+ parts

-

779

$22.371

$21.252

$20.134

-

Corohmni

South Africa . 5,057 parts In-Stock

1+ parts

$58.512

100+ parts

-

1k+ parts

-

10k+ parts

-

5,057

$58.512

-

-

-

Lixinc

USA . 17,874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,874

-

-

-

-

Overview

Unlock the potential of your electronic devices with the CC1310F32RSMT by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for a variety of applications. This versatile microprocessor circuit offers customers exceptional value with its advanced technology and industrial-grade performance. Whether you're designing IoT devices or smart sensors, the CC1310F32RSMT provides the power and efficiency you need to bring your ideas to life. Trust Texas Instruments to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for portable devices.

Surface Mount: YES

Surface mount technology makes the product easy to assemble and allows for a compact design, saving space on the PCB.

Maximum Supply Voltage: 3.8 V

The high maximum supply voltage allows for flexibility in powering the device and is compatible with a wide range of power sources.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enables the product to operate efficiently at lower power levels, reducing energy consumption.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers high performance and energy efficiency, making it suitable for a variety of applications requiring processing power.

RAM Bytes: 28672

With a large amount of RAM, the product can handle complex tasks and store data efficiently, enhancing overall performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, increasing the reliability and efficiency of the product.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is a common standard in electronics, ensuring compatibility with various power sources and peripherals.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC1310F32RSMT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

28672

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Trade Compliance

CC1310F32RSMT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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