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CC1310F128RHBT

Texas Instruments

CC1310F128RHBT by Texas Instruments

CC1310F128RHBT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring a microprocessor circuit in a compact chip carrier package.

Median Price

$7.306

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 100,340 parts In-Stock

1+ parts

$6.832

100+ parts

$5.986

1k+ parts

$3.382

10k+ parts

-

100,340

$6.832

$5.986

$3.382

-

Mouser Electronics

USA . 1,365 parts In-Stock

1+ parts

$7.780

100+ parts

$5.900

1k+ parts

$4.670

10k+ parts

-

1,365

$7.780

$5.900

$4.670

-

DigiKey

USA . 704 parts In-Stock

1+ parts

$7.780

100+ parts

$5.892

1k+ parts

$5.272

10k+ parts

$5.041

704

$7.780

$5.892

$5.272

$5.041

RS (Exports)

UK . 490 parts In-Stock

1+ parts

-

100+ parts

$6.360

1k+ parts

-

10k+ parts

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490

-

$6.360

-

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.009

100+ parts

-

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100

$5.009

-

-

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TME

Poland . 233 parts In-Stock

1+ parts

$5.950

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-

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233

$5.950

-

-

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Digiode

USA . 1,957 parts In-Stock

1+ parts

$6.490

100+ parts

-

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-

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1,957

$6.490

-

-

-

Chip Stock

USA . 72,700 parts In-Stock

1+ parts

-

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72,700

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Vyrian

USA . 25,569 parts In-Stock

1+ parts

-

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25,569

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Semtec, LLC

USA . 15,079 parts In-Stock

1+ parts

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15,079

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,944 parts In-Stock

1+ parts

$5.009

100+ parts

-

1k+ parts

-

10k+ parts

$4.908

5,944

$5.009

-

-

$4.908

Semicontronic

India . 25,386 parts In-Stock

1+ parts

$5.410

100+ parts

$5.275

1k+ parts

$5.248

10k+ parts

-

25,386

$5.410

$5.275

$5.248

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Ampacity Inc.

Singapore . 25,379 parts In-Stock

1+ parts

$5.410

100+ parts

-

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25,379

$5.410

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Corphita

USA . 3,421 parts In-Stock

1+ parts

$6.149

100+ parts

-

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3,421

$6.149

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$33.997

100+ parts

$30.937

1k+ parts

$27.878

10k+ parts

-

2,000

$33.997

$30.937

$27.878

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Parana Technologies

USA . 468 parts In-Stock

1+ parts

$43.124

100+ parts

$4,004.723

1k+ parts

$38.812

10k+ parts

-

468

$43.124

$4,004.723

$38.812

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Corohmni

South Africa . 227 parts In-Stock

1+ parts

$46.087

100+ parts

-

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227

$46.087

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DigiPath Technology Company

USA . 504 parts In-Stock

1+ parts

$47.485

100+ parts

$43.686

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-

10k+ parts

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504

$47.485

$43.686

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IDEA Electronic Components Group

UK . 1,517 parts In-Stock

1+ parts

$48.454

100+ parts

$46.031

1k+ parts

$43.609

10k+ parts

-

1,517

$48.454

$46.031

$43.609

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ChromeModa Solutions

Germany . 423 parts In-Stock

1+ parts

$48.454

100+ parts

$39.732

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423

$48.454

$39.732

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Kepictronics

USA . 12,103 parts In-Stock

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Lixinc

USA . 3,852 parts In-Stock

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3,852

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Argo Parts USA

USA . 3,801 parts In-Stock

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3,801

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Perfect Parts

USA . 560 parts In-Stock

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560

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Authorized Procurement Solutions

USA . 115 parts In-Stock

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115

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GreenTree Electronics

Israel . 115 parts In-Stock

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115

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Overview

Unlock the power of innovation with the CC1310F128RHBT by Texas Instruments. This cutting-edge microprocessor circuit offers unparalleled quality and reliability, backed by the industry-leading manufacturer. Ideal for a wide range of applications, this chip carrier boasts a very thin profile and nickel/palladium/gold terminal finish. With a minimum operating temperature of -40°C and maximum supply voltage of 3.8V, the CC1310F128RHBT delivers exceptional performance in industrial settings. Trust Texas Instruments to provide the technology you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the components inside, making it a reliable choice.

Surface Mount:

YES - The surface mount feature allows for easy installation and space-saving design, making it convenient for integration into various electronic devices.

Maximum Supply Voltage:

3.8 V - With a high supply voltage, this product can handle power fluctuations without compromising performance.

Package Shape:

SQUARE - The square shape of the package allows for efficient use of space on circuit boards, maximizing functionality in a compact form factor.

No. of Terminals:

32 - With a sufficient number of terminals, this product offers versatility in connecting to other components for seamless operation.

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - The combination of these styles offers enhanced thermal management and space-saving benefits, making it an ideal choice for compact electronic devices.

Minimum Supply Voltage:

1.8 V - The low minimum supply voltage requirement makes this product energy-efficient and suitable for battery-powered applications.

Maximum Operating Temperature:

85 °C - With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliability in demanding situations.

CPU Family:

CORTEX-M3 - The CPU family of Cortex-M3 ensures high performance and efficiency, making it suitable for handling complex tasks with ease.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature allows this product to function reliably in extreme cold environments without compromising performance.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - The use of high-quality terminal finish ensures excellent conductivity and resistance to corrosion, extending the lifespan of the product.

Terminal Position:

QUAD - The quad terminal position provides a secure and stable connection, minimizing the risk of signal interference and ensuring smooth operation.

Maximum Seated Height:

1 mm - The low seated height of the package allows for slim and sleek designs, ideal for compact electronic devices.

Width:

5 mm - The standardized width of 5mm ensures compatibility with industry-standard components, making it easy to integrate into various systems.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature enables reliable soldering and ensures the durability of the product during assembly processes.

Length:

5 mm - The compact length of 5mm makes this product suitable for space-constrained applications without sacrificing functionality.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade ensures stable performance in harsh environments, making it suitable for rugged applications.

Peripheral IC Type:

MICROPROCESSOR CIRCUIT - The peripheral IC type of microprocessor circuit offers advanced processing capabilities, enhancing the overall performance of the product.

RAM Bytes:

28672 - With a generous amount of RAM, this product can handle complex computations and data storage effectively, making it suitable for high-performance applications.

Technology:

CMOS - The CMOS technology used in this product offers low power consumption and high speed, perfect for energy-efficient and fast-paced operations.

Terminal Form:

NO LEAD - The no-lead terminal form reduces the risk of solder joint cracks and ensures long-term reliability, making it a durable choice for electronic devices.

Nominal Supply Voltage:

3.3 V - The nominal supply voltage of 3.3V provides stable power delivery, ensuring consistent performance and functionality.

Terminal Pitch:

0.5 mm - The small terminal pitch of 0.5mm allows for close placement of components, enabling dense and efficient circuit designs.

Moisture Sensitivity Level (MSL):

3 - With an MSL of 3, this product is moisture-resistant, preventing damage from humidity and ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC1310F128RHBT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

28672

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

CC1310F128RHBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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