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CC1310F64RGZT

Texas Instruments

CC1310F64RGZT by Texas Instruments

CC1310F64RGZT by Texas Instruments is a 48-terminal microprocessor circuit with a Cortex-M3 CPU, operating at -40 to 85°C. It features 28,672 RAM bytes and a CMOS technology with a supply voltage range of 1.8V to 3.8V. Ideal for industrial applications requiring low power consumption and high performance in compact designs.

Median Price

$7.240

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,155 parts In-Stock

1+ parts

$6.308

100+ parts

$5.528

1k+ parts

$3.123

10k+ parts

-

7,155

$6.308

$5.528

$3.123

-

DigiKey

USA . 664 parts In-Stock

1+ parts

$7.240

100+ parts

$5.479

1k+ parts

$4.900

10k+ parts

$4.685

664

$7.240

$5.479

$4.900

$4.685

Mouser Electronics

USA . 298 parts In-Stock

1+ parts

$7.240

100+ parts

$5.480

1k+ parts

$4.440

10k+ parts

-

298

$7.240

$5.480

$4.440

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$4.589

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$4.589

-

-

-

Digiode

USA . 1,501 parts In-Stock

1+ parts

$5.993

100+ parts

-

1k+ parts

-

10k+ parts

-

1,501

$5.993

-

-

-

Vyrian

USA . 4,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,635

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,924 parts In-Stock

1+ parts

$4.589

100+ parts

-

1k+ parts

-

10k+ parts

$4.497

5,924

$4.589

-

-

$4.497

Netroflash

USA . 100 parts In-Stock

1+ parts

$4.589

100+ parts

-

1k+ parts

$4.359

10k+ parts

$4.267

100

$4.589

-

$4.359

$4.267

Semicontronic

India . 2,567 parts In-Stock

1+ parts

$5.360

100+ parts

$5.226

1k+ parts

$5.199

10k+ parts

-

2,567

$5.360

$5.226

$5.199

-

Ampacity Inc.

Singapore . 2,254 parts In-Stock

1+ parts

$5.360

100+ parts

-

1k+ parts

-

10k+ parts

-

2,254

$5.360

-

-

-

Corphita

USA . 3,782 parts In-Stock

1+ parts

$5.677

100+ parts

-

1k+ parts

-

10k+ parts

-

3,782

$5.677

-

-

-

Corohmni

South Africa . 1,986 parts In-Stock

1+ parts

$42.011

100+ parts

-

1k+ parts

-

10k+ parts

-

1,986

$42.011

-

-

-

Parana Technologies

USA . 2,183 parts In-Stock

1+ parts

$44.214

100+ parts

-

1k+ parts

-

10k+ parts

-

2,183

$44.214

-

-

-

DigiPath Technology Company

USA . 1,360 parts In-Stock

1+ parts

$48.685

100+ parts

-

1k+ parts

-

10k+ parts

-

1,360

$48.685

-

-

-

ChromeModa Solutions

Germany . 4,163 parts In-Stock

1+ parts

$49.679

100+ parts

$40.737

1k+ parts

-

10k+ parts

-

4,163

$49.679

$40.737

-

-

IDEA Electronic Components Group

UK . 1,074 parts In-Stock

1+ parts

$49.679

100+ parts

$47.195

1k+ parts

$44.711

10k+ parts

-

1,074

$49.679

$47.195

$44.711

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$56.980

100+ parts

$54.131

1k+ parts

$54.131

10k+ parts

-

500

$56.980

$54.131

$54.131

-

Argo Parts USA

USA . 292 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

292

-

-

-

-

Overview

Discover the CC1310F64RGZT by Texas Instruments, a top-quality microprocessor circuit designed for a wide range of applications. With advanced technology and reliable performance, this chip carrier offers industrial-grade durability and efficiency. Perfect for projects requiring low power consumption and high processing speeds, the CC1310F64RGZT provides exceptional value and benefits to customers looking for cutting-edge solutions. Experience the advantages of Texas Instruments' expertise in semiconductor manufacturing with this versatile and innovative product.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is lightweight and durable, making the product suitable for various applications.

Surface Mount:

YES - This feature allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage:

3.8 V - With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing versatility.

Package Shape:

SQUARE - The square shape offers a compact design, optimizing space utilization in electronic devices.

No. of Terminals:

48 - The high number of terminals allows for multiple connections and functions, enhancing the product's capabilities.

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - This advanced package style offers efficient heat dissipation and a slim profile, ideal for compact designs.

Minimum Supply Voltage:

1.8 V - The low minimum supply voltage ensures efficient power consumption, making the product energy-efficient.

Maximum Operating Temperature:

85 °C - With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

CPU Family:

CORTEX-M3 - The Cortex-M3 CPU family offers high performance and efficiency, making this product suitable for demanding tasks.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature allows the product to function reliably in extreme cold environments.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position:

QUAD - The quad terminal position allows for stable connections and efficient data transfer, enhancing the product's performance.

Maximum Seated Height:

1 mm - The low maximum seated height ensures compatibility with slim devices and facilitates compact designs.

Width:

7 mm - The compact width of the product enables easy integration into various electronic applications.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature allows for reliable soldering processes, ensuring secure connections.

Length:

7 mm - The moderate length of the product offers a balanced form factor for efficient space utilization.

Temperature Grade:

INDUSTRIAL - This temperature grade indicates that the product is designed for industrial applications, ensuring reliability in demanding environments.

Peripheral IC Type:

MICROPROCESSOR CIRCUIT - This peripheral IC type enhances the product's functionality and processing capabilities.

RAM Bytes:

28672 - The high RAM capacity allows for efficient data storage and processing, making the product suitable for complex tasks.

Technology:

CMOS - The CMOS technology used in this product offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form:

NO LEAD - The no-lead terminal form simplifies the manufacturing process and improves reliability.

Nominal Supply Voltage:

3.3 V - The nominal supply voltage ensures stable operation and compatibility with standard power sources.

Terminal Pitch:

0.5 mm - The small terminal pitch allows for high-density packaging and efficient connectivity in compact designs.

Moisture Sensitivity Level (MSL):

3 - The MSL 3 rating indicates that the product is suitable for reflow soldering processes, ensuring reliability during assembly.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC1310F64RGZT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

28672

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CC1310F64RGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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