Loading...

MCIMX6QP5EYM1AA

NXP Semiconductors

MCIMX6QP5EYM1AA by NXP Semiconductors

MCIMX6QP5EYM1AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 624 terminals. It operates b/w -20°C to 105°C, with supply voltage ranging from 1.35V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.

Median Price

$99.725

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 108 parts In-Stock

1+ parts

$108.310

100+ parts

$87.810

1k+ parts

-

10k+ parts

-

108

$108.310

$87.810

-

-

DigiKey

USA . 130 parts In-Stock

1+ parts

$122.730

100+ parts

$94.721

1k+ parts

-

10k+ parts

-

130

$122.730

$94.721

-

-

Avnet

USA . 240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

240

-

-

-

-

Rochester

USA . 147 parts In-Stock

1+ parts

-

100+ parts

$79.780

1k+ parts

$71.380

10k+ parts

$67.180

147

-

$79.780

$71.380

$67.180

Verical

USA . 147 parts In-Stock

1+ parts

-

100+ parts

$99.725

1k+ parts

-

10k+ parts

-

147

-

$99.725

-

-

Newark

USA . 68 parts In-Stock

1+ parts

-

100+ parts

$73.510

1k+ parts

-

10k+ parts

-

68

-

$73.510

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,096 parts In-Stock

1+ parts

$70.176

100+ parts

-

1k+ parts

-

10k+ parts

-

3,096

$70.176

-

-

-

Vyrian

USA . 3,362 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,362

-

-

-

-

Anansix

USA . 2,637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,637

-

-

-

-

Sensible Micro Corp

USA . 142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

142

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

TME

Poland . 40 parts In-Stock

1+ parts

-

100+ parts

$107.010

1k+ parts

-

10k+ parts

-

40

-

$107.010

-

-

Martec Srl

Italy . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Cyclops Electronics Ltd

UK . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 409 parts In-Stock

1+ parts

$8.832

100+ parts

-

1k+ parts

-

10k+ parts

-

409

$8.832

-

-

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$16.288

100+ parts

$15.474

1k+ parts

$15.474

10k+ parts

-

2,000

$16.288

$15.474

$15.474

-

Ampacity Inc.

Singapore . 124 parts In-Stock

1+ parts

$62.790

100+ parts

-

1k+ parts

-

10k+ parts

-

124

$62.790

-

-

-

Semicontronic

India . 124 parts In-Stock

1+ parts

$62.790

100+ parts

$61.220

1k+ parts

$60.906

10k+ parts

-

124

$62.790

$61.220

$60.906

-

Aztec Data Supply Inc.

USA . 10,397 parts In-Stock

1+ parts

$63.370

100+ parts

-

1k+ parts

-

10k+ parts

-

10,397

$63.370

-

-

-

Corphita

USA . 2,935 parts In-Stock

1+ parts

$66.483

100+ parts

-

1k+ parts

-

10k+ parts

-

2,935

$66.483

-

-

-

Corohmni

South Africa . 93 parts In-Stock

1+ parts

$72.837

100+ parts

-

1k+ parts

-

10k+ parts

-

93

$72.837

-

-

-

Microchip USA

USA . 1,720 parts In-Stock

1+ parts

$160.260

100+ parts

$157.470

1k+ parts

$156.080

10k+ parts

$154.690

1,720

$160.260

$157.470

$156.080

$154.690

Lixinc

USA . 8,215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,215

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,052 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,052

-

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Argo Parts USA

USA . 2,686 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,686

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

UNI Independent Distributors

Spain . 789 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

789

-

-

-

-

Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Perfect Parts

USA . 269 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

269

-

-

-

-

Continental Prestige Electronics

USA . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12

-

-

-

-

Speed Components Ltd (Excess)

Israel . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Overview

Discover endless possibilities with the MCIMX6QP5EYM1AA by NXP Semiconductors. This cutting-edge product from a trusted manufacturer offers unparalleled quality and reliability in the realm of Other Function uPs, uCs & Peripheral ICs. With its advanced technology and innovative design, this versatile component caters to a wide range of applications. From enhancing performance to optimizing efficiency, the MCIMX6QP5EYM1AA delivers exceptional value and benefits to customers looking to take their projects to the next level. Experience the advantages of this top-of-the-line solution and unlock new opportunities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for portable devices.

Surface Mount: YES

This product is easy to install and saves space on a PCB, making it ideal for compact designs.

Maximum Supply Voltage: 1.5 V

Operates efficiently with a maximum supply voltage of 1.5V, ensuring compatibility with various power sources.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy integration into designs.

No. of Terminals: 624

With a high number of terminals, this product offers extensive connectivity options for complex circuits.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style provides improved signal integrity and reliability.

Minimum Supply Voltage: 1.35 V

Functions reliably with a low minimum supply voltage of 1.35V, suitable for low-power applications.

Maximum Operating Temperature: 105 °C

With a high operating temperature of 105°C, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -20 °C

Suitable for use in cold environments with a minimum operating temperature of -20°C.

Terminal Finish: TIN SILVER COPPER

The tin silver copper terminal finish enhances conductivity and prevents oxidation, ensuring long-term performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and enhances thermal management.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a slim profile and easy integration into space-constrained designs.

Width: 21 mm

The compact width of 21mm saves valuable board space and allows for efficient placement of components.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures for up to 40 seconds, enabling easy soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable solder joints and component attachment.

Length: 21 mm

The short length of 21mm saves space on the PCB and allows for more flexibility in design layouts.

Peripheral IC Type: SoC

The System-on-Chip (SoC) design integrates multiple functions into a single chip, reducing system complexity and cost.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, ideal for energy-efficient applications.

Terminal Form: BALL

The ball terminal form provides a reliable connection and allows for easy rework and replacement if needed.

Nominal Supply Voltage: 1.4 V

The nominal supply voltage of 1.4V ensures stable operation and compatibility with a wide range of systems.

Terminal Pitch: 0.8 mm

The tight terminal pitch of 0.8mm enables high-density packaging and enhanced performance in space-constrained applications.

Moisture Sensitivity Level (MSL): 3

The MSL of 3 indicates moderate sensitivity to moisture, requiring proper handling during storage and assembly.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6QP5EYM1AA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6QP5EYM1AA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20