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MCIMX6S5DVM10AC

NXP Semiconductors

MCIMX6S5DVM10AC by NXP Semiconductors

MCIMX6S5DVM10AC by NXP Semiconductors is a SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage range of 1.35-1.5V. With 624 terminals in a low profile grid array package, it's ideal for applications requiring high performance and compact design.

Median Price

$28.680

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

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Arrow

USA . 324 parts In-Stock

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$19.115

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Verical

USA . 324 parts In-Stock

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Chip1Stop

Japan . 608 parts In-Stock

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Mouser Electronics

USA . 511 parts In-Stock

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$39.590

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$27.250

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Distrelec

Netherlands . 59 parts In-Stock

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$38.267

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$34.998

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DigiKey

USA . 252 parts In-Stock

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$47.480

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$34.347

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Rochester

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$25.660

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$24.150

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Distributors (In-Stock)

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Digiode

USA . 3,873 parts In-Stock

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Nova Conductors

Japan . 38 parts In-Stock

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Flip Electronics

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Component Sense

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Chip Stock

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Anansix

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Vyrian

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Sensible Micro Corp

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Cyclops Electronics Ltd

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ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

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Goldney Electronics S.L.

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Ampacity Inc.

Singapore . 2,086 parts In-Stock

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$18.700

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Semicontronic

India . 290 parts In-Stock

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$18.232

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$18.139

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Corphita

USA . 2,000 parts In-Stock

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$19.800

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$23.322

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$23.089

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$22.156

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Aranea Global

USA . 1,000 parts In-Stock

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$31.483

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$30.224

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Continental Prestige Electronics

USA . 2,054 parts In-Stock

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$32.125

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Aztec Data Supply Inc.

USA . 4,684 parts In-Stock

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$62.025

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Corohmni

South Africa . 253 parts In-Stock

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Modulus Dynamics

Lithuania . 3,256 parts In-Stock

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Microchip USA

USA . 1,377 parts In-Stock

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$102.470

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$100.680

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$99.790

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$98.900

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$98.900

iodParts Technologies Inc.

India . 68,302 parts In-Stock

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Lixinc

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Futuretech Components

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Argo Parts USA

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Perfect Parts

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GreenTree Electronics

Israel . 500 parts In-Stock

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Speed Components Ltd (Excess)

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Overview

Discover the cutting-edge MCIMX6S5DVM10AC by NXP Semiconductors, a top-tier manufacturer known for their superior quality products. This innovative device falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications. With a maximum supply voltage of 1.5V and a minimum operating temperature of 0°C, this product ensures reliability and efficiency in various settings. Experience seamless performance and exceptional value with the MCIMX6S5DVM10AC, designed to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability to the product, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving design, making it convenient for compact electronic devices.

Maximum Supply Voltage: 1.5 V

With a maximum supply voltage of 1.5V, this product is energy-efficient and suitable for low power applications.

Package Shape: SQUARE

Square package shape provides uniformity and ease of handling during assembly and maintenance.

No. of Terminals: 624

The high number of terminals allows for a wide range of connectivity options, enhancing the functionality of the product.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style offers a compact design and efficient signal transmission, making it ideal for space-constrained applications.

Minimum Supply Voltage: 1.35 V

With a minimum supply voltage of 1.35V, this product ensures reliable operation even in low voltage conditions.

Maximum Operating Temperature: 95 °C

High maximum operating temperature of 95°C ensures stable performance even in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C ensures the product can operate in a wide range of temperature environments.

Terminal Finish: TIN SILVER COPPER

Terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, enhancing the product's longevity.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and soldering, simplifying the assembly process.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm allows for a slim profile, ideal for compact electronic devices.

Width: 21 mm

Width of 21mm provides a balanced form factor for the product, ensuring compatibility with standard electronic components.

Maximum Time At Peak Reflow Temperature (s): 40

Maximum time at peak reflow temperature of 40 seconds ensures efficient soldering during the assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C enables reliable solder joints, ensuring product integrity during manufacturing and use.

Length: 21 mm

Length of 21mm provides a compact footprint for the product, suitable for space-constrained applications.

Peripheral IC Type: SoC

System-on-Chip (SoC) peripheral IC type integrates multiple functions into a single chip, reducing component count and enhancing overall system efficiency.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and easy reworkability, ensuring hassle-free maintenance and repair.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm enables high-density packaging and efficient signal transmission, improving overall product performance.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level (MSL) of 3 indicates the product can withstand moderate exposure to moisture during storage and assembly, enhancing reliability in varying environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6S5DVM10AC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6S5DVM10AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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