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MCIMX6X4CVM08AB

NXP Semiconductors

MCIMX6X4CVM08AB by NXP Semiconductors

MCIMX6X4CVM08AB by NXP Semiconductors is a 529-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for industrial applications, it features a low-profile grid array package with fine pitch terminals for surface mounting.

Median Price

$39.570

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

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Arrow

USA . 250 parts In-Stock

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$30.930

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Chip1Stop

Japan . 336 parts In-Stock

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$39.570

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DigiKey

USA . 113 parts In-Stock

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$46.730

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$34.465

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$34.465

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Mouser Electronics

USA . 149 parts In-Stock

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$51.890

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$37.380

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Verical

USA . 4,032 parts In-Stock

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Avnet

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EBV Elektronik

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Nova Conductors

Japan . 48 parts In-Stock

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$34.560

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Digiode

USA . 3,547 parts In-Stock

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$36.850

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Chip Stock

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TME

Poland . 4,064 parts In-Stock

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Anansix

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GLYN GmbH & Co. KG

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DigiKey Marketplace

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Vyrian

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J2 Sourcing AB

Sweden . 5 parts In-Stock

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Mil-Aero Solutions, Inc.

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Prism Electronics

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Aztec Data Supply Inc.

USA . 1,394 parts In-Stock

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$22.569

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Semicontronic

India . 264 parts In-Stock

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$22.790

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$22.220

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$22.106

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$22.790

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$22.106

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Ampacity Inc.

Singapore . 20 parts In-Stock

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$22.790

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Continental Prestige Electronics

USA . 1,744 parts In-Stock

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$33.476

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$32.806

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Netroflash

USA . 1,000 parts In-Stock

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$34.560

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Corphita

USA . 4,435 parts In-Stock

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Corohmni

South Africa . 358 parts In-Stock

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Microchip USA

USA . 2,843 parts In-Stock

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iodParts Technologies Inc.

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Lixinc

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A-Z Elektronik GmbH

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Epart123

USA . 2,100 parts In-Stock

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$41.200

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UNI Independent Distributors

Spain . 1,426 parts In-Stock

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Argo Parts USA

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Formix International (Excess)

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Perfect Parts

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Overview

Discover the cutting-edge MCIMX6X4CVM08AB by NXP Semiconductors, a top-tier manufacturer known for delivering superior quality semiconductor solutions. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering unmatched reliability and performance. With a wide range of applications, this innovative device provides customers with exceptional value, benefits, and advantages, making it the ideal choice for all your electronic needs. Experience the next level of technology with NXP Semiconductors' MCIMX6X4CVM08AB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight, durable, and cost-effective, making it a good choice for this product.

Surface Mount: YES

Surface mount technology allows for compact and efficient circuit board design, enhancing the overall performance and reliability of the product.

Maximum Supply Voltage: 1.5 V

Operates within a safe voltage range, ensuring stable and reliable performance.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board.

No. of Terminals: 529

Large number of terminals provide ample connectivity options for various electronic components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style enhances signal integrity and thermal performance of the product.

Minimum Supply Voltage: 1.275 V

Low minimum supply voltage ensures energy efficiency and longer battery life for portable electronic devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature range allows for reliable performance in harsh industrial environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures the product can be used in extreme cold conditions without any issues.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position allows for easy integration with other components on the circuit board.

Maximum Seated Height: 1.52 mm

Low seated height enables a slim and compact design for the product.

Width: 19 mm

Optimal width dimension for fitting into standard electronic enclosures and devices.

Maximum Time At Peak Reflow Temperature (s): 40

Short time at peak reflow temperature ensures proper soldering without damaging sensitive components.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for secure and reliable solder joints during manufacturing.

Length: 19 mm

Optimal length dimension for fitting into standard electronic enclosures and devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product can withstand demanding operating conditions in industrial applications.

Peripheral IC Type: SoC

System-on-Chip (SoC) integration provides high performance and functionality in a compact package, ideal for various applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of electronic devices.

Terminal Form: BALL

Ball terminal form allows for efficient soldering and reliable connection to the circuit board.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density mounting and compact design of the product.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level 3 indicates the product is sensitive to moisture but with proper handling and storage, it can be used effectively in various environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6X4CVM08AB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

529

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.52 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6X4CVM08AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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