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MCIMX6G1CVM05AB

NXP Semiconductors

MCIMX6G1CVM05AB by NXP Semiconductors

MCIMX6G1CVM05AB by NXP Semiconductors is a System on Chip with 289 terminals, operating at -40 to 105°C. It features a low profile grid array package style, 0.8mm terminal pitch, and industrial temperature grade. Ideal for applications requiring high performance in compact designs.

Median Price

$18.298

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 340 parts In-Stock

1+ parts

$18.298

100+ parts

$12.186

1k+ parts

$11.498

10k+ parts

-

340

$18.298

$12.186

$11.498

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DigiKey

USA . 771 parts In-Stock

1+ parts

$18.500

100+ parts

$13.754

1k+ parts

$11.842

10k+ parts

-

771

$18.500

$13.754

$11.842

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Mouser Electronics

USA . 279 parts In-Stock

1+ parts

$18.500

100+ parts

$12.470

1k+ parts

$11.850

10k+ parts

-

279

$18.500

$12.470

$11.850

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EBV Elektronik

Germany . 13,984 parts In-Stock

1+ parts

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13,984

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Verical

USA . 717 parts In-Stock

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$12.034

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717

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$12.034

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Rochester

USA . 218 parts In-Stock

1+ parts

-

100+ parts

$10.270

1k+ parts

$9.190

10k+ parts

$8.650

218

-

$10.270

$9.190

$8.650

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 338 parts In-Stock

1+ parts

$10.840

100+ parts

-

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338

$10.840

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-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$14.641

100+ parts

-

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100

$14.641

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-

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South Electronics

USA . 8,690 parts In-Stock

1+ parts

-

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8,690

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-

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TME

Poland . 869 parts In-Stock

1+ parts

-

100+ parts

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$14.500

10k+ parts

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869

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-

$14.500

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Flip Electronics

USA . 650 parts In-Stock

1+ parts

-

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650

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Cyclops Electronics Ltd

UK . 608 parts In-Stock

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608

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Anansix

USA . 125 parts In-Stock

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125

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Vyrian

USA . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,492 parts In-Stock

1+ parts

$9.700

100+ parts

$9.458

1k+ parts

$9.409

10k+ parts

-

2,492

$9.700

$9.458

$9.409

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Ampacity Inc.

Singapore . 497 parts In-Stock

1+ parts

$9.700

100+ parts

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497

$9.700

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Corphita

USA . 3,247 parts In-Stock

1+ parts

$10.269

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3,247

$10.269

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Continental Prestige Electronics

USA . 6,747 parts In-Stock

1+ parts

$14.641

100+ parts

-

1k+ parts

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10k+ parts

$14.348

6,747

$14.641

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-

$14.348

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$14.641

100+ parts

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2,000

$14.641

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Corohmni

South Africa . 2,221 parts In-Stock

1+ parts

$32.534

100+ parts

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2,221

$32.534

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Aztec Data Supply Inc.

USA . 547 parts In-Stock

1+ parts

$39.080

100+ parts

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547

$39.080

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Microchip USA

USA . 2,219 parts In-Stock

1+ parts

$47.909

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2,219

$47.909

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$69.450

100+ parts

$65.977

1k+ parts

$65.977

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2,500

$69.450

$65.977

$65.977

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iodParts Technologies Inc.

India . 21,424 parts In-Stock

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21,424

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Lixinc

USA . 16,730 parts In-Stock

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16,730

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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Argo Parts USA

USA . 4,698 parts In-Stock

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4,698

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UNI Independent Distributors

Spain . 2,280 parts In-Stock

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2,280

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Futuretech Components

Singapore . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 1,021 parts In-Stock

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1,021

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Overview

Discover the innovative MCIMX6G1CVM05AB by NXP Semiconductors, a cutting-edge System on Chip solution that promises unparalleled performance and reliability. This high-quality product is designed with advanced CMOS technology, making it ideal for a wide range of applications in the industrial sector. With its compact grid array package and low profile design, this chip offers enhanced functionality while maximizing space efficiency. Trust NXP Semiconductors to deliver top-notch solutions that exceed expectations and provide customers with exceptional value and benefits. Elevate your projects with the MCIMX6G1CVM05AB - the ultimate choice for superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for portable and rugged applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and resources during production.

Maximum Supply Voltage: 1.3 V

Provides a sufficient power supply for the product to function effectively without risking damage from overvoltage.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB, optimizing the overall design layout.

No. of Terminals: 289

Having a high number of terminals allows for connectivity to various other components, expanding the product's functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density integration and low profile, suitable for compact electronic devices.

Minimum Supply Voltage: 1.15 V

Even with a low supply voltage, the product can still operate efficiently, potentially saving power consumption.

Maximum Operating Temperature: 105 °C

Capable of withstanding high temperatures, making the product suitable for industrial environments where heat levels can rise.

Minimum Operating Temperature: -40 °C

Ability to function in sub-zero temperatures, ensuring reliability in cold environments.

Terminal Finish: TIN SILVER COPPER

This finish provides good electrical conductivity and corrosion resistance, enhancing the overall durability of the product.

Terminal Position: BOTTOM

Bottom terminal positioning aids in PCB layout and allows for easy accessibility during assembly and maintenance.

Maximum Seated Height: 1.32 mm

Low profile design allows for compact integration, making the product suitable for space-constrained applications.

Width: 14 mm

Compact width dimension enables the product to fit into small spaces and helps in optimizing PCB layout.

Maximum Time At Peak Reflow Temperature (s): 40

Sufficient time at peak reflow temperature ensures proper soldering and reliability during manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and secure connections for robust performance.

Length: 14 mm

Compact length makes the product suitable for applications where space is limited, ensuring efficient use of resources.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: SYSTEM ON CHIP

Integration of various functions into a single chip streamlines the design process and reduces component count, making the product cost-effective.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, contributing to energy efficiency and overall product effectiveness.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and ensures secure connections, enhancing the product's overall reliability.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting and optimal use of PCB space, making the product suitable for compact designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the product can withstand moderate exposure to moisture during storage and handling, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6G1CVM05AB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.32 mm

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX6G1CVM05AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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