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XCZU25DR-2FFVE1156I

Xilinx

XCZU25DR-2FFVE1156I by Xilinx

XCZU25DR-2FFVE1156I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This IC has 1156 terminals in a GRID ARRAY package, suitable for industrial applications requiring high performance and reliability.

Median Price

$14,450.000

Lifecycle Status

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VNN

France . 760 parts In-Stock

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DF Sales Co.

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Vyrian

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One Stop Electronics

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AZTECH Wire

Italy . 393 parts In-Stock

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MARBEL Systems

Belgium . 645 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Semicontronic

India . 593 parts In-Stock

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Ampacity Inc.

Singapore . 523 parts In-Stock

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Qasali Group International

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Argo Parts USA

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Bastille Electronics

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Overview

Unlock unlimited possibilities with the XCZU25DR-2FFVE1156I by Xilinx, a leading manufacturer known for top-quality products. This innovative Programmable SoC is perfect for a wide range of applications within the Other Function uPs,uCs & Peripheral ICs category. With its industrial-grade temperature rating and advanced CMOS technology, this product offers unparalleled value and flexibility. Experience enhanced performance and efficiency with the XCZU25DR-2FFVE1156I, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight, durable, and cost-effective, making the product easy to handle and less prone to damage during transportation and installation.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing production time and costs.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage tolerance of 0.876 V provides flexibility and reliability in various operating conditions.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the PCB, maximizing component density and system performance.

No. of Terminals: 1156

The large number of terminals allows for versatile connectivity options and integration with other components, increasing functionality and compatibility.

Package Style (Meter): GRID ARRAY

Grid array package style offers better electrical performance and thermal management, ensuring stable operation and longevity of the product.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40°C enables the product to function reliably in extreme environments or industrial settings.

Peripheral IC Type: PROGRAMMABLE SoC

A programmable System-on-Chip (SoC) design allows for customization, flexibility, and scalability, making the product suitable for a wide range of applications and future upgrades.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption, high speed, and compatibility with a variety of electronic systems, enhancing efficiency and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU25DR-2FFVE1156I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU25DR-2FFVE1156I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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