Loading...

VS3674UNION

Texas Instruments

VS3674UNION by Texas Instruments

VS3674UNION by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 338 terminals in a GRID ARRAY package style, suitable for applications requiring low profile and fine pitch components. With a supply voltage range of 1.28V to 1.42V and operating temperature from 0°C to 85°C, it offers versatility in various electronic designs.

Median Price

$33.624

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$33.624

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$33.624

-

-

-

Vyrian

USA . 4,734 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,734

-

-

-

-

Digiode

USA . 913 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

913

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 841 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

841

$3.000

-

-

-

One Stop Electronics

USA . 719 parts In-Stock

1+ parts

$4.000

100+ parts

-

1k+ parts

-

10k+ parts

-

719

$4.000

-

-

-

AZTECH Wire

Italy . 463 parts In-Stock

1+ parts

$8.791

100+ parts

-

1k+ parts

-

10k+ parts

-

463

$8.791

-

-

-

Semicontronic

India . 407 parts In-Stock

1+ parts

$10.000

100+ parts

$9.750

1k+ parts

$9.700

10k+ parts

-

407

$10.000

$9.750

$9.700

-

Parana Technologies

USA . 1,402 parts In-Stock

1+ parts

$17.007

100+ parts

-

1k+ parts

$17.231

10k+ parts

-

1,402

$17.007

-

$17.231

-

Corohmni

South Africa . 5,049 parts In-Stock

1+ parts

$17.724

100+ parts

-

1k+ parts

-

10k+ parts

-

5,049

$17.724

-

-

-

DigiPath Technology Company

USA . 2,301 parts In-Stock

1+ parts

$18.727

100+ parts

-

1k+ parts

-

10k+ parts

-

2,301

$18.727

-

-

-

ChromeModa Solutions

Germany . 3,222 parts In-Stock

1+ parts

$19.109

100+ parts

$15.669

1k+ parts

-

10k+ parts

-

3,222

$19.109

$15.669

-

-

IDEA Electronic Components Group

UK . 1,299 parts In-Stock

1+ parts

$19.109

100+ parts

$18.154

1k+ parts

$17.198

10k+ parts

-

1,299

$19.109

$18.154

$17.198

-

Continental Prestige Electronics

USA . 42 parts In-Stock

1+ parts

$33.624

100+ parts

-

1k+ parts

-

10k+ parts

$32.951

42

$33.624

-

-

$32.951

Corphita

USA . 4,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,305

-

-

-

-

Argo Parts USA

USA . 1,974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,974

-

-

-

-

Overview

Discover the cutting-edge technology of the VS3674UNION by Texas Instruments, a high-quality microprocessor circuit designed for a wide range of applications. With a sleek square package and 338 terminals, this versatile IC offers reliability and performance like no other. From smart devices to automotive systems, this innovative product provides value and efficiency to customers looking for top-notch solutions. Trust Texas Instruments for superior quality and unmatched advantages in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a variety of applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on the PCB, enhancing the overall design efficiency.

Maximum Supply Voltage: 1.42 V

The high maximum supply voltage ensures stable and reliable operation of the product under different voltage conditions.

Package Shape: SQUARE

The square package shape provides a compact and uniform design, optimizing space utilization on the PCB.

No. of Terminals: 338

Having a high number of terminals allows for multiple connections and functionalities, making the product versatile for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with low profile and fine pitch offers improved signal integrity and thermal performance, enhancing overall product reliability.

Minimum Supply Voltage: 1.28 V

The low minimum supply voltage ensures efficient power consumption and extends the product's operating life.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the product to withstand harsh environmental conditions and ensures reliable performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in various temperature environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring long-term performance and reliability.

Terminal Position: BOTTOM

The bottom terminal position allows for easy soldering and connection to the PCB, streamlining the assembly process.

Maximum Seated Height: 1.3 mm

The low seated height of the package saves space on the PCB and enables a more compact overall design.

Width: 13 mm

The compact width of the product enables efficient space utilization on the PCB, especially in applications with size constraints.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly of the product, reducing the risk of thermal damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures reliable soldering and assembly, suitable for lead-free soldering processes.

Length: 13 mm

The compact length of the product allows for space-saving on the PCB and enables a more efficient layout design.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit type, the product offers advanced processing capabilities and versatility, suitable for complex applications and functionalities.

Technology: CMOS

The CMOS technology utilized in the product ensures low power consumption and high-speed operation, making it energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and solder joints, ensuring stable performance and durability of the product.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage of 1.35 V provides a stable operating voltage for the product, ensuring consistent and reliable performance.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for compact packaging and efficient routing of connections, enhancing the product's design flexibility.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product has moderate sensitivity to moisture, making it suitable for a wide range of storage and operating conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs VS3674UNION attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

VS3674UNION Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 2