Loading...

VS3673UNION

Texas Instruments

VS3673UNION by Texas Instruments

VS3673UNION by Texas Instruments is a 338-terminal microprocessor circuit with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 1.28-1.42V. Suitable for I2C, SPI, UART, and USB bus compatibility applications due to its low profile grid array package style.

Median Price

$20.600

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$20.600

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$20.600

-

-

-

Vyrian

USA . 1,219 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,219

-

-

-

-

Digiode

USA . 1,159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,159

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 520 parts In-Stock

1+ parts

$16.629

100+ parts

-

1k+ parts

-

10k+ parts

-

520

$16.629

-

-

-

One Stop Electronics

USA . 771 parts In-Stock

1+ parts

$20.000

100+ parts

-

1k+ parts

-

10k+ parts

-

771

$20.000

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$20.600

100+ parts

-

1k+ parts

$19.570

10k+ parts

$19.158

100

$20.600

-

$19.570

$19.158

Ampacity Inc.

Singapore . 607 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

-

607

$28.000

-

-

-

Corohmni

South Africa . 2,457 parts In-Stock

1+ parts

$31.307

100+ parts

-

1k+ parts

-

10k+ parts

-

2,457

$31.307

-

-

-

Microchip USA

USA . 2,181 parts In-Stock

1+ parts

$47.381

100+ parts

-

1k+ parts

-

10k+ parts

-

2,181

$47.381

-

-

-

Parana Technologies

USA . 993 parts In-Stock

1+ parts

$50.753

100+ parts

-

1k+ parts

-

10k+ parts

-

993

$50.753

-

-

-

ChromeModa Solutions

Germany . 3,771 parts In-Stock

1+ parts

$57.026

100+ parts

$46.761

1k+ parts

-

10k+ parts

-

3,771

$57.026

$46.761

-

-

IDEA Electronic Components Group

UK . 178 parts In-Stock

1+ parts

$57.026

100+ parts

$54.175

1k+ parts

$51.323

10k+ parts

-

178

$57.026

$54.175

$51.323

-

Corphita

USA . 1,808 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,808

-

-

-

-

DigiPath Technology Company

USA . 379 parts In-Stock

1+ parts

-

100+ parts

$51.415

1k+ parts

-

10k+ parts

-

379

-

$51.415

-

-

Overview

Experience the next level of performance with the VS3673UNION by Texas Instruments. Manufactured by a trusted leader in the industry, this cutting-edge product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering endless possibilities for applications. With a maximum supply voltage of 1.42 V and a minimum supply voltage of 1.28 V, this versatile device is designed to deliver exceptional quality and reliability. From its advanced technology to its innovative features, the VS3673UNION provides unmatched value and benefits to customers looking to elevate their projects to new heights. Embrace superior functionality and efficiency with this game-changing solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing production time.

Maximum Supply Voltage: 1.42 V

Ability to handle higher supply voltage ensures stable operation and flexibility in power requirements.

Package Shape: SQUARE

Square package shape simplifies layout design and offers efficient use of space on the PCB.

No. of Terminals: 338

High number of terminals enable connectivity with various external components, enhancing the versatility of the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design allows for high density integration and improved thermal performance.

Minimum Supply Voltage: 1.28 V

Low minimum supply voltage requirement ensures efficient power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures enables usage in refrigerated or outdoor settings without performance degradation.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates ease of soldering and PCB assembly, simplifying the manufacturing process.

Maximum Seated Height: 1.3 mm

Low seated height allows for compact design and space-saving in electronic devices.

Width: 13 mm

Narrow width dimension enables fitting into compact spaces or densely populated PCB layouts.

External Data Bus Width: 32

Wider external data bus width increases data processing speed and efficiency, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures efficient soldering process and reduces the risk of thermal stress on components.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables reliable solder joints and robust mechanical connection during assembly.

Length: 13 mm

Compact length dimension allows for versatile placement on the PCB and efficient use of space.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit enhances the product's processing capabilities for advanced functionality and complex tasks.

Technology: CMOS

CMOS technology offers low power consumption, high speed operation, and compatibility with a wide range of digital systems.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and simplifies the soldering process during assembly.

Nominal Supply Voltage: 1.35 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the product.

Bus Compatibility: I2C; SPI; UART; USB

Compatibility with multiple communication protocols enhances connectivity options and interoperability with various devices.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density packaging and close integration of the product with other components on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product is suitable for surface mount assembly with standard reflow profiles, ensuring quality and reliability in manufacturing.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs VS3673UNION attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

VS3673UNION Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 2