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ATWINC1500-MR210PB1140

Microchip Technology

ATWINC1500-MR210PB1140 by Microchip Technology

ATWINC1500-MR210PB1140 by Microchip operates at 3-4.2V, with temp range -40 to 85°C. It's a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in compact spaces.

Median Price

$7.370

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$7.370

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100

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Vyrian

USA . 7,034 parts In-Stock

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VNN

France . 3,392 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 350 parts In-Stock

1+ parts

$6.000

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350

$6.000

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Continental Prestige Electronics

USA . 1,416 parts In-Stock

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$7.370

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$7.223

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$7.223

Corohmni

South Africa . 3,151 parts In-Stock

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$7.370

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AZTECH Wire

Italy . 191 parts In-Stock

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$11.387

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191

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Semicontronic

India . 823 parts In-Stock

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$28.000

100+ parts

$27.300

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$27.160

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823

$28.000

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$27.160

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Aztec Data Supply Inc.

USA . 4,193 parts In-Stock

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$76.962

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West Coast Incorporated

USA . 2,984 parts In-Stock

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Perfect Parts

USA . 1,803 parts In-Stock

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Argo Parts USA

USA . 1,744 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Experience unparalleled connectivity with the ATWINC1500-MR210PB1140 by Microchip Technology. As a leading manufacturer in the industry, Microchip ensures top-notch quality and reliability in all their products. This versatile IC falls under the category of Other Function uPs,uCs & Peripheral ICs, making it a must-have for various applications. From its compact surface mount design to its wide operating temperature range, this product offers unmatched value and benefits to customers. Stay ahead of the curve with the ATWINC1500-MR210PB1140 and elevate your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing costs.

Maximum Supply Voltage: 4.2 V

Having a high maximum supply voltage adds versatility to the product and allows it to be used in a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape makes it easier to design and fit the product onto circuit boards efficiently.

No. of Terminals: 28

Having a higher number of terminals provides more connectivity options and functionality for the product.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and operation in various voltage conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to work in extreme cold conditions, making it versatile for different environments.

Maximum Seated Height: 2.113 mm

The low seated height enables the product to be compact and fit into tight spaces without compromising performance.

Width: 14.73 mm

The moderate width provides a balance between space-saving design and efficient functionality for the product.

Length: 21.72 mm

The optimal length of the product offers a good balance between compactness and functionality for easy integration into the circuit design.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures reliable performance in demanding industrial environments where temperature fluctuations are common.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The product's microprocessor circuit type provides advanced processing capabilities, making it suitable for applications requiring high computational power.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high integration capabilities, making the product efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and offers improved reliability compared to traditional leaded packages.

Nominal Supply Voltage: 3.6 V

The nominal supply voltage provides a stable and efficient power source for the product's operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ATWINC1500-MR210PB1140 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Additional Features:

SEATED HGT-NOM

JESD-30 Code:

R-XXMA-N28

Length:

21.72 mm

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.113 mm

Maximum Supply Voltage:

4.2 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14.73 mm

Peripheral IC Type:

Trade Compliance

ATWINC1500-MR210PB1140 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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