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ATWINC1500-MR210PB1976

Microchip Technology

ATWINC1500-MR210PB1976 by Microchip Technology

ATWINC1500-MR210PB1976 by Microchip operates at 3-4.2V, with -40 to 85°C temp range. It is a CMOS microprocessor circuit with 28 terminals for IoT applications. This surface-mount IC measures 21.72x14.73mm and is ideal for compact electronic devices.

Median Price

$8.050

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 211 parts In-Stock

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$8.050

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DigiKey

USA . 91 parts In-Stock

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$8.050

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$7.540

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Verical

USA . 72 parts In-Stock

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$7.838

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72

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$7.838

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Nova Conductors

Japan . 82 parts In-Stock

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$10.014

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Vyrian

USA . 7,353 parts In-Stock

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VNN

France . 4,126 parts In-Stock

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Semicontronic

India . 307 parts In-Stock

1+ parts

$6.840

100+ parts

$6.669

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$6.635

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307

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$6.669

$6.635

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Ampacity Inc.

Singapore . 283 parts In-Stock

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$7.020

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Continental Prestige Electronics

USA . 3,711 parts In-Stock

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$10.014

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$9.813

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Netroflash

USA . 2,000 parts In-Stock

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$10.014

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$9.813

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AZTECH Wire

Italy . 422 parts In-Stock

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$13.428

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Corohmni

South Africa . 411 parts In-Stock

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$22.260

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Aztec Data Supply Inc.

USA . 2,603 parts In-Stock

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LOOK Integrated Logistics

Peru . 6,819 parts In-Stock

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Montano Global Distributors

Canada . 6,339 parts In-Stock

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NIA Electronics

USA . 5,024 parts In-Stock

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LMD Electronica

Estonia . 4,697 parts In-Stock

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Ledger Components

France . 4,000 parts In-Stock

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Argo Parts USA

USA . 1,148 parts In-Stock

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Overview

Elevate your electronics projects with the ATWINC1500-MR210PB1976 by Microchip Technology. Known for their superior quality and innovative technology, Microchip delivers cutting-edge solutions in the field of Other Function uPs,uCs & Peripheral ICs. This surface mount device offers a wide range of applications with its compact design and reliable performance. Whether you're a seasoned professional or a hobbyist, this product provides unmatched value and efficiency for all your project needs. Elevate your creations today with the ATWINC1500-MR210PB1976.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and efficient installation on a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 4.2 V

The high maximum supply voltage provides flexibility in power source options for the device, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular shape of the package offers compatibility with standard mounting setups, ensuring seamless integration into existing systems.

No. of Terminals: 28

With a large number of terminals, this product supports complex circuit designs, enabling the creation of advanced electronic systems.

Package Style: MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style ensures a compact and space-efficient design, ideal for applications with limited real estate.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement enhances energy efficiency, contributing to a lower power consumption of the overall system.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliability under extreme conditions, making this product suitable for harsh environments.

Minimum Operating Temperature: -40 °C

The wide temperature range support enables operation in both hot and cold climates, allowing for use in a diverse range of settings.

Maximum Seated Height: 2.113 mm

The low maximum seated height profile facilitates a sleek and slim device profile, suitable for applications where space is a premium.

Width: 14.73 mm

The moderate width dimension offers a good balance between compactness and ease of handling during installation and maintenance.

Length: 21.72 mm

The length dimension provides ample space for the various components and circuitry, allowing for a comprehensive feature set within the same package.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The incorporation of a microprocessor circuit as a peripheral IC type adds advanced computational capabilities to the product, enhancing its functionality.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity, contributing to the efficiency and reliability of the product.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process by eliminating the need for soldering, reducing the risk of assembly errors and enhancing reliability.

Nominal Supply Voltage: 3.3 V

The stable nominal supply voltage requirement offers compatibility with standard power sources, ensuring consistent performance across different setups.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ATWINC1500-MR210PB1976 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XXMA-N28

Length:

21.72 mm

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

2.113 mm

Maximum Supply Voltage:

4.2 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UNSPECIFIED

Width:

14.73 mm

Peripheral IC Type:

Trade Compliance

ATWINC1500-MR210PB1976 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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