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XCZU4EV-1FBVB900I

Xilinx

XCZU4EV-1FBVB900I by Xilinx

XCZU4EV-1FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Suitable for industrial applications, it requires a supply voltage of 0.825V to 0.876V.

Median Price

$2,145.565

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Farnell

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Newark

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Mouser Electronics

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Element14

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Digiode

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Nova Conductors

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AZTECH Wire

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Modulus Dynamics

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Kenton Components

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Aztec Data Supply Inc.

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One Stop Electronics

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Netroflash

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Lucentia Tech

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Overview

Unleash the power of cutting-edge technology with the XCZU4EV-1FBVB900I by Xilinx. This innovative microprocessor circuit offers unparalleled performance and reliability, thanks to Xilinx's renowned expertise in the field. Ideal for a wide range of applications in the industrial sector, this product promises seamless integration and enhanced functionality. Experience the next level of efficiency and productivity with the XCZU4EV-1FBVB900I, where quality meets innovation to deliver exceptional value to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring longevity and reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Maximum Supply Voltage: 0.876 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into existing circuit designs and layouts.

No. of Terminals: 900

Having a large number of terminals enables this product to connect to multiple external components, expanding its functionality.

Package Style (Meter): GRID ARRAY

The grid array package style provides efficient thermal dissipation and electrical performance, ensuring optimal operation of the product.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage allows for efficient power consumption, making this product energy-efficient.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, increasing its reliability in various settings.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows this product to function in extreme cold environments, enhancing its versatility.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

This terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections and long-term performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom makes it easier to mount and connect this product to circuit boards, simplifying the assembly process.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required for peak reflow temperature ensures quick and efficient soldering during manufacturing, improving production efficiency.

Peak Reflow Temperature °C: 245

The high peak reflow temperature capability ensures secure solder joints, preventing damage or disconnection during operation.

Temperature Grade: INDUSTRIAL

Being classified as industrial-grade means this product meets high standards for reliability and performance in demanding industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this product offers advanced processing capabilities, making it suitable for complex computing tasks and applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of this product.

Terminal Form: BALL

The ball terminal form allows for precise alignment and connection, ensuring stable and secure connections in the circuit design.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage provides a standard operating level for this product, ensuring compatibility with a wide range of power sources.

Moisture Sensitivity Level (MSL): 4

With a MSL of 4, this product has moderate sensitivity to moisture, requiring appropriate handling and storage to maintain its performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4EV-1FBVB900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU4EV-1FBVB900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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