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XCZU11EG-L1FFVC1760I

Xilinx

XCZU11EG-L1FFVC1760I by Xilinx

XCZU11EG-L1FFVC1760I by Xilinx is a MICROPROCESSOR CIRCUIT with 1760 terminals in a GRID ARRAY package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. Ideal for industrial applications requiring high-performance CMOS technology.

Median Price

$15.360

Lifecycle Status

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Nova Conductors

Japan . 300 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 300 parts In-Stock

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$12.623

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One Stop Electronics

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Semicontronic

India . 530 parts In-Stock

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Ampacity Inc.

Singapore . 379 parts In-Stock

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MARBEL Systems

Belgium . 296 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 6,881 parts In-Stock

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Corohmni

South Africa . 2,920 parts In-Stock

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Aztec Data Supply Inc.

USA . 739 parts In-Stock

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Modulus Dynamics

Lithuania . 1,355 parts In-Stock

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Qasali Group International

UK . 3,339 parts In-Stock

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Argo Parts USA

USA . 3,240 parts In-Stock

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$6,993.440

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$6,923.506

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$6,853.571

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$6,783.637

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Continental Prestige Electronics

USA . 813 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$6,643.768

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Supply Digital

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Overview

Unlock the power of innovation with the XCZU11EG-L1FFVC1760I by Xilinx. As a trusted leader in the industry, Xilinx delivers cutting-edge technology that opens up endless possibilities for your projects. From advanced microprocessor circuits to high-quality materials, this product is designed to exceed expectations. Ideal for a wide range of applications, this versatile solution offers unmatched performance and reliability. Elevate your designs and experience the true value of Xilinx technology with the XCZU11EG-L1FFVC1760I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of strength and flexibility, making the product durable and resistant to damage.

Surface Mount: YES

Allows for easy installation on a PCB, saving space and reducing assembly time.

Maximum Supply Voltage: 0.742 V

Provides a safe operating range for the device, preventing damage from overvoltage.

Package Shape: RECTANGULAR

Simplifies PCB design and ensures efficient use of space.

No. of Terminals: 1760

Offers versatile connectivity options for interfacing with other components and peripherals.

Maximum Operating Temperature: 100 °C

Can withstand high temperature environments, suitable for industrial applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides good conductivity and corrosion resistance for reliable connections.

Technology: CMOS

Low power consumption and high noise immunity, enhancing overall performance efficiency.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-L1FFVC1760I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

Additional Features:

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.742 V

Minimum Supply Voltage:

.698 V

Nominal Supply Voltage:

.72 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU11EG-L1FFVC1760I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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