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MCIMX286CVM4B

NXP Semiconductors

MCIMX286CVM4B by NXP Semiconductors

MCIMX286CVM4B by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. Ideal for industrial applications requiring low profile and fine pitch grid array package style.

Median Price

$25.060

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 749 parts In-Stock

1+ parts

$26.020

100+ parts

$18.190

1k+ parts

$17.620

10k+ parts

-

749

$26.020

$18.190

$17.620

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Arrow

USA . 608 parts In-Stock

1+ parts

$28.450

100+ parts

$23.630

1k+ parts

$22.690

10k+ parts

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608

$28.450

$23.630

$22.690

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DigiKey

USA . 400 parts In-Stock

1+ parts

$31.070

100+ parts

$21.973

1k+ parts

$21.193

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400

$31.070

$21.973

$21.193

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Verical

USA . 760 parts In-Stock

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$22.139

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$22.139

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Newark

USA . 304 parts In-Stock

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$24.100

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$24.100

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Avnet

USA . 16 parts In-Stock

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$16.786

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$16.597

16

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$16.597

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$18.505

100+ parts

-

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50

$18.505

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Digiode

USA . 4,171 parts In-Stock

1+ parts

$21.784

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$21.784

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Sensible Micro Corp

USA . 3,139 parts In-Stock

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3,139

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Vyrian

USA . 1,530 parts In-Stock

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Anansix

USA . 1,294 parts In-Stock

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TME

Poland . 608 parts In-Stock

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$24.570

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608

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$24.570

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,754 parts In-Stock

1+ parts

$11.870

100+ parts

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1,754

$11.870

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Semicontronic

India . 551 parts In-Stock

1+ parts

$12.180

100+ parts

$11.876

1k+ parts

$11.815

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551

$12.180

$11.876

$11.815

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Aztec Data Supply Inc.

USA . 222 parts In-Stock

1+ parts

$15.155

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222

$15.155

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$18.500

100+ parts

$17.575

1k+ parts

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$16.465

450

$18.500

$17.575

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$16.465

Continental Prestige Electronics

USA . 5,257 parts In-Stock

1+ parts

$18.505

100+ parts

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$18.135

5,257

$18.505

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$18.135

Corphita

USA . 4,812 parts In-Stock

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$20.637

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$20.637

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Component Stockers USA

USA . 2,103 parts In-Stock

1+ parts

$24.010

100+ parts

$16.430

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$16.430

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2,103

$24.010

$16.430

$16.430

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Microchip USA

USA . 2,110 parts In-Stock

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$58.765

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$58.765

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Corohmni

South Africa . 1,882 parts In-Stock

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$59.020

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$59.020

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$78.937

100+ parts

$74.990

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$74.990

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$78.937

$74.990

$74.990

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S.R.D Solutions

India . 420,000 parts In-Stock

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Authorized Procurement Solutions

USA . 9,500 parts In-Stock

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9,500

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Robosynatics

Brazil . 3,436 parts In-Stock

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$40.710

1k+ parts

$39.879

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$39.879

3,436

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$40.710

$39.879

$39.879

Lucentia Tech

USA . 3,436 parts In-Stock

1+ parts

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$40.710

1k+ parts

$39.879

10k+ parts

$39.879

3,436

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$40.710

$39.879

$39.879

Infinite Electronics LLP (Excess)

. 3,048 parts In-Stock

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Perfect Parts

USA . 2,242 parts In-Stock

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UNI Independent Distributors

Spain . 698 parts In-Stock

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Argo Parts USA

USA . 365 parts In-Stock

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365

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Kepictronics

USA . 297 parts In-Stock

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Overview

Unlock the potential of your next project with the MCIMX286CVM4B by NXP Semiconductors. This cutting-edge System on Chip offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. With a focus on quality and innovation, NXP Semiconductors ensures that you get a product that exceeds your expectations every time. Experience the value and benefits of this versatile IC, designed to take your designs to the next level. Whether you're working on industrial automation, smart devices, or IoT solutions, this product delivers the power and efficiency you need to succeed. Elevate your projects with the MCIMX286CVM4B and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps reduce the overall weight of the product, making it a practical choice for various applications.

Surface Mount: YES

The surface-mount design allows for easy and efficient installation, saving time and effort during assembly processes.

Maximum Supply Voltage: 1.55 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing its versatility in different environments.

Package Shape: SQUARE

The square shape of the package offers an efficient use of space and allows for easier placement on circuit boards.

No. of Terminals: 289

The large number of terminals provides ample connectivity options, making this product suitable for complex electronic systems.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with precise terminal spacing, ensuring an optimal layout on the PCB.

Minimum Supply Voltage: 1.35 V

With a low minimum supply voltage, this product can operate efficiently even in low-power scenarios, enhancing its energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance enables this product to withstand elevated temperatures, increasing its reliability in harsh conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature capability allows this product to function reliably in cold environments, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections and long-term performance.

Terminal Position: BOTTOM

The terminal position on the bottom makes it convenient for PCB layout and allows for easy integration with other components on the board.

Maximum Seated Height: 1.37 mm

The low seated height saves space and enables a more compact design, ideal for applications with limited vertical clearance.

Width: 14 mm

The moderate width of the product offers a good balance between space savings and ease of handling during installation and maintenance.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature specification ensures proper soldering and reliability during the assembly process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering processes, ensuring secure connections and long-term performance.

Length: 14 mm

The moderate length of the product offers a good balance between space savings and ease of handling during installation and maintenance.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating makes this product suitable for demanding environments with wide temperature fluctuations.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design integrates multiple functions into a single IC, reducing the need for additional components and simplifying the overall system design.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: BALL

The ball terminal form ensures reliable connections and allows for easy rework or replacement if needed.

Nominal Supply Voltage: 1.45 V

The nominal supply voltage specification indicates the optimal operating voltage for this product, ensuring stable performance under typical conditions.

Terminal Pitch: 0.8 mm

The tight terminal pitch offers high-density connections and facilitates compact PCB layouts, ideal for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

The MSL rating indicates the sensitivity of the product to moisture, allowing for proper handling and storage to maintain its performance over time.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX286CVM4B attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.37 mm

Maximum Supply Voltage:

1.55 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.45 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX286CVM4B Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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