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MCIMX286DVM4B

NXP Semiconductors

MCIMX286DVM4B by NXP Semiconductors

MCIMX286DVM4B by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C, with supply voltage range of 1.35-1.55 V. Ideal for applications requiring low profile and fine pitch GRID ARRAY package style.

Median Price

$14.108

Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

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Chip1Stop

Japan . 304 parts In-Stock

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Arrow

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$13.400

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Verical

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Newark

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$24.340

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DigiKey

USA . 760 parts In-Stock

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$28.490

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$20.058

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$19.334

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Avnet

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Digiode

USA . 1,780 parts In-Stock

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Anansix

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Nova Conductors

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Bristol Electronics

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Cyclops Electronics Ltd

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Semicontronic

India . 1,593 parts In-Stock

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$10.590

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$10.325

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$10.272

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Ampacity Inc.

Singapore . 2,094 parts In-Stock

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Corphita

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$19.894

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Aztec Data Supply Inc.

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Corohmni

South Africa . 794 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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iodParts Technologies Inc.

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Microchip USA

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Perfect Parts

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Argo Parts USA

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Futuretech Components

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Bastille Electronics

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Overview

Experience cutting-edge technology with the MCIMX286DVM4B by NXP Semiconductors. This innovative System on Chip offers unparalleled performance and reliability in a compact square package. Ideal for a wide range of applications, this product is designed to meet the demands of today's fast-paced world. With a low profile design and fine pitch style, the MCIMX286DVM4B delivers exceptional quality and value. Stay ahead of the curve with NXP Semiconductors and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy installation on circuit boards without the need for through-holes.

Maximum Supply Voltage: 1.55 V

Ensures safe operation within the specified voltage range for reliable performance.

Package Shape: SQUARE

Facilitates efficient use of space on the circuit board.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures without compromising functionality.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for reliable connections.

Width: 14 mm

Compact size enables easy integration into various electronic devices.

Technology: CMOS

Offers low power consumption and high noise immunity for efficient operation.

Nominal Supply Voltage: 1.45 V

Optimal voltage level for stable and efficient performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX286DVM4B attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.37 mm

Maximum Supply Voltage:

1.55 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.45 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX286DVM4B Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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