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MCIMX6U5EVM10AC

NXP Semiconductors

MCIMX6U5EVM10AC by NXP Semiconductors

MCIMX6U5EVM10AC by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating temperature range of -20 to 105 °C. It is used in Other Function uPs,uCs & Peripheral ICs applications.

Median Price

$44.359

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 300 parts In-Stock

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$32.500

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$29.300

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Arrow

USA . 224 parts In-Stock

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$32.630

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$32.630

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Mouser Electronics

USA . 55 parts In-Stock

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$53.060

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$38.940

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$53.060

$38.940

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DigiKey

USA . 65 parts In-Stock

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$63.750

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$47.799

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$46.490

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$63.750

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Avnet

USA . 360 parts In-Stock

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Rochester

USA . 266 parts In-Stock

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$39.430

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$35.280

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$33.210

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$35.280

$33.210

Verical

USA . 256 parts In-Stock

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$49.288

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$44.100

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$41.513

256

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$44.100

$41.513

EBV Elektronik

Germany . 60 parts In-Stock

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Flip Electronics (Authorized)

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Digiode

USA . 3,014 parts In-Stock

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$33.345

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$33.345

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Nova Conductors

Japan . 300 parts In-Stock

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$43.045

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Chip Stock

USA . 3,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,191 parts In-Stock

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Anansix

USA . 994 parts In-Stock

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Martec Srl

Italy . 500 parts In-Stock

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Vyrian

USA . 115 parts In-Stock

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Flip Electronics

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DigiKey Marketplace

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Distributors (Availability)

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Semicontronic

India . 237 parts In-Stock

1+ parts

$29.410

100+ parts

$28.675

1k+ parts

$28.528

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237

$29.410

$28.675

$28.528

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Ampacity Inc.

Singapore . 73 parts In-Stock

1+ parts

$29.410

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73

$29.410

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$30.138

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$28.631

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$28.631

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$30.138

$28.631

$28.631

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Corphita

USA . 1,334 parts In-Stock

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$31.590

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$31.590

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Continental Prestige Electronics

USA . 5,566 parts In-Stock

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$41.452

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$40.623

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$41.452

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$40.623

Aztec Data Supply Inc.

USA . 103 parts In-Stock

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$59.741

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Corohmni

South Africa . 60 parts In-Stock

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$83.371

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Microchip USA

USA . 1,808 parts In-Stock

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Perfect Parts

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Lixinc

USA . 14,735 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,254 parts In-Stock

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Infinite Electronics LLP (Excess)

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Robosynatics

Brazil . 3,933 parts In-Stock

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$33.688

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$33.000

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$33.000

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$33.000

Lucentia Tech

USA . 3,933 parts In-Stock

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$33.688

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$33.000

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$33.000

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$33.000

Futuretech Components

Singapore . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Epart123

USA . 2,100 parts In-Stock

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$24.500

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Kepictronics

USA . 1,500 parts In-Stock

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UNI Independent Distributors

Spain . 1,229 parts In-Stock

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S.R.D Solutions

India . 1,200 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$42.184

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$40.892

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$40.032

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$40.892

$40.032

Argo Parts USA

USA . 467 parts In-Stock

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iodParts Technologies Inc.

India . 220 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 7 parts In-Stock

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Overview

Discover the MCIMX6U5EVM10AC by NXP Semiconductors, a game-changing solution in the category of Other Function uPs,uCs & Peripheral ICs. With its cutting-edge technology and superior quality, this product is designed to revolutionize your applications. Experience the benefits of its low power consumption and high performance, offering unmatched value to customers. Whether it's for industrial automation, consumer electronics, or automotive systems, the MCIMX6U5EVM10AC delivers exceptional results. Trust NXP Semiconductors, a renowned manufacturer known for their innovation and reliability. Upgrade your projects today with the MCIMX6U5EVM10AC!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a durable and cost-effective plastic/epoxy material, ensuring longevity and affordability.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation onto circuit boards, increasing convenience and reducing assembly time.

Maximum Supply Voltage: 1.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, making it suitable for various applications.

Package Shape: SQUARE

The square package shape offers a compact and space-saving design, enabling flexibility in circuit board layouts and maximizing space utilization.

No. of Terminals: 624

With a large number of terminals, this product can support complex circuitry and facilitate connectivity with multiple components, enhancing versatility and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style, coupled with low profile and fine pitch design, ensures efficient signal transmission, reducing signal loss and enhancing performance.

Minimum Supply Voltage: 1.35 V

With a low minimum supply voltage, this product is energy-efficient and suitable for applications with limited power availability or low-power requirements.

Maximum Operating Temperature: 105 °C

This product can withstand high operating temperatures, ensuring stability and reliability even in demanding environments.

Minimum Operating Temperature: -20 °C

With a wide operating temperature range, this product can function effectively in extreme cold conditions, expanding its usability in various environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and reducing the risk of signal degradation.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure installation onto circuit boards, improving stability and reliability.

Maximum Seated Height: 1.6 mm

With a low maximum seated height, this product offers a compact form factor, making it suitable for space-constrained applications or designs.

Width: 21 mm

The 21mm width ensures compatibility with standard PCB configurations and allows for seamless integration into existing systems.

Maximum Time At Peak Reflow Temperature (s): 40

This product can withstand high temperatures during reflow processes for up to 40 seconds, enabling efficient manufacturing and assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can endure rigorous soldering processes, ensuring secure and robust connections.

Length: 21 mm

The 21mm length offers a compact size, allowing for efficient board real estate utilization and enabling design flexibility.

Peripheral IC Type: SYSTEM ON CHIP

This product is a highly integrated system-on-chip peripheral IC, combining various functions into a single component, simplifying designs and reducing system complexity.

Technology: CMOS

Built using complementary metal-oxide-semiconductor (CMOS) technology, this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: BALL

The ball terminal form ensures reliable and solid electrical connections, minimizing contact resistance and enhancing signal transmission quality.

Terminal Pitch: 0.8 mm

With a fine terminal pitch of 0.8mm, this product supports high-density circuit board designs, allowing for greater component integration and miniaturization.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this product has moderate moisture sensitivity, making it suitable for standard storage and handling conditions without requiring specialized precautions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6U5EVM10AC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6U5EVM10AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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