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TCI6630K2LDCMSA2

Texas Instruments

TCI6630K2LDCMSA2 by Texas Instruments

TCI6630K2LDCMSA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. This IC is suitable for applications requiring high-performance processing capabilities in electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,230 parts In-Stock

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5,230

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Digiode

USA . 477 parts In-Stock

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477

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 555 parts In-Stock

1+ parts

$7.000

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555

$7.000

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AZTECH Wire

Italy . 457 parts In-Stock

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$14.980

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457

$14.980

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Parana Technologies

USA . 1,023 parts In-Stock

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$17.241

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$17.456

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$17.241

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$17.456

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DigiPath Technology Company

USA . 112 parts In-Stock

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$18.985

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$17.466

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112

$18.985

$17.466

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ChromeModa Solutions

Germany . 3,434 parts In-Stock

1+ parts

$19.372

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$15.885

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3,434

$19.372

$15.885

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IDEA Electronic Components Group

UK . 2,119 parts In-Stock

1+ parts

$19.372

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$18.403

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$17.435

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2,119

$19.372

$18.403

$17.435

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Corohmni

South Africa . 424 parts In-Stock

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$21.431

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424

$21.431

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One Stop Electronics

USA . 545 parts In-Stock

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$30.000

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$30.000

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Corphita

USA . 2,087 parts In-Stock

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2,087

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Argo Parts USA

USA . 1,408 parts In-Stock

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Continental Prestige Electronics

USA . 875 parts In-Stock

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875

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Bastille Electronics

Australia . 72 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TCI6630K2LDCMSA2 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality products that are designed to exceed expectations. This versatile microprocessor circuit offers endless possibilities for a wide range of applications, thanks to its innovative design and advanced features. Experience seamless performance and reliability like never before with the TCI6630K2LDCMSA2. Upgrade your projects and elevate your results with this game-changing solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly process.

Maximum Supply Voltage: 0.997 V

The maximum supply voltage of 0.997 V ensures safe operation of the product within specified limits.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB.

No. of Terminals: 900

With 900 terminals, this product provides a high level of connectivity and functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers improved thermal performance and reliability.

Minimum Supply Voltage: 0.902 V

The minimum supply voltage of 0.902 V ensures stability and proper functionality of the product.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure PCB mounting.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability.

Peak Reflow Temperature °C: 245

Peak reflow temperature of 245°C ensures proper soldering and component integrity.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit type offers high performance and processing capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form allows for easy soldering and strong connections.

Nominal Supply Voltage: 0.95 V

Nominal supply voltage of 0.95 V ensures stable operation and performance.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level of 4 indicates the product can withstand moderate exposure to moisture during handling and storage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6630K2LDCMSA2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TCI6630K2LDCMSA2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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