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MCIMX31CVMN4CR2

NXP Semiconductors

MCIMX31CVMN4CR2 by NXP Semiconductors

MCIMX31CVMN4CR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates at 1.22-1.47V, suitable for industrial applications. Featuring 473 terminals in a low profile grid array package, it can withstand temperatures from -40 to 85°C.

Median Price

$47.302

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 66 parts In-Stock

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Vyrian

USA . 872 parts In-Stock

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Digiode

USA . 408 parts In-Stock

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Anansix

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AZTECH Wire

Italy . 613 parts In-Stock

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$17.911

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Ampacity Inc.

Singapore . 1,150 parts In-Stock

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$23.000

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One Stop Electronics

USA . 2,782 parts In-Stock

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Semicontronic

India . 1,010 parts In-Stock

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$33.000

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$32.175

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$32.010

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Bastille Electronics

Australia . 100 parts In-Stock

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$47.300

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$44.935

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$42.097

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Continental Prestige Electronics

USA . 4,825 parts In-Stock

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$47.302

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$46.356

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Corohmni

South Africa . 734 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,348 parts In-Stock

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$82.080

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Microchip USA

USA . 1,751 parts In-Stock

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UNI Independent Distributors

Spain . 8,185 parts In-Stock

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Corphita

USA . 4,762 parts In-Stock

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Argo Parts USA

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Advanced Electronics

New Zealand . 70 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the MCIMX31CVMN4CR2 by NXP Semiconductors. Designed to deliver unmatched performance, this system on chip peripheral IC boasts advanced features and a durable plastic body for seamless integration. From industrial applications to consumer electronics, this versatile product offers reliability and efficiency at every turn. Experience innovation like never before with the MCIMX31CVMN4CR2 - your key to success in the fast-paced world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring its longevity and reliability in various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 1.47 V

With a relatively low maximum supply voltage, the IC can be operated efficiently without the risk of damage from high voltage inputs.

Package Shape: SQUARE

Square package shape allows for space-saving and efficient PCB layout, maximizing the use of available space for other components.

Minimum Operating Temperature: -40 °C

The IC's ability to operate at low temperatures makes it suitable for use in a wide range of industrial and harsh environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it a versatile and efficient choice for integrated circuits.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX31CVMN4CR2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B473

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

473

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA473,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,1.8/3

Qualification:

Not Qualified

Maximum Seated Height:

1.54 mm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.47 V

Minimum Supply Voltage:

1.22 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

MCIMX31CVMN4CR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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