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TCI6630K2LXCMSA2

Texas Instruments

TCI6630K2LXCMSA2 by Texas Instruments

Texas Instruments TCI6630K2LXCMSA2 is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages b/w 0.902V to 0.997V, utilizing CMOS technology. Ideal for applications requiring high-performance computing in compact form factors.

Median Price

$2.110

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,752 parts In-Stock

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Digiode

USA . 1,474 parts In-Stock

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1,474

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TME

Poland . 44 parts In-Stock

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-

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$2.110

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44

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$2.110

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Nova Conductors

Japan . 34 parts In-Stock

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34

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Distributors (Availability)

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AZTECH Wire

Italy . 334 parts In-Stock

1+ parts

$7.420

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-

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334

$7.420

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Ampacity Inc.

Singapore . 787 parts In-Stock

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$11.000

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787

$11.000

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Parana Technologies

USA . 2,187 parts In-Stock

1+ parts

$17.189

100+ parts

$1,596.302

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$15.471

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-

2,187

$17.189

$1,596.302

$15.471

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DigiPath Technology Company

USA . 1,915 parts In-Stock

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$18.928

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1,915

$18.928

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ChromeModa Solutions

Germany . 6,918 parts In-Stock

1+ parts

$19.314

100+ parts

$15.837

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6,918

$19.314

$15.837

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IDEA Electronic Components Group

UK . 1,826 parts In-Stock

1+ parts

$19.314

100+ parts

$18.348

1k+ parts

$17.383

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-

1,826

$19.314

$18.348

$17.383

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One Stop Electronics

USA . 925 parts In-Stock

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$29.000

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925

$29.000

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Corohmni

South Africa . 2,375 parts In-Stock

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$32.020

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2,375

$32.020

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Continental Prestige Electronics

USA . 3,836 parts In-Stock

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3,836

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Corphita

USA . 2,887 parts In-Stock

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Argo Parts USA

USA . 1,598 parts In-Stock

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1,598

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Unlock the potential of your electronic designs with the TCI6630K2LXCMSA2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that meet the highest standards. This microprocessor circuit offers endless possibilities for applications in various industries. With its advanced technology and reliable performance, this IC provides unmatched value and benefits to customers looking to enhance their systems. Experience the advantages of the TCI6630K2LXCMSA2 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 0.997 V

The high maximum supply voltage ensures stable and reliable operation of the product.

Package Shape: SQUARE

The square package shape helps in optimizing space on the PCB and allows for efficient layout.

No. of Terminals: 900

The high number of terminals provides flexibility in connecting various components and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style enables easy alignment and mounting on the PCB.

Minimum Supply Voltage: 0.902 V

The low minimum supply voltage ensures energy efficiency and stable performance at lower power levels.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper ensures good electrical conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connections on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures proper soldering without damaging the IC.

Peak Reflow Temperature °C: 245

The high peak reflow temperature capability ensures reliable solder joints and product longevity.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit in the peripheral IC enhances the processing power and functionality of the product.

Technology: CMOS

CMOS technology ensures low power consumption and high speed performance.

Terminal Form: BALL

The ball terminal form enables easy rework and replacement of the IC if necessary.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage provides a balanced operating point for efficiency and performance.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the product has a moderate sensitivity to moisture, requiring proper handling and storage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6630K2LXCMSA2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TCI6630K2LXCMSA2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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