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TCI6630K2LSCMSA24

Texas Instruments

TCI6630K2LSCMSA24 by Texas Instruments

TCI6630K2LSCMSA24 by Texas Instruments is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0.902V to 0.997V and is designed for applications requiring high-performance processing capabilities in a compact form factor. Ideal for use in advanced electronic systems that demand efficient data processing and control functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,264 parts In-Stock

1+ parts

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3,264

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Vyrian

USA . 3,181 parts In-Stock

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3,181

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 476 parts In-Stock

1+ parts

$11.000

100+ parts

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476

$11.000

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AZTECH Wire

Italy . 327 parts In-Stock

1+ parts

$18.190

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327

$18.190

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Parana Technologies

USA . 1,334 parts In-Stock

1+ parts

$37.900

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1,334

$37.900

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Corohmni

South Africa . 198 parts In-Stock

1+ parts

$40.929

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198

$40.929

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DigiPath Technology Company

USA . 615 parts In-Stock

1+ parts

$41.732

100+ parts

$38.394

1k+ parts

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615

$41.732

$38.394

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ChromeModa Solutions

Germany . 5,170 parts In-Stock

1+ parts

$42.584

100+ parts

$34.919

1k+ parts

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5,170

$42.584

$34.919

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IDEA Electronic Components Group

UK . 2,305 parts In-Stock

1+ parts

$42.584

100+ parts

$40.455

1k+ parts

$38.326

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2,305

$42.584

$40.455

$38.326

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Corphita

USA . 472 parts In-Stock

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472

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Overview

Unlock the power of cutting-edge technology with the TCI6630K2LSCMSA24 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers innovative solutions in the category of Other Function uPs, uCs & Peripheral ICs. This product offers unmatched value with its advanced features and versatile applications. Experience seamless performance and efficiency with the TCI6630K2LSCMSA24, designed to meet your unique needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the inner components of the product, ensuring long-lasting performance.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of the product on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 0.997 V

The high maximum supply voltage of 0.997 V allows for reliable and stable operation under varying power conditions, making this product versatile and adaptable for different applications.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making it suitable for designs where space is limited or where a sleek and modern aesthetic is desired.

No. of Terminals: 900

With 900 terminals, this product offers ample connectivity options for interfacing with other components or peripherals, providing flexibility in design and functionality.

Package Style (Meter): GRID ARRAY

The grid array package style allows for a higher density of terminals in a compact space, making it ideal for applications where a large number of connections are required.

Minimum Supply Voltage: 0.902 V

The low minimum supply voltage of 0.902 V ensures efficient power consumption and enables the product to operate reliably even with lower power sources, enhancing energy efficiency.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom facilitates easier and tidier PCB layout and soldering, streamlining the manufacturing process and improving overall product reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit as a peripheral IC enhances the product's processing capabilities, enabling advanced functionality and performance in various applications.

Technology: CMOS

Utilizing CMOS technology offers benefits such as low power consumption, high noise immunity, and compatibility with a wide range of devices, making this product efficient and versatile for diverse applications.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and easy soldering, ensuring a secure and stable interface with other components for consistent performance.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage of 0.95 V is a commonly used and stable voltage level, ensuring compatibility with standard power sources and smooth operation in various electronic systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6630K2LSCMSA24 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

No. of Terminals:

900

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

TCI6630K2LSCMSA24 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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