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TCI6630K2LDCMSA24

Texas Instruments

TCI6630K2LDCMSA24 by Texas Instruments

TCI6630K2LDCMSA24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates b/w 0.902V to 0.997V, making it suitable for high-performance computing applications requiring low supply voltage. The PLASTIC/EPOXY package body material and BALL terminal form ensure reliable surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,713 parts In-Stock

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4,713

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Digiode

USA . 3,981 parts In-Stock

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3,981

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Distributors (Availability)

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AZTECH Wire

Italy . 261 parts In-Stock

1+ parts

$10.843

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261

$10.843

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One Stop Electronics

USA . 535 parts In-Stock

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$26.000

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535

$26.000

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Corohmni

South Africa . 991 parts In-Stock

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$39.451

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991

$39.451

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Parana Technologies

USA . 987 parts In-Stock

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$42.265

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987

$42.265

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ChromeModa Solutions

Germany . 6,063 parts In-Stock

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$47.489

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$38.941

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6,063

$47.489

$38.941

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IDEA Electronic Components Group

UK . 2,062 parts In-Stock

1+ parts

$47.489

100+ parts

$45.115

1k+ parts

$42.740

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2,062

$47.489

$45.115

$42.740

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Corphita

USA . 4,704 parts In-Stock

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DigiPath Technology Company

USA . 1,744 parts In-Stock

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$42.816

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$42.816

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Overview

Unlock the power of cutting-edge technology with the TCI6630K2LDCMSA24 by Texas Instruments. Renowned for their top-quality products, Texas Instruments delivers exceptional performance and reliability in the field of Other Function uPs,uCs & Peripheral ICs. This versatile microprocessor circuit is perfect for a wide range of applications, providing seamless integration and high efficiency. Experience the value and benefits of Texas Instruments' innovation with the TCI6630K2LDCMSA24, offering customers unparalleled advantages in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 0.997 V

Having a maximum supply voltage of 0.997 V makes this product suitable for low power applications, reducing energy consumption and heat generation.

Package Shape: SQUARE

A square package shape provides a compact design that can fit well in tight spaces, making it ideal for applications where size is a constraint.

No. of Terminals: 900

With 900 terminals, this product offers a high level of connectivity options for interfacing with other components and devices, increasing its versatility.

Package Style (Meter): GRID ARRAY

A grid array package style allows for efficient routing of connections and signals, reducing the risk of interference and improving overall performance.

Minimum Supply Voltage: 0.902 V

The minimum supply voltage of 0.902 V ensures reliable operation even in low voltage conditions, making it suitable for a wide range of applications.

Terminal Position: BOTTOM

Bottom terminal position simplifies the mounting process and provides a secure connection, enhancing the overall reliability of the product.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Featuring a microprocessor circuit as a peripheral IC type offers advanced processing capabilities, enabling complex functions and tasks to be performed efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the product energy-efficient and capable of handling demanding tasks.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and provides a reliable connection, ensuring stable performance under varying conditions.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage of 0.95 V optimizes power efficiency while maintaining reliable operation, making it a cost-effective and versatile choice for various applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6630K2LDCMSA24 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

No. of Terminals:

900

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

TCI6630K2LDCMSA24 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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