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TCI6630K2LXCMS2

Texas Instruments

TCI6630K2LXCMS2 by Texas Instruments

TCI6630K2LXCMS2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates on a supply voltage range of 0.902V to 0.997V, making it suitable for high-performance computing applications requiring advanced CMOS technology and surface mount compatibility. With a peak reflow temperature of 245°C, this device offers reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,774 parts In-Stock

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Digiode

USA . 3,955 parts In-Stock

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3,955

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Distributors (Availability)

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One Stop Electronics

USA . 1,119 parts In-Stock

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$6.000

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$6.000

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AZTECH Wire

Italy . 838 parts In-Stock

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$18.474

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838

$18.474

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Ampacity Inc.

Singapore . 248 parts In-Stock

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$26.000

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$26.000

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Parana Technologies

USA . 333 parts In-Stock

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$27.853

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$40.724

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333

$27.853

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$40.724

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DigiPath Technology Company

USA . 2,156 parts In-Stock

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$30.669

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$30.669

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ChromeModa Solutions

Germany . 2,230 parts In-Stock

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$31.295

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$25.662

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$31.295

$25.662

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IDEA Electronic Components Group

UK . 251 parts In-Stock

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$31.295

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$29.730

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$28.166

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251

$31.295

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$28.166

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Corohmni

South Africa . 973 parts In-Stock

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$45.777

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Argo Parts USA

USA . 3,346 parts In-Stock

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Corphita

USA . 3,169 parts In-Stock

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Continental Prestige Electronics

USA . 1,559 parts In-Stock

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Bastille Electronics

Australia . 79 parts In-Stock

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Overview

Elevate your projects with the TCI6630K2LXCMS2 by Texas Instruments, a top-tier manufacturer known for quality and reliability. This versatile microprocessor circuit is perfect for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category. With a grid array package style and Tin Silver Copper terminal finish, this product offers unmatched performance and value. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and easy handling.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and facilitating efficient assembly.

Maximum Supply Voltage: 0.997 V

The high maximum supply voltage capability of 0.997 V ensures stable and reliable performance under varying voltage conditions.

Package Shape: SQUARE

The square package shape offers efficient use of space on the circuit board, contributing to a compact and organized design.

No. of Terminals: 900

The high number of terminals allows for extensive connectivity options, enabling versatile applications and compatibility with various systems.

Package Style (Meter): GRID ARRAY

The grid array package style provides a structured and organized layout of terminals, simplifying the connection process and enhancing overall system efficiency.

Minimum Supply Voltage: 0.902 V

The low minimum supply voltage requirement of 0.902 V ensures efficient power usage and compatibility with a wide range of power sources.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish ensures excellent conductivity, reliability, and durability for seamless connections and long-term performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy installation and maintenance, allowing for quick and convenient access to the terminals on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and assembly, contributing to a reliable and stable connection.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C allows for efficient and effective soldering, ensuring secure connections and optimal performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit type enhances the product's processing capabilities, enabling advanced functionality and performance for a wide range of applications.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and excellent noise immunity, making the product energy-efficient and reliable for various electronic systems.

Terminal Form: BALL

The ball terminal form provides a secure and reliable connection, ensuring stable performance and preventing signal loss or interference.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage of 0.95 V provides a standard operating voltage, ensuring compatibility with a wide range of systems and power sources.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that the product has a low sensitivity to moisture, preventing damage or performance issues in humid environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6630K2LXCMS2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TCI6630K2LXCMS2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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