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MIMX8MM3DVTLZAA

NXP Semiconductors

MIMX8MM3DVTLZAA by NXP Semiconductors

The NXP Semiconductors MIMX8MM3DVTLZAA is a low-profile, fine-pitch grid array SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.

Median Price

$32.100

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 152 parts In-Stock

1+ parts

$32.100

100+ parts

$19.500

1k+ parts

$19.000

10k+ parts

-

152

$32.100

$19.500

$19.000

-

Mouser Electronics

USA . 137 parts In-Stock

1+ parts

$32.600

100+ parts

$21.650

1k+ parts

$21.640

10k+ parts

-

137

$32.600

$21.650

$21.640

-

DigiKey

USA . 94 parts In-Stock

1+ parts

$36.320

100+ parts

$27.785

1k+ parts

$24.853

10k+ parts

-

94

$36.320

$27.785

$24.853

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Verical

USA . 608 parts In-Stock

1+ parts

-

100+ parts

$22.038

1k+ parts

$19.725

10k+ parts

$18.563

608

-

$22.038

$19.725

$18.563

Rochester

USA . 608 parts In-Stock

1+ parts

-

100+ parts

$17.630

1k+ parts

$15.780

10k+ parts

$14.850

608

-

$17.630

$15.780

$14.850

EBV Elektronik

Germany . 152 parts In-Stock

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-

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-

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152

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Distributors (In-Stock)

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Digiode

USA . 1,451 parts In-Stock

1+ parts

$25.175

100+ parts

-

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1,451

$25.175

-

-

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$28.680

100+ parts

-

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870

$28.680

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-

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Vyrian

USA . 8,337 parts In-Stock

1+ parts

-

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8,337

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Anansix

USA . 610 parts In-Stock

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610

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Distributors (Availability)

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Semicontronic

India . 426 parts In-Stock

1+ parts

$20.350

100+ parts

$19.841

1k+ parts

$19.740

10k+ parts

-

426

$20.350

$19.841

$19.740

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Ampacity Inc.

Singapore . 23 parts In-Stock

1+ parts

$20.350

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-

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23

$20.350

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Corphita

USA . 1,933 parts In-Stock

1+ parts

$23.850

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1,933

$23.850

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Continental Prestige Electronics

USA . 4,604 parts In-Stock

1+ parts

$28.680

100+ parts

-

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10k+ parts

$28.107

4,604

$28.680

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-

$28.107

Netroflash

USA . 100 parts In-Stock

1+ parts

$28.680

100+ parts

-

1k+ parts

$27.246

10k+ parts

$26.673

100

$28.680

-

$27.246

$26.673

Modulus Dynamics

Lithuania . 1,461 parts In-Stock

1+ parts

$33.322

100+ parts

$33.322

1k+ parts

$33.322

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1,461

$33.322

$33.322

$33.322

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Corohmni

South Africa . 4,994 parts In-Stock

1+ parts

$34.387

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4,994

$34.387

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Microchip USA

USA . 1,842 parts In-Stock

1+ parts

$62.967

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1,842

$62.967

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Aztec Data Supply Inc.

USA . 2,923 parts In-Stock

1+ parts

$68.060

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2,923

$68.060

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$83.408

100+ parts

$79.238

1k+ parts

$79.238

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5,000

$83.408

$79.238

$79.238

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UNI Independent Distributors

Spain . 4,332 parts In-Stock

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4,332

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Argo Parts USA

USA . 2,926 parts In-Stock

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2,926

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Robosynatics

Brazil . 1,586 parts In-Stock

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1,586

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Lucentia Tech

USA . 1,586 parts In-Stock

1+ parts

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100+ parts

$62.074

1k+ parts

$60.807

10k+ parts

$60.807

1,586

-

$62.074

$60.807

$60.807

Overview

Experience unparalleled performance and reliability with the MIMX8MM3DVTLZAA by NXP Semiconductors. As a leader in semiconductor innovation, NXP delivers cutting-edge solutions for a wide range of applications. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs and offers customers exceptional value and benefits. Whether you're looking to power your IoT device or enhance your automotive system, the MIMX8MM3DVTLZAA is the perfect choice. Trust NXP Semiconductors for quality, efficiency, and unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage ensures a reliable power source for the product.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space on the PCB.

No. of Terminals: 486

The large number of terminals allows for connections to multiple external components, enhancing functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density and efficient signal transmission.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature allows for use in various environmental conditions without overheating.

Terminal Finish: TIN SILVER

The tin silver terminal finish provides good conductivity and corrosion resistance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connections on the PCB.

Maximum Seated Height: 1.25 mm

The low maximum seated height helps to minimize the overall profile of the product.

Width: 14 mm

The compact width dimension allows for efficient utilization of space on the PCB.

Maximum Time At Peak Reflow Temperature (s): 40

The short maximum time at peak reflow temperature ensures reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for robust solder joints for long-term reliability.

Length: 14 mm

The compact length dimension contributes to a space-saving design on the PCB.

Peripheral IC Type: SoC

The System on Chip (SoC) design integrates multiple functions into a single chip, reducing component count and complexity.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

The ball terminal form provides reliable connections and facilitates easy assembly.

Nominal Supply Voltage: 1 V

The standard nominal supply voltage ensures compatibility with common power sources.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting on the PCB, saving space.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product has a moderate sensitivity to moisture, suitable for standard manufacturing processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMX8MM3DVTLZAA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B486

JESD-609 Code:

e2

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

486

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA486,27X27,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.25 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMX8MM3DVTLZAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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