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TCI6630K2LSCMS

Texas Instruments

TCI6630K2LSCMS by Texas Instruments

TCI6630K2LSCMS by Texas Instruments is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0.902V to 0.997V, making it suitable for high-performance computing applications requiring low power consumption and advanced processing capabilities. The surface-mount design and ball terminal form enhance its versatility for various embedded system designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,241 parts In-Stock

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8,241

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Digiode

USA . 3,248 parts In-Stock

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3,248

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 436 parts In-Stock

1+ parts

$6.958

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436

$6.958

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One Stop Electronics

USA . 904 parts In-Stock

1+ parts

$29.000

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904

$29.000

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Parana Technologies

USA . 1,671 parts In-Stock

1+ parts

$43.363

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1,671

$43.363

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DigiPath Technology Company

USA . 259 parts In-Stock

1+ parts

$47.749

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259

$47.749

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ChromeModa Solutions

Germany . 4,883 parts In-Stock

1+ parts

$48.723

100+ parts

$39.953

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4,883

$48.723

$39.953

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IDEA Electronic Components Group

UK . 796 parts In-Stock

1+ parts

$48.723

100+ parts

$46.287

1k+ parts

$43.851

10k+ parts

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796

$48.723

$46.287

$43.851

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Corohmni

South Africa . 78 parts In-Stock

1+ parts

$69.334

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78

$69.334

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Corphita

USA . 1,791 parts In-Stock

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1,791

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Overview

Unlock the power of cutting-edge technology with the TCI6630K2LSCMS by Texas Instruments. Renowned for their superior quality and innovation, Texas Instruments delivers top-of-the-line products that exceed expectations. This versatile microprocessor circuit is perfect for a wide range of applications, offering unmatched performance and reliability. From smart devices to automotive systems, this product provides exceptional value and efficiency. Upgrade your projects with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 0.997 V

The high maximum supply voltage ensures stable operation and compatibility with different power sources.

Package Shape: SQUARE

Square package shape facilitates easy placement on the PCB and efficient use of space.

No. of Terminals: 900

With 900 terminals, this product provides a high level of connectivity and versatility for complex circuit designs.

Package Style (Meter): GRID ARRAY

Grid array package style offers high terminal density and improved electrical performance, making it ideal for high-speed applications.

Minimum Supply Voltage: 0.902 V

The low minimum supply voltage ensures energy efficiency and reliable operation even at lower power levels.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and improves thermal management for better overall performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit enables advanced data processing and control capabilities, making the product suitable for sophisticated applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable operation, making the product efficient and cost-effective.

Terminal Form: BALL

Ball terminal form allows for efficient soldering and reliable connections, ensuring long-term functionality of the product.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage provides a balanced operating range for optimal performance and compatibility with standard power sources.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6630K2LSCMS attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

No. of Terminals:

900

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

TCI6630K2LSCMS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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