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MCIMX357CJQ5CR2

NXP Semiconductors

MCIMX357CJQ5CR2 by NXP Semiconductors

MCIMX357CJQ5CR2 by NXP Semiconductors is a 400-terminal GRID ARRAY uP with 1.22-1.47 V supply range, ideal for SYSTEM ON CHIP applications in industrial settings. It features a low profile design, operates b/w -40 to 85 °C, and has a peak reflow temp of 260 C.

Median Price

$41.370

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

MCIMX357CJQ5CR2 by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,100 parts In-Stock

1+ parts

$41.370

100+ parts

$32.074

1k+ parts

-

10k+ parts

-

2,100

$41.370

$32.074

-

-

Mouser Electronics

USA . 1,359 parts In-Stock

1+ parts

$41.370

100+ parts

$32.080

1k+ parts

$31.840

10k+ parts

-

1,359

$41.370

$32.080

$31.840

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Future Electronics

Canada . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$24.740

10k+ parts

-

1,000

-

-

$24.740

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Distributors (In-Stock)

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Nova Conductors

Japan . 82 parts In-Stock

1+ parts

$27.127

100+ parts

-

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82

$27.127

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Digiode

USA . 791 parts In-Stock

1+ parts

$30.428

100+ parts

-

1k+ parts

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791

$30.428

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Semtec, LLC

USA . 2,543 parts In-Stock

1+ parts

-

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2,543

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NAC Semi

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$38.000

10k+ parts

$35.080

2,000

-

-

$38.000

$35.080

Vyrian

USA . 1,930 parts In-Stock

1+ parts

-

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1,930

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IBS Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$28.587

10k+ parts

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1,000

-

-

$28.587

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Cyclops Electronics Ltd

UK . 242 parts In-Stock

1+ parts

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242

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Anansix

USA . 101 parts In-Stock

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101

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,439 parts In-Stock

1+ parts

$27.127

100+ parts

-

1k+ parts

-

10k+ parts

$26.584

3,439

$27.127

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-

$26.584

Semicontronic

India . 2,052 parts In-Stock

1+ parts

$28.590

100+ parts

$27.875

1k+ parts

$27.732

10k+ parts

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2,052

$28.590

$27.875

$27.732

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Ampacity Inc.

Singapore . 1,882 parts In-Stock

1+ parts

$28.590

100+ parts

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1k+ parts

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1,882

$28.590

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Corphita

USA . 1,032 parts In-Stock

1+ parts

$28.827

100+ parts

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1,032

$28.827

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$43.986

100+ parts

$40.027

1k+ parts

$36.069

10k+ parts

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450

$43.986

$40.027

$36.069

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Microchip USA

USA . 2,418 parts In-Stock

1+ parts

$56.966

100+ parts

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2,418

$56.966

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Corohmni

South Africa . 1 parts In-Stock

1+ parts

$65.238

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1

$65.238

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Aztec Data Supply Inc.

USA . 3,450 parts In-Stock

1+ parts

$72.602

100+ parts

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3,450

$72.602

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Lixinc

USA . 10,511 parts In-Stock

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10,511

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UNI Independent Distributors

Spain . 5,004 parts In-Stock

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5,004

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Argo Parts USA

USA . 4,992 parts In-Stock

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4,992

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Overview

Unlock the next level of innovation with the MCIMX357CJQ5CR2 by NXP Semiconductors. This cutting-edge System on Chip offers unparalleled performance and reliability in a compact GRID ARRAY package. Perfect for a wide range of applications, this product is designed to exceed your expectations. Experience seamless integration, superior quality, and unmatched value with NXP Semiconductors. Elevate your projects and stay ahead of the competition with the MCIMX357CJQ5CR2.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the internal components of the IC.

Surface Mount:

YES - Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage:

1.47 V - Suitable for a wide range of applications while ensuring safe operation within specified limits.

Package Shape:

SQUARE - Offers a compact design that maximizes space efficiency on the PCB.

No. of Terminals:

400 - Provides ample connectivity options for interfacing with other components in the system.

Package Style:

GRID ARRAY, LOW PROFILE, FINE PITCH - Enables high-density mounting for increased functionality in a limited space.

Minimum Supply Voltage:

1.22 V - Ensures compatibility with various power sources while maintaining stable operation.

Maximum Operating Temperature:

85 °C - Allows the IC to perform reliably in a wide range of environmental conditions.

Minimum Operating Temperature:

40 °C - Ensures functionality even in extreme cold temperatures.

Terminal Finish:

TIN SILVER COPPER - Enhances solderability and conductivity for a reliable electrical connection.

Terminal Position:

BOTTOM - Facilitates easier PCB layout and routing of traces for efficient circuit design.

Maximum Seated Height:

1.6 mm - Contributes to a slim and streamlined form factor for space-constrained applications.

Width:

17 mm - Provides a compact footprint that can fit into tight spaces on the PCB.

Maximum Time At Peak Reflow Temperature (s):

40 - Helps ensure proper soldering without damaging the IC during assembly.

Peak Reflow Temperature °C:

260 - Allows for high-temperature soldering processes for a secure bond to the PCB.

Length:

17 mm - Offers a square form factor that simplifies placement and orientation on the circuit board.

Temperature Grade:

INDUSTRIAL - Built to withstand harsh industrial environments with extended temperature ranges.

Peripheral IC Type:

SYSTEM ON CHIP - Integrates multiple functions into a single IC for simplified system design and reduced component count.

Terminal Form:

BALL - Enables reliable connections and efficient heat dissipation for improved performance.

Nominal Supply Voltage:

1.8 V - Operates within a common voltage range for compatibility with various power sources.

Terminal Pitch:

0.8 mm - Allows for precise placement and alignment during PCB assembly for a secure mechanical connection.

Moisture Sensitivity Level (MSL):

3 - Indicates the level of protection against moisture during storage and handling, ensuring product reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX357CJQ5CR2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.47 V

Minimum Supply Voltage:

1.22 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCIMX357CJQ5CR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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