Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TCI6630K2LDCMS24 by Texas Instruments is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0.902V to 0.997V and is designed for applications requiring high-performance processing capabilities in a compact form factor. Ideal for advanced computing systems, networking equipment, and industrial automation solutions.
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The plastic/epoxy material used in the package body provides durability and protection to the components inside, ensuring a longer lifespan for the product.
The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.
The high maximum supply voltage of 0.997 V allows for versatile use in different voltage environments, providing flexibility in application.
The square package shape helps in optimizing space efficiency on circuit boards, allowing for more compact and streamlined designs.
The large number of terminals (900) enables connectivity to a wide range of external components and devices, making this product highly versatile in functionality.
The grid array package style provides a stable and secure mounting structure, ensuring reliable performance under varying environmental conditions.
The low minimum supply voltage of 0.902 V helps in reducing power consumption and operating costs, making this product energy-efficient.
The bottom terminal position allows for easy access and connections, facilitating maintenance and troubleshooting processes.
The microprocessor circuit in the peripheral IC type enhances processing capabilities, enabling advanced functionality and performance in various applications.
The CMOS technology used in this product ensures high-speed operation, low power consumption, and compatibility with a wide range of digital systems.
The ball terminal form offers reliable and secure connections, minimizing the risk of signal loss or disruptions, ensuring smooth and uninterrupted operation.
The nominal supply voltage at 0.95 V provides stable and consistent power delivery, ensuring reliable performance and consistent output in various operating conditions.
Other Function uPs,uCs & Peripheral ICs TCI6630K2LDCMS24 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments
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TCI6630K2LDCMS24 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
LM358AN
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N7002
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
BAV99
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
M39029/58-360
Positronic Industries
CONNECTOR ACCESSORY; MIL-Connector Accessory Name: CONTACT; DIN Conformity: NO; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354; Contact Type: CRIMP REAR RELEASE;
LD1117S33CTR
STMicroelectronics
STMicroelectronics LD1117S33CTR is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It operates within an input voltage range of 4.75V to 15V, making it suitable for various applications requiring stable voltage regulation in compact designs. The device features low dropout voltage of 1.3V, high temperature operation up to 125°C, and small outline package style for space-constrained PCB layouts.
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
Multicomp Pro
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
MICRODIODE ELECTRONICS SHENZHEN CO LTD
Crimson Semiconductor
1N4148WS
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
STM32F407VGT6
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BM83SM1-00TA
Microchip Technology
BM83SM1-00TA by Microchip Tech is a 50-terminal IC with max supply voltage of 4.2V and min of 3.2V. It operates b/w -40 to 85°C, ideal for PROGRAMMABLE RFSoC applications due to its CMOS technology and compact rectangular package style.
AM4372BZDNA60
Texas Instruments
AM4372BZDNA60 by Texas Instruments is a System on Chip with 491 terminals in a low profile grid array package. It operates b/w -40 to 105°C, with supply voltage range of 1.056V to 1.144V. Ideal for industrial applications requiring high performance and reliability in compact designs.
ESP32-WROOM-32E-N16
Espressif Systems (Shanghai)
ESP32-WROOM-32E-N16 by Espressif Systems is a 38-terminal SoC with CMOS technology. It operates at 3-3.6V, withstands -40 to 85°C, and has a compact rectangular package. Ideal for IoT devices, wearables, and smart home applications due to its small form factor and low power consumption.
MPFS250TFCVG484I
Microchip Technology's MPFS250TFCVG484I is a 484-terminal SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.97V to 1.03V. The grid array package is square-shaped, measuring 19mm x 19mm, suitable for various uPs and uCs applications.
FT245BL-T/R
FTDI
FT245BL-T/R by FTDI is a 32-terminal peripheral IC with a supply voltage range of 4.35V to 5.25V. It operates in temperatures from 0°C to 70°C, making it suitable for commercial applications requiring a microprocessor circuit with CMOS technology. The package style is flatpack, low profile, and it features gull wing terminal form for easy surface mounting at a compact size of 7mm x 7mm.
MIMX8MM3CVTKZAA
NXP Semiconductors
The NXP Semiconductors MIMX8MM3CVTKZAA is a SoC with 486 terminals, operating b/w -40 to 105°C. It has a supply voltage range of 0.9V to 1V and uses CMOS technology. This low-profile, fine-pitch IC is suitable for applications requiring high performance in compact spaces.
CYAT827AZA59-22002
Infineon Technologies
PSoC;
ST33HTPH2E28AHD0
ST33HTPH2E28AHD0 by STMicroelectronics is a 28-terminal IC with CMOS technology, operating b/w -40 to 105°C. It's a cryptographic authenticator with 1.8V supply voltage, suitable for secure applications requiring compact design and surface mount compatibility.
CC1310F128RGZT
CC1310F128RGZT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring a microprocessor circuit in a compact chip carrier package style.
XCZU7EV-2FFVC1156E
Xilinx
XCZU7EV-2FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 1156 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for applications requiring high performance and reliability in compact designs.
MIMX8MN6DVTJZAA
The NXP Semiconductors MIMX8MN6DVTJZAA is a low-profile, fine-pitch grid array SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.
DA16200MOD-AAC4WA32
Renesas Electronics
SYSTEM ON CHIP; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
NRF9160-SIAA-R
Nordic Semiconductor Asa
NRF9160-SIAA-R by Nordic Semiconductor Asa is a surface mount microcontroller with 127 terminals. It operates at a voltage range of 3-5.5V and can withstand temperatures from -40 to 85°C. It is commonly used in industrial applications requiring low power consumption and compact size.
ESP32-S3-WROOM-1-N4
ESP32-S3-WROOM-1-N4 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C and requires 3-3.6 V supply voltage. Ideal for IoT applications due to its compact size (18x25.5 mm) and surface-mount capability.
XC7Z010-1CLG225C
The Xilinx XC7Z010-1CLG225C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring low profile, fine pitch grid array packages in plastic/epoxy material.
DA14682-00F08A92
SoC; Peak Reflow Temperature (C): 255; Moisture Sensitivity Level (MSL): 3;
MC13213R2
Freescale Semiconductor
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 71; Package Code: VFLGA; Package Shape: SQUARE;
ATECC608B-MAHCZ-S
ATECC608B-MAHCZ-S by Microchip Technology is a cryptographic authenticator with 8 terminals and a small outline package. It operates at temperatures ranging from -40 to 85 °C and has a max supply voltage of 5.5 V. It is commonly used in industrial applications for secure authentication purposes.
CY8C6244AZI-S4D92
CY8C6244AZI-S4D92 by Infineon Technologies is a 64-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage ranging from 1.7V to 3.6V. This IC is used in applications requiring low-profile, fine-pitch packages for various functions like uPs and uCs.
MCIMX6X1AVK08AB
MCIMX6X1AVK08AB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.275V to 1.5V, making it ideal for automotive applications requiring low profile, fine pitch ICs.
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UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
TCI6630K2LCMSA2
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .997 V;
TCI6630K2LCMS
TCI6630K2LCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for high-performance computing applications requiring advanced processing capabilities.
TCI6630K2LCMSA
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
TCI6630K2LDCMSA
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B900;
TCI6630K2LDCMSA2
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: .95 V;
TCI6630K2LXCMSA2
TCI6630K2LXCMSA
TCI6630K2LXCMSA by Texas Instruments is a microprocessor circuit with a max supply voltage of 0.997V and a min supply voltage of 0.902V. It is used in applications requiring high-performance processing capabilities.
TCI6630K2LXCMS2
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
TCI6630K2LXCMS
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
TCI6630K2LSCMSA
TCI6630K2LSCMSA2
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .902 V;
TCI6630K2LDCMS2
TCI6630K2LCMS2
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
TCI6630K2LSCMSA24
TCI6630K2LDCMSA24
TCI6630K2LCMSA24
TCI6630K2LSCMS
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
TCI6630K2LSCMS2
TCI6630K2LCMS24
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