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TCI6630K2LDCMS24

Texas Instruments

TCI6630K2LDCMS24 by Texas Instruments

TCI6630K2LDCMS24 by Texas Instruments is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0.902V to 0.997V and is designed for applications requiring high-performance processing capabilities in a compact form factor. Ideal for advanced computing systems, networking equipment, and industrial automation solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,998 parts In-Stock

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7,998

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Digiode

USA . 502 parts In-Stock

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502

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One Stop Electronics

USA . 787 parts In-Stock

1+ parts

$10.000

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787

$10.000

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AZTECH Wire

Italy . 314 parts In-Stock

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$13.679

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314

$13.679

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Corohmni

South Africa . 675 parts In-Stock

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$40.543

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675

$40.543

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Parana Technologies

USA . 1,552 parts In-Stock

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$72.992

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1,552

$72.992

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DigiPath Technology Company

USA . 438 parts In-Stock

1+ parts

$80.373

100+ parts

$73.943

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438

$80.373

$73.943

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ChromeModa Solutions

Germany . 5,699 parts In-Stock

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$82.013

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$67.251

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5,699

$82.013

$67.251

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IDEA Electronic Components Group

UK . 763 parts In-Stock

1+ parts

$82.013

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$77.912

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$73.812

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763

$82.013

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$73.812

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Corphita

USA . 4,052 parts In-Stock

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4,052

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Overview

Elevate your products to the next level with the TCI6630K2LDCMS24 by Texas Instruments. Renowned for their top-quality manufacturing, Texas Instruments delivers exceptional performance and reliability in the category of Other Function uPs,uCs & Peripheral ICs. This cutting-edge product boasts a range of applications, offering unmatched value and benefits to customers. Experience seamless integration, superior functionality, and unparalleled efficiency with the TCI6630K2LDCMS24. Elevate your projects with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 0.997 V

The high maximum supply voltage of 0.997 V allows for versatile use in different voltage environments, providing flexibility in application.

Package Shape: SQUARE

The square package shape helps in optimizing space efficiency on circuit boards, allowing for more compact and streamlined designs.

No. of Terminals: 900

The large number of terminals (900) enables connectivity to a wide range of external components and devices, making this product highly versatile in functionality.

Package Style (Meter): GRID ARRAY

The grid array package style provides a stable and secure mounting structure, ensuring reliable performance under varying environmental conditions.

Minimum Supply Voltage: 0.902 V

The low minimum supply voltage of 0.902 V helps in reducing power consumption and operating costs, making this product energy-efficient.

Terminal Position: BOTTOM

The bottom terminal position allows for easy access and connections, facilitating maintenance and troubleshooting processes.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit in the peripheral IC type enhances processing capabilities, enabling advanced functionality and performance in various applications.

Technology: CMOS

The CMOS technology used in this product ensures high-speed operation, low power consumption, and compatibility with a wide range of digital systems.

Terminal Form: BALL

The ball terminal form offers reliable and secure connections, minimizing the risk of signal loss or disruptions, ensuring smooth and uninterrupted operation.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage at 0.95 V provides stable and consistent power delivery, ensuring reliable performance and consistent output in various operating conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6630K2LDCMS24 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

No. of Terminals:

900

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

TCI6630K2LDCMS24 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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