Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MCIMX515DJM8C by NXP Semiconductors is a SYSTEM ON CHIP with 529 terminals, operating at 1.05-1.15V. It features a CMOS technology, low profile GRID ARRAY package style suitable for applications requiring high performance in a compact form factor and temperature range of -20 to 85°C.
Median Price
$62.563
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$78.900
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$79.510
$59.016
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Rochester
$50.050
$44.780
$42.140
Verical
$55.975
$52.675
Avnet
Future Electronics
$39.250
EBV Elektronik
Chip1Stop
$36.500
Digiode
$38.684
Nova Conductors
$48.950
Flip Electronics
Vyrian
DigiKey Marketplace
NAC Semi
$60.380
Anansix
Chip Stock
IBS Electronics
$69.676
TME
$71.650
Martec Srl
Cyclops Electronics Ltd
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LIBRA Elektronik GmbH
ComSIT Distribution GmbH
LWI Electronics Inc
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Corohmni
$25.696
Ampacity Inc.
$31.020
Component Stockers USA
$33.660
$41.360
$52.510
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$36.648
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$46.502
$43.566
Continental Prestige Electronics
$47.971
Aztec Data Supply Inc.
$61.481
Semicontronic
$67.530
$65.842
$65.504
Lixinc
Robosynatics
$24.906
$24.397
Lucentia Tech
Epart123
$26.500
UNI Independent Distributors
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Futuretech Components
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Glotronic Ltd.
A-Z Elektronik GmbH
Authorized Procurement Solutions
Perfect Parts
GreenTree Electronics
Benley Electronics
BidChips
iBuyXS LLC
Speed Components Ltd (Excess)
The use of plastic/epoxy material makes the package lightweight and durable, suitable for various applications.
Surface mount technology allows for easier and more efficient PCB assembly, saving time and reducing manufacturing costs.
The maximum supply voltage of 1.15V ensures safe operation without exceeding voltage limits, protecting the device from damage.
The square package shape helps in optimizing space on the PCB, allowing for efficient layout and minimizing footprint.
The power supply of 1.2V provides stable and reliable power to the device, ensuring consistent performance.
With a high number of terminals, this product offers ample connectivity options and versatility in connecting to other components.
The grid array, low profile, and fine pitch package style enables high density mounting, contributing to compact design and increased functionality.
The minimum supply voltage of 1.05V ensures that the device can operate within a range of voltages, providing flexibility in power supply options.
With a maximum operating temperature of 85°C, this product can withstand high temperatures, making it suitable for a wide range of environments and applications.
The minimum operating temperature of -20°C ensures that the device can function in cold environments without any performance issues, increasing its usability.
The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, improving the reliability and longevity of the device.
The bottom terminal position allows for easy and secure connection to the PCB, ensuring stable electrical contact for optimal performance.
The maximum seated height of 1.6mm helps in achieving a low-profile design, reducing overall height and enabling compact integration in electronic devices.
The width of 19mm provides a suitable size for easy placement and installation on the PCB, offering convenience in assembly and layout.
The maximum time at peak reflow temperature of 40 seconds ensures efficient and safe soldering process during manufacturing, leading to reliable connections.
The peak reflow temperature of 260°C is suitable for effective soldering of the component on the PCB, ensuring strong and durable connections.
The length of 19mm complements the width and overall dimensions of the package, providing a compact form factor for space-saving integration.
The system-on-chip design integrates multiple functions into a single chip, reducing the need for external components and enhancing overall performance efficiency.
The CMOS technology offers low power consumption and high noise immunity, making the device energy-efficient and reliable in various operating conditions.
The ball terminal form provides secure connections and allows for easy rework or replacement if needed, ensuring flexibility and durability in the assembly process.
The nominal supply voltage of 1.1V provides a stable operating voltage for the device, ensuring consistent performance and minimizing power fluctuations.
The terminal pitch of 0.8mm allows for precise placement and connection on the PCB, enabling high-density mounting and improved signal integrity.
The moisture sensitivity level of 3 indicates that the product can withstand moderate exposure to moisture during storage and handling, ensuring reliability in varying environmental conditions.
Other Function uPs,uCs & Peripheral ICs MCIMX515DJM8C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors
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JESD-609 Code:
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MCIMX515DJM8C Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
1N4148WT
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
1N4148
American Power Devices
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
RC0805FR-0710RL
Yageo
Yageo's RC0805FR-0710RL is a 10 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. With a temperature range of -55 to 155 °C, it suits applications requiring precise resistance values in compact surface mount designs.
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
Baneasa S A
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
LM107H/883
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
BAV99W-7-F
Diodes Incorporated
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
2N2222A
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Itt Semiconductor
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
MCP25050-E/SL
Microchip Technology
MCP25050-E/SL by Microchip: 8-bit microprocessor circuit with 5V supply, operating from -40 to 125 °C. Automotive grade, TS16949 screened IC in small outline package for surface mount applications. Features dual terminal position, CMOS technology, and matte tin finish on gull wing terminals.
ATSAM4C8CB-AU
ATSAM4C8CB-AU by Microchip Technology is a SoC peripheral IC with CMOS technology. It operates in an industrial temperature range from -40 to 85°C and has a low profile flatpack package with 100 terminals. With a supply voltage range of 1.08V to 1.32V, it is suitable for various applications requiring high-performance microcontrollers in compact form factors.
CY8C5287AXI-LP095
Infineon Technologies
PSoC; Temperature Grade: INDUSTRIAL; Terminal Finish: PURE TIN; Moisture Sensitivity Level (MSL): 3;
XCZU5EV-2SFVC784I
Xilinx
XCZU5EV-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.
MC-10105F1-821-FNA-M1-A
Renesas Electronics
MC-10105F1-821-FNA-M1-A by Renesas Electronics is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 0.9V to 3.3V, making it ideal for industrial applications requiring high performance in a compact GRID ARRAY package.
ESP32-WROOM-32E(M113EH3200PH3Q0)
Espressif Systems (Shanghai)
ESP32-WROOM-32E(M113EH3200PH3Q0) by Espressif Systems is a MICROPROCESSOR CIRCUIT with 38 terminals, operating at 3-3.6V. It has an industrial temperature grade of -40 to 85°C and is ideal for IoT applications requiring low power consumption and wireless connectivity.
XCZU4EV-L1SFVC784I
The Xilinx XCZU4EV-L1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. With 784 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high-performance processing capabilities.
MIMXRT1052CVJ5B
NXP Semiconductors
The NXP Semiconductors MIMXRT1052CVJ5B is a System on Chip with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring high performance and reliability.
CY8C6136BZI-F34
CY8C6136BZI-F34 by Infineon is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. With a very thin profile and fine pitch, it's ideal for applications requiring high-performance microcontrollers in compact spaces.
XC7Z007S-2CLG225I
XC7Z007S-2CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 225 terminals in a low profile grid array package, it's ideal for various uPs and uCs applications.
MCIMX6U8DVM10AC
MCIMX6U8DVM10AC by NXP Semiconductors is a System on Chip with 624 terminals, operating at 0-95°C. It has a low profile grid array package style and uses CMOS technology. Ideal for applications requiring high performance in compact designs.
XCZU2CG-1SBVA484I
XCZU2CG-1SBVA484I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.
EFR32MG21A020F512IM32-B
Silicon Labs
EFR32MG21A020F512IM32-B by Silicon Labs is a 32-terminal, square-shaped chip carrier with a supply voltage range of 1.71V to 3.8V. Operating b/w -40°C to 125°C, it's an automotive-grade System on Chip (SoC) suitable for various IoT applications due to its CMOS technology and compact dimensions of 4mm x 4mm.
MCIMX515DJM8C
Freescale Semiconductor
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE;
XC7Z030-L2FBG676I
The Xilinx XC7Z030-L2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.
MCP25050-I/SL
MCP25050-I/SL by Microchip Technology is an 8-bit peripheral IC with a supply voltage range of 2.7V to 5.5V, suitable for industrial applications. It features a small outline package style, dual terminal position, and CMOS technology, making it ideal for microprocessor circuits requiring high reliability in harsh environments.
CY8C21434-24LQXIT
Cypress Semiconductor
PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
ATSAM4C16CB-AUR
Microchip Technology's ATSAM4C16CB-AUR is a SoC with 100 terminals, operating at -40 to 85 °C. It has a supply voltage range of 1.08V to 1.32V and peak reflow temp of 260C. Ideal for industrial applications requiring low profile, fine pitch ICs in a square package.
MCIMX6X4CVM08AB
SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE;
CY8C4149AZI-S598
PROGRAMMABLE SYSTEM ON CHIP; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3;
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MCIMX287CVM4B
MCIMX287CVM4B by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.35V to 1.55V. With a grid array package style, it's ideal for industrial applications requiring low profile and fine pitch components.
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX535DVV1C
MCIMX535DVV1C by NXP Semiconductors is a System on Chip with 529 terminals, operating at -20 to 85°C. It has a supply voltage range of 0.9/1.25-1.3V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact form factors.
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;
MCIMX535DVV1CR2
MCIMX535DVV1CR2 by NXP Semiconductors is a SYSTEM ON CHIP with 529 terminals, operating at -20 to 85 °C. It has a supply voltage range of 0.9/1.25-1.3 V and uses BALL terminal form for various applications in Other Function uPs,uCs & Peripheral ICs.
MCIMX7D5EVM10SD
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q6AVT10AD
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
MCIMX6Q7CVT08AD
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
MCIMX6Q7CVT08AD by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.275V to 1.5V. Ideal for industrial applications requiring fine-pitch grid array package style.
MCIMX6Q6AVT10ADR
MCIMX6Q6AVT10ADR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With 624 terminals in a GRID ARRAY package style, it has a low supply voltage range of 1.35-1.5 V for power efficiency.
MCIMX535DVV2C
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.325V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
MCIMX6Q5EYM10AD
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q5EYM10AD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 105 °C, with a supply voltage range of 1.35V to 1.5V. This IC has a grid array package style, 624 terminals, and is suitable for various uP and uC applications.
MCIMX6Y2DVM09AB
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX7D3EVK10SD
MCIMX7D3EVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating b/w -20 to 105°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.
MCIMX6S7CVM08AC
MCIMX6S7CVM08AC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.275V to 1.5V. This low-profile, fine-pitch IC with 624 terminals is ideal for industrial applications requiring high performance in a compact form factor.
MCIMX6Q7CVT08AE
MCIMX6Q7CVT08AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring fine pitch grid array package style.
MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
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