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XC7Z045-1FBG676C

Xilinx

XC7Z045-1FBG676C by Xilinx

The Xilinx XC7Z045-1FBG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

Median Price

$1,416.960

Lifecycle Status

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4

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1k+

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Nova Conductors

Japan . 75 parts In-Stock

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Vyrian

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Digiode

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One Stop Electronics

USA . 1,370 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 546 parts In-Stock

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Semicontronic

India . 851 parts In-Stock

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Ampacity Inc.

Singapore . 1,069 parts In-Stock

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$34.000

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Corohmni

South Africa . 910 parts In-Stock

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$36.475

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Aztec Data Supply Inc.

USA . 155 parts In-Stock

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Modulus Dynamics

Lithuania . 1,427 parts In-Stock

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Texas Native Microelectronics

USA . 450 parts In-Stock

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$123.782

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$118.831

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$115.117

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$108.928

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Advanced Electronics

New Zealand . 312 parts In-Stock

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$174.856

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Microchip USA

USA . 2,556 parts In-Stock

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Argo Parts USA

USA . 3,878 parts In-Stock

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$1,402.790

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$1,388.621

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$1,374.451

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Continental Prestige Electronics

USA . 7 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Lixinc

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MARBEL Systems

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Supply Digital

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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Corphita

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Qasali Group International

UK . 66 parts In-Stock

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Kenton Components

USA . 33 parts In-Stock

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Perfect Parts

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Overview

Upgrade your electronics with the XC7Z045-1FBG676C by Xilinx, a cutting-edge System on Chip that delivers unmatched performance and reliability. With Xilinx's reputation for top-quality products, you can trust that this peripheral IC will exceed your expectations. Ideal for a variety of applications, this package offers customers incredible value, benefits, and advantages. Experience seamless integration and enhanced functionality with the XC7Z045-1FBG676C - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and improving reliability.

Maximum Supply Voltage: 1.05 V

Operates efficiently within a safe voltage range, ensuring stable performance.

Package Shape: SQUARE

Square package shape is easy to align and mount on the PCB, simplifying the assembly process.

No. of Terminals: 676

The high number of terminals allows for a wide range of connectivity options, making the product versatile and suitable for complex applications.

Package Style (Meter): GRID ARRAY

Grid array package style provides good thermal and electrical performance, essential for high-performance applications.

Minimum Supply Voltage: 0.95 V

Can operate at low supply voltages, reducing power consumption and heat dissipation.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Operates reliably even in low-temperature conditions, ensuring consistent performance in various environments.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure soldering on the PCB, enhancing reliability.

Maximum Seated Height: 2.54 mm

Low seated height reduces the overall profile of the product, making it suitable for space-constrained applications.

Width: 27 mm

Compact width allows for efficient use of PCB real estate, enabling dense and miniaturized designs.

Length: 27 mm

Square shape with equal length and width simplifies placement and routing on the PCB, improving design flexibility.

Peripheral IC Type: SYSTEM ON CHIP

System on chip integration combines multiple functions into a single chip, reducing complexity and cost while improving efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Terminal Form: BALL

Ball terminal form provides reliable contact and reduces the risk of solder joint failure, ensuring long-term performance.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage simplifies power supply design and ensures consistent performance.

Terminal Pitch: 1 mm

Narrow terminal pitch allows for high-density mounting on the PCB, maximizing connectivity options in a compact space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z045-1FBG676C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z045-1FBG676C Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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