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CSR8670C-IBBH-R

Qualcomm

CSR8670C-IBBH-R by Qualcomm

Qualcomm's CSR8670C-IBBH-R is a CMOS microprocessor circuit with 112 terminals in a grid array package. It is surface-mountable and features ball terminal form. This IC is ideal for applications requiring high-performance processing in compact electronic devices.

Median Price

$11.560

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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DigiKey

USA . 2,437 parts In-Stock

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$19.400

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$14.851

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$13.638

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$11.610

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$11.610

Arrow

USA . 8,000 parts In-Stock

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Verical

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Nova Conductors

Japan . 23 parts In-Stock

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Microfarads

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Chip Stock

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Vyrian

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Electronics Depot

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Sunrise Surplus Inc.

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Semtec, LLC

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Prism Electronics

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Aranea Global

USA . 100 parts In-Stock

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$12.743

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$12.233

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Continental Prestige Electronics

USA . 3,659 parts In-Stock

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$13.003

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Modulus Dynamics

Lithuania . 1,182 parts In-Stock

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$30.276

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$30.276

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Microchip USA

USA . 854 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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Corohmni

South Africa . 89 parts In-Stock

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Aztec Data Supply Inc.

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Perfect Parts

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Lixinc

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Authorized Procurement Solutions

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Kepictronics

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Alle Elektronik GmbH

Germany . 1,029 parts In-Stock

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Argo Parts USA

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Overview

Unlock a world of possibilities with the CSR8670C-IBBH-R by Qualcomm. This cutting-edge microprocessor circuit offers unmatched quality and reliability, backed by the trusted name of Qualcomm. Perfect for a wide range of applications, this peripheral IC provides seamless connectivity and enhanced functionality. Experience the value and benefits of this innovative technology, designed to bring convenience and efficiency to your projects. Elevate your devices with the CSR8670C-IBBH-R today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy are common materials for package bodies as they provide good protection for the internal components of the IC and are cost-effective.

Surface Mount: YES

Surface mount packaging allows for easy and efficient mounting on circuit boards, saving space and making it suitable for compact designs.

Package Shape: SQUARE

Square package shapes are versatile and space-efficient, making it easier to place multiple ICs closely together on a circuit board.

No. of Terminals: 112

Having a higher number of terminals allows for more connections to external components, increasing the functionality and versatility of the IC.

Package Style (Meter): GRID ARRAY

Grid array packages are known for their high density and reliable connections, making them suitable for complex electronic systems.

Terminal Position: BOTTOM

Bottom terminal position simplifies the assembly process and allows for easy accessibility during production and testing.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this IC is capable of performing complex processing tasks, making it suitable for applications requiring advanced computational capabilities.

Technology: CMOS

CMOS technology is known for its low power consumption and high noise immunity, making the IC energy-efficient and reliable in various operating conditions.

Terminal Form: BALL

Ball terminal form provides reliable and secure connections, reducing the risk of signal interference or data loss in high-frequency applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CSR8670C-IBBH-R attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Qualcomm

Specs

JESD-30 Code:

S-PBGA-B112

No. of Terminals:

112

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

CSR8670C-IBBH-R Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Qualcomm

Qualcomm develops and licenses wireless technology and designs chips for smartphones. The company's key patents revolve around CDMA and OFDMA technologies, which are standards in wireless communications that are the backbone of all 3G and 4G networks. The firm is a leader in 5G network technology as well. Qualcomm's IP is licensed by virtually all wireless device makers. The firm is also the world's largest wireless chip vendor, supplying nearly every premier handset maker with leading-edge processors. Qualcomm also sells RF-front end modules into smartphones and chips into automotive and Internet of Things markets.

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