Loading...

VS3674PITTA

Texas Instruments

VS3674PITTA by Texas Instruments

VS3674PITTA by Texas Instruments is a MICROPROCESSOR CIRCUIT with 338 terminals in a GRID ARRAY package. It operates b/w 0-85 °C with supply voltage range of 1.28-1.42 V, making it ideal for low profile applications requiring fine pitch technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,835 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,835

-

-

-

-

Digiode

USA . 4,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,635

-

-

-

-

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

550

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 449 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

449

$3.000

-

-

-

Semicontronic

India . 1,008 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

10k+ parts

-

1,008

$6.000

$5.850

$5.820

-

AZTECH Wire

Italy . 581 parts In-Stock

1+ parts

$9.628

100+ parts

-

1k+ parts

-

10k+ parts

-

581

$9.628

-

-

-

Ampacity Inc.

Singapore . 582 parts In-Stock

1+ parts

$32.000

100+ parts

-

1k+ parts

-

10k+ parts

-

582

$32.000

-

-

-

Corohmni

South Africa . 1,109 parts In-Stock

1+ parts

$70.403

100+ parts

-

1k+ parts

-

10k+ parts

-

1,109

$70.403

-

-

-

Parana Technologies

USA . 93 parts In-Stock

1+ parts

$72.286

100+ parts

-

1k+ parts

-

10k+ parts

-

93

$72.286

-

-

-

DigiPath Technology Company

USA . 938 parts In-Stock

1+ parts

$79.596

100+ parts

$73.228

1k+ parts

-

10k+ parts

-

938

$79.596

$73.228

-

-

ChromeModa Solutions

Germany . 4,637 parts In-Stock

1+ parts

$81.220

100+ parts

$66.600

1k+ parts

-

10k+ parts

-

4,637

$81.220

$66.600

-

-

IDEA Electronic Components Group

UK . 1,562 parts In-Stock

1+ parts

$81.220

100+ parts

$77.159

1k+ parts

$73.098

10k+ parts

-

1,562

$81.220

$77.159

$73.098

-

Corphita

USA . 4,903 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,903

-

-

-

-

Argo Parts USA

USA . 4,356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,356

-

-

-

-

Continental Prestige Electronics

USA . 3,727 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,727

-

-

-

-

Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Elevate your electronic designs with the Texas Instruments VS3674PITTA, a high-quality microprocessor circuit offering exceptional performance and reliability. Manufactured by industry leader Texas Instruments, this product is designed for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category. With its cutting-edge technology and innovative design, the VS3674PITTA provides customers with unparalleled value, benefits, and advantages. Experience the difference with Texas Instruments and revolutionize your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.42 V

With a high maximum supply voltage, this product can handle power fluctuations and ensure stable performance.

Package Shape: SQUARE

The square package shape makes it easy to align and mount multiple components on a circuit board, optimizing space utilization.

No. of Terminals: 338

The large number of terminals provides flexibility for connecting a variety of external components, expanding the product's functionality.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch design make this product suitable for compact designs with high component density.

Minimum Supply Voltage: 1.28 V

The low minimum supply voltage ensures energy efficiency and extends battery life for devices powered by this product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows this product to function effectively in cold environments, providing reliable operation across a wide temperature range.

Terminal Finish: TIN SILVER COPPER

The tin, silver, and copper terminal finish enhances conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies the connection of external components and facilitates efficient heat dissipation for improved reliability.

Maximum Seated Height: 1.3 mm

The low maximum seated height minimizes the overall profile of the product, making it suitable for slim and compact electronic designs.

Width: 13 mm

The 13mm width allows for easy integration into standard PCB layouts and facilitates efficient routing of traces for optimized signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures reliable solder connections during the assembly process, reducing the risk of solder defects.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability enables the product to undergo lead-free soldering processes, meeting RoHS compliance standards.

Length: 13 mm

The 13mm length is compact and space-saving, making this product suitable for applications where board real estate is limited.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit type offers advanced computing capabilities, making this product ideal for applications requiring complex data processing.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high-speed operation, making it energy-efficient and reliable for various applications.

Terminal Form: BALL

The ball terminal form provides a reliable and robust connection, improving signal transmission and reducing the risk of connection failures.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage of 1.35V ensures compatibility with common power sources, making integration into existing systems straightforward.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting, enabling compact and efficient PCB designs with multiple components.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product's resistance to moisture and enables safe storage and handling in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs VS3674PITTA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

VS3674PITTA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 2