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MIMXRT1175CVM8A

NXP Semiconductors

MIMXRT1175CVM8A by NXP Semiconductors

The NXP MIMXRT1175CVM8A is a SoC peripheral IC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.1-1.15 V. Its grid array package has 289 terminals and measures 14x14 mm, making it suitable for various embedded applications.

Median Price

$11.060

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 409 parts In-Stock

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$10.777

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Chip1Stop

Japan . 129 parts In-Stock

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$12.300

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Mouser Electronics

USA . 2 parts In-Stock

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$21.760

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$13.390

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$12.710

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$21.760

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$12.710

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Verical

USA . 6,384 parts In-Stock

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$9.362

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EBV Elektronik

Germany . 5,320 parts In-Stock

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Rochester

USA . 760 parts In-Stock

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$11.060

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$9.890

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$9.310

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$9.310

Distributors (In-Stock)

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Digiode

USA . 4,826 parts In-Stock

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$17.005

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$17.005

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Nova Conductors

Japan . 650 parts In-Stock

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$18.700

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$18.700

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Maritex

Poland . 257 parts In-Stock

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$24.867

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$17.005

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$15.957

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257

$24.867

$17.005

$15.957

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Flip Electronics

USA . 172,444 parts In-Stock

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Vyrian

USA . 8,844 parts In-Stock

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TME

Poland . 6,384 parts In-Stock

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$7.890

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IBS Electronics

USA . 760 parts In-Stock

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760

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Anansix

USA . 448 parts In-Stock

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Bristol Electronics

USA . 122 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 770 parts In-Stock

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$14.540

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770

$14.540

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Corphita

USA . 1,444 parts In-Stock

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$16.110

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$16.110

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Continental Prestige Electronics

USA . 6,675 parts In-Stock

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$18.700

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$18.326

6,675

$18.700

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$18.326

Netroflash

USA . 50 parts In-Stock

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$18.700

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50

$18.700

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Semicontronic

India . 542 parts In-Stock

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$31.640

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$30.849

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$30.691

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542

$31.640

$30.849

$30.691

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$41.556

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$39.479

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$39.479

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$41.556

$39.479

$39.479

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Corohmni

South Africa . 7 parts In-Stock

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$41.947

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Microchip USA

USA . 2,547 parts In-Stock

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$48.159

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Aztec Data Supply Inc.

USA . 2,870 parts In-Stock

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$61.130

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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UNI Independent Distributors

Spain . 3,691 parts In-Stock

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Argo Parts USA

USA . 359 parts In-Stock

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Futuretech Components

Singapore . 58 parts In-Stock

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Overview

Discover the power and efficiency of the MIMXRT1175CVM8A by NXP Semiconductors, a cutting-edge solution in the realm of Other Function uPs,uCs & Peripheral ICs. This product boasts superior quality and reliability from a trusted manufacturer, making it perfect for a wide range of applications. With its advanced technology and innovative design, customers can expect seamless performance, enhanced functionality, and unmatched value. Experience the future of electronics with the MIMXRT1175CVM8A and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy are durable materials, ensuring the product is long-lasting and able to withstand different environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Maximum Supply Voltage: 1.15 V

The maximum supply voltage of 1.15V ensures safe operation and prevents damage to the product.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making it suitable for compact designs.

No. of Terminals: 289

With a high number of terminals, this product can support a wide range of functionalities and connections.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density integration, low profile for space-saving, and fine pitch for improved signal integrity.

Minimum Supply Voltage: 1.1 V

The minimum supply voltage of 1.1V ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand elevated temperatures and operate in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function effectively in cold environments.

Terminal Position: BOTTOM

Bottom terminal positioning can simplify the assembly process and improve thermal performance.

Maximum Seated Height: 1.52 mm

A low maximum seated height makes this product suitable for slim and compact device designs.

Width: 14 mm

A moderate width of 14mm allows for flexibility in placement on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 40

The product can withstand peak reflow temperature for up to 40 seconds, enabling efficient soldering processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can undergo reflow soldering without compromising its performance.

Length: 14 mm

A moderate length of 14mm allows for flexibility in placement on the circuit board.

Peripheral IC Type: SoC

With a System-on-Chip (SoC) design, this product integrates multiple functions into a single chip for enhanced performance and efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various signal levels.

Terminal Form: BALL

Ball terminal form provides reliable connections and allows for easy soldering during assembly.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, this product offers high density integration while ensuring signal integrity and ease of assembly.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this product has a moderate level of moisture sensitivity, allowing for safe storage and handling in typical manufacturing environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMXRT1175CVM8A attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.52 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMXRT1175CVM8A Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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