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XCZU11EG-2FFVC1760I

Xilinx

XCZU11EG-2FFVC1760I by Xilinx

XCZU11EG-2FFVC1760I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

Median Price

$7,876.610

Lifecycle Status

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Avnet

USA . 125 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 558 parts In-Stock

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Ampacity Inc.

Singapore . 1,268 parts In-Stock

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MARBEL Systems

Belgium . 5,811 parts In-Stock

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One Stop Electronics

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Corohmni

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Texas Native Microelectronics

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Semicontronic

India . 1,339 parts In-Stock

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Kenton Components

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Qasali Group International

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Aztec Data Supply Inc.

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Modulus Dynamics

Lithuania . 1,789 parts In-Stock

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Continental Prestige Electronics

USA . 4,247 parts In-Stock

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Argo Parts USA

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Netroflash

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Overview

Upgrade your electronic designs with the XCZU11EG-2FFVC1760I by Xilinx, a top-tier manufacturer in the industry. This cutting-edge microprocessor circuit offers unparalleled performance and reliability, making it ideal for a wide range of applications. Its advanced technology and industrial-grade components ensure optimal functionality even in challenging environments. Experience the superior quality and value of Xilinx products with the XCZU11EG-2FFVC1760I – the perfect choice for all your processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various industrial applications.

Surface Mount: YES

This allows for easy PCB assembly, reducing manufacturing time and cost.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for flexibility in power supply options.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate into existing designs and layouts.

No. of Terminals: 1760

The high number of terminals provide versatility and connectivity options for various functions.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and compact size.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the product to function in extreme environments.

Moisture Sensitivity Level (MSL): 4

The MSL 4 indicates that the product can withstand exposure to moisture without compromising performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-2FFVC1760I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU11EG-2FFVC1760I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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