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AM6441BSEFHAALV

Texas Instruments

AM6441BSEFHAALV by Texas Instruments

AM6441BSEFHAALV by Texas Instruments is a 441-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring fine pitch grid array package style and surface mount compatibility.

Median Price

$34.830

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,352 parts In-Stock

1+ parts

$22.217

100+ parts

$19.407

1k+ parts

$13.384

10k+ parts

-

6,352

$22.217

$19.407

$13.384

-

Mouser Electronics

USA . 394 parts In-Stock

1+ parts

$34.830

100+ parts

$24.330

1k+ parts

$23.980

10k+ parts

-

394

$34.830

$24.330

$23.980

-

DigiKey

USA . 336 parts In-Stock

1+ parts

$34.830

100+ parts

$25.040

1k+ parts

$23.988

10k+ parts

-

336

$34.830

$25.040

$23.988

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 709 parts In-Stock

1+ parts

$20.805

100+ parts

-

1k+ parts

-

10k+ parts

-

709

$20.805

-

-

-

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$22.160

100+ parts

-

1k+ parts

-

10k+ parts

-

550

$22.160

-

-

-

Vyrian

USA . 8,774 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,774

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-

-

-

VNN

France . 2,751 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,751

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,321 parts In-Stock

1+ parts

$18.610

100+ parts

$18.145

1k+ parts

$18.052

10k+ parts

-

2,321

$18.610

$18.145

$18.052

-

Ampacity Inc.

Singapore . 2,277 parts In-Stock

1+ parts

$18.610

100+ parts

-

1k+ parts

-

10k+ parts

-

2,277

$18.610

-

-

-

Corphita

USA . 1,167 parts In-Stock

1+ parts

$19.710

100+ parts

-

1k+ parts

-

10k+ parts

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1,167

$19.710

-

-

-

Continental Prestige Electronics

USA . 3,649 parts In-Stock

1+ parts

$22.160

100+ parts

-

1k+ parts

-

10k+ parts

$21.717

3,649

$22.160

-

-

$21.717

Corohmni

South Africa . 739 parts In-Stock

1+ parts

$23.912

100+ parts

-

1k+ parts

-

10k+ parts

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739

$23.912

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-

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Argo Parts USA

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

-

-

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$21.717

1k+ parts

$21.052

10k+ parts

$20.609

500

-

$21.717

$21.052

$20.609

Robosynatics

Brazil . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

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Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$32.606

1k+ parts

$32.606

10k+ parts

$32.606

500

-

$32.606

$32.606

$32.606

Overview

Experience innovation like never before with the AM6441BSEFHAALV by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. This versatile system on chip offers endless possibilities in various applications, providing customers with unparalleled value and performance. From cutting-edge technology to exceptional features, the AM6441BSEFHAALV delivers unmatched benefits, making it the perfect choice for your next project. Elevate your designs with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product easy to handle and resistant to damage during handling or assembly.

Surface Mount: YES

Surface mount technology allows for compact and efficient placement of components on a PCB, saving space and reducing overall system size.

Maximum Supply Voltage: 0.79 V

With a higher maximum supply voltage, the product can handle a wider range of input voltages, adding versatility to its application.

Package Shape: SQUARE

A square package shape allows for easier integration into the overall system design, optimizing space usage on the PCB.

No. of Terminals: 441

Having a high number of terminals enables the product to connect to multiple input and output channels, increasing its functionality and versatility.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array packaging provides a high number of connections in a compact space, optimizing signal integrity and reducing interference.

Minimum Supply Voltage: 0.715 V

A lower minimum supply voltage allows the product to operate efficiently even at low power levels, saving energy and reducing heat dissipation.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures the product can function reliably in harsh environmental conditions without overheating or performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to operate in extreme cold temperatures, making it suitable for a wide range of applications and environments.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies the soldering and assembly process, enhancing the product's manufacturability and reliability.

Maximum Seated Height: 2.652 mm

With a low seated height, the product can be mounted close to the PCB surface, reducing the overall profile of the system and improving airflow for better thermal management.

Width: 17.2 mm

The compact width of the product allows for efficient space utilization on the PCB, enabling a more streamlined and organized layout.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for a longer duration, ensuring proper soldering and reliable connections during the manufacturing process.

Peak Reflow Temperature °C: 250

The high peak reflow temperature capability allows the product to undergo reflow soldering processes without damage, resulting in strong and consistent solder joints.

Length: 17.2 mm

The compact length of the product contributes to efficient use of space on the PCB, enabling a more compact and robust system design.

Peripheral IC Type: SYSTEM ON CHIP

System on Chip integration combines multiple functions into a single IC, reducing component count, board space, and power consumption while enhancing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable for a wide range of applications.

Terminal Form: BALL

Ball terminals provide reliable and secure connections, ensuring good contact with the PCB and minimizing the risk of signal or power loss.

Nominal Supply Voltage: 0.75 V

The nominal supply voltage provides a stable and consistent power source for the product, ensuring reliable operation and consistent performance over time.

Terminal Pitch: 0.8 mm

A fine terminal pitch allows for high-density mounting of components on the PCB, optimizing space usage and signal integrity for improved system performance.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the product is moderately sensitive to moisture, requiring proper handling and storage to prevent damage or performance issues in humid environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6441BSEFHAALV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

441

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.652 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6441BSEFHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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