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AM6441BSFFHAALV

Texas Instruments

AM6441BSFFHAALV by Texas Instruments

AM6441BSFFHAALV by Texas Instruments is a SYSTEM ON CHIP with 441 terminals in a GRID ARRAY package. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring fine pitch and CMOS technology.

Median Price

$33.122

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,523 parts In-Stock

1+ parts

$26.523

100+ parts

$23.576

1k+ parts

$17.335

10k+ parts

-

1,523

$26.523

$23.576

$17.335

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Mouser Electronics

USA . 84 parts In-Stock

1+ parts

$39.720

100+ parts

$27.760

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-

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84

$39.720

$27.760

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 831 parts In-Stock

1+ parts

$25.197

100+ parts

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831

$25.197

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Vyrian

USA . 2,912 parts In-Stock

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2,912

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 577 parts In-Stock

1+ parts

$2.084

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577

$2.084

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Northwest PG Solutions

USA . 380 parts In-Stock

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$2.292

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380

$2.292

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Semicontronic

India . 551 parts In-Stock

1+ parts

$22.540

100+ parts

$21.976

1k+ parts

$21.864

10k+ parts

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551

$22.540

$21.976

$21.864

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Ampacity Inc.

Singapore . 345 parts In-Stock

1+ parts

$22.540

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345

$22.540

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Corphita

USA . 4,539 parts In-Stock

1+ parts

$23.871

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4,539

$23.871

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Corohmni

South Africa . 126 parts In-Stock

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$26.523

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126

$26.523

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Microchip USA

USA . 1,125 parts In-Stock

1+ parts

$61.210

100+ parts

$60.140

1k+ parts

$59.610

10k+ parts

$59.080

1,125

$61.210

$60.140

$59.610

$59.080

Overview

Elevate your electronic projects to new heights with the AM6441BSFFHAALV by Texas Instruments. Crafted with precision and expertise, this cutting-edge product falls under the category of Other Function uPs, uCs & Peripheral ICs, offering unparalleled performance and reliability. Whether you're looking to enhance your automotive systems, industrial controls, or consumer electronics, this versatile device is designed to exceed your expectations. With Texas Instruments' reputation for quality and innovation, you can trust that this product delivers exceptional value, benefits, and advantages to meet all your needs. Upgrade your projects today with the AM6441BSFFHAALV and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the product, making it suitable for various environments.

Surface Mount: YES

Allows for easy installation and mounting on circuit boards, simplifying the manufacturing process.

Maximum Supply Voltage: 0.79 V

Operates efficiently within a specified voltage range, ensuring stable performance and preventing damage from overvoltage.

Package Shape: SQUARE

Provides a compact design, saving space on the circuit board and allowing for efficient layout.

No. of Terminals: 441

Offers a high number of terminals for connectivity options, making it versatile for different applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enables precise alignment and soldering during assembly, improving overall product quality and reliability.

Minimum Supply Voltage: 0.715 V

Works reliably even at low voltages, ensuring consistent performance under varying power conditions.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, making it suitable for use in harsh environments or applications that generate heat.

Minimum Operating Temperature: -40 °C

Operates effectively in cold temperatures, providing flexibility for use in different temperature conditions.

Terminal Position: BOTTOM

Facilitates easy connection and integration with other components, enhancing the overall efficiency of the product.

Maximum Seated Height: 2.652 mm

Has a low profile design, allowing for space-saving installation in compact devices or systems.

Width: 17.2 mm

Compact width size enables tight packaging of components, improving overall product density and performance.

Peak Reflow Temperature °C: 250

Can withstand high temperatures during the reflow soldering process, ensuring proper solder connections for reliable operation.

Length: 17.2 mm

Compact length size contributes to saving space on the circuit board, enabling efficient placement of other components.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple functions on a single chip reduces component count and complexity, leading to cost savings and improved performance.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity, enhancing energy efficiency and reliability.

Terminal Form: BALL

Ball terminals provide reliable electrical connections and facilitate easy installation on the circuit board.

Nominal Supply Voltage: 0.75 V

Designed to operate optimally at a specific voltage level, ensuring consistent and reliable performance.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for compact design and efficient routing of signals, improving overall product functionality.

Moisture Sensitivity Level (MSL): 3

With MSL 3 rating, the product is suitable for a wide range of environments and storage conditions, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6441BSFFHAALV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

441

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.652 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6441BSFFHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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