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XC7Z035-2FBG676I

Xilinx

XC7Z035-2FBG676I by Xilinx

The Xilinx XC7Z035-2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.

Median Price

$1,826.560

Lifecycle Status

Suppliers In-Stock

8

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1k+

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Avnet

USA . 5 parts In-Stock

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$252.100

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Mouser Electronics

USA . 2 parts In-Stock

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$1,826.560

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DigiKey

USA . 3 parts In-Stock

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$1,957.670

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Digiode

USA . 379 parts In-Stock

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$1,625.688

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VNN

France . 330 parts In-Stock

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$1,711.250

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Nova Conductors

Japan . 66 parts In-Stock

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Vyrian

USA . 6,242 parts In-Stock

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Chip Stock

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Ampacity Inc.

Singapore . 1,378 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 329 parts In-Stock

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$11.266

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Semicontronic

India . 444 parts In-Stock

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$15.000

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$14.625

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$14.550

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One Stop Electronics

USA . 1,107 parts In-Stock

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$30.000

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Aztec Data Supply Inc.

USA . 2,025 parts In-Stock

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$65.230

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Corohmni

South Africa . 51 parts In-Stock

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$68.047

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Modulus Dynamics

Lithuania . 469 parts In-Stock

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$112.733

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$112.733

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$112.733

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Texas Native Microelectronics

USA . 1,000 parts In-Stock

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$148.072

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$142.149

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$137.707

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$130.303

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$130.303

Kenton Components

USA . 3,186 parts In-Stock

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$177.686

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$170.579

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$165.248

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$156.364

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$170.579

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$156.364

Qasali Group International

UK . 60 parts In-Stock

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$399.794

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Microchip USA

USA . 1,557 parts In-Stock

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Corphita

USA . 85 parts In-Stock

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$1,540.125

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Aranea Global

USA . 100 parts In-Stock

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$1,697.071

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$1,629.188

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Continental Prestige Electronics

USA . 4,966 parts In-Stock

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$1,731.705

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Argo Parts USA

USA . 4,859 parts In-Stock

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$1,731.705

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$1,714.388

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$1,697.071

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$1,679.754

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$1,679.754

Advanced Electronics

New Zealand . 75 parts In-Stock

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$1,766.339

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Lixinc

USA . 11,799 parts In-Stock

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MARBEL Systems

Belgium . 4,832 parts In-Stock

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Supply Digital

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Vigor

Singapore . 359 parts In-Stock

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

USA . 250 parts In-Stock

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$0.221

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RC Electronics

USA . 51 parts In-Stock

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Overview

Experience unmatched performance and reliability with the XC7Z035-2FBG676I by Xilinx. As a leading manufacturer in the industry, Xilinx delivers cutting-edge technology that sets new standards for quality. This versatile System on Chip is perfect for a wide range of applications, offering customers superior value and benefits. Elevate your projects to new heights with the XC7Z035-2FBG676I and unlock endless possibilities in the world of Other Function uPs,uCs & Peripheral ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.05 V

The higher maximum supply voltage allows for flexibility in power requirements.

Package Shape: SQUARE

The square package shape helps in efficient use of space on the PCB.

No. of Terminals: 676

The high number of terminals allows for versatile connectivity options.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal performance and signal integrity.

Minimum Supply Voltage: 0.95 V

The lower minimum supply voltage enables energy efficiency and can support low-power applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation even in extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and assembly.

Maximum Seated Height: 2.54 mm

The low seated height helps in overall compact design of the product.

Width: 27 mm

The compact width allows for space-efficient placement on the PCB.

Length: 27 mm

The compact length enables efficient use of board space.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip peripheral IC type integrates multiple functions into a single chip, reducing overall system complexity.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and thermal performance.

Nominal Supply Voltage: 1 V

The nominal supply voltage ensures compatibility with standard power sources.

Terminal Pitch: 1 mm

The small terminal pitch allows for high-density mounting and miniaturization of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z035-2FBG676I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z035-2FBG676I Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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