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XC7Z014S-1CLG400I

Xilinx

XC7Z014S-1CLG400I by Xilinx

XC7Z014S-1CLG400I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile, fine pitch grid array package, it's ideal for various applications requiring high-performance processing capabilities.

Median Price

$132.500

Lifecycle Status

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< 1k

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Digiode

USA . 53 parts In-Stock

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$125.875

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VNN

France . 253 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 782 parts In-Stock

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$14.776

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Aztec Data Supply Inc.

USA . 345 parts In-Stock

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Corohmni

South Africa . 64 parts In-Stock

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Texas Native Microelectronics

USA . 200 parts In-Stock

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$100.521

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$93.485

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Vigor

Singapore . 595 parts In-Stock

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Semicontronic

India . 87 parts In-Stock

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$112.630

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Modulus Dynamics

Lithuania . 234 parts In-Stock

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Corphita

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Kenton Components

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$120.625

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Continental Prestige Electronics

USA . 5,538 parts In-Stock

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Bastille Electronics

Australia . 45 parts In-Stock

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$117.925

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Microchip USA

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Ampacity Inc.

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Qasali Group International

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Futuretech Components

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MARBEL Systems

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Argo Parts USA

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Supply Digital

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Robosynatics

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Lucentia Tech

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Overview

Elevate your projects with the XC7Z014S-1CLG400I by Xilinx, a top-tier manufacturer known for their cutting-edge technology and reliability. This versatile System on Chip offers endless possibilities in the realm of Other Function uPs,uCs & Peripheral ICs. With a low profile and fine pitch package style, this product is perfect for applications requiring precision and efficiency. Experience the seamless integration and superior performance that only Xilinx can deliver. Upgrade your designs today with the XC7Z014S-1CLG400I and unlock a world of innovation at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good mechanical and thermal properties, providing durability and reliability for the product.

Surface Mount: YES

Surface mount technology allows for more efficient PCB assembly and space-saving design.

Maximum Supply Voltage: 1.05 V

Operates at a safe maximum supply voltage to prevent damage to the device.

Package Shape: SQUARE

Square package shape can offer better space utilization and easier handling during assembly.

No. of Terminals: 400

Large number of terminals provide flexibility for connection to various external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch enables high-density mounting and improved signal integrity.

Minimum Supply Voltage: 0.95 V

Can operate at low supply voltages for efficient power consumption.

Maximum Operating Temperature: 100 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme low-temperature environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier soldering and assembly on the PCB.

Maximum Seated Height: 1.6 mm

Low profile design helps in space-constrained applications.

Width: 17 mm

Compact width size enables efficient PCB layout and space utilization.

Length: 17 mm

Square shape and size provide uniformity in dimensions for consistent assembly.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple functions into a single chip simplifies system design and reduces component count.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form allows for reliable solder connections and high connectivity.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent performance of the device.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density mounting and precise connections on the PCB.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z014S-1CLG400I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B400

Length:

17 mm

No. of Terminals:

400

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XC7Z014S-1CLG400I Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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