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ST33HTPH2E28AHB3

STMicroelectronics

ST33HTPH2E28AHB3 by STMicroelectronics

ST33HTPH2E28AHB3 by STMicroelectronics is a cryptographic authenticator in a compact 28-terminal package. It operates b/w -40 °C to 105 °C, with a nominal voltage of 1.8V and features a thin profile design for space-constrained applications. Ideal for secure authentication in IoT devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,161 parts In-Stock

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3,161

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Digiode

USA . 1,547 parts In-Stock

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1,547

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Anansix

USA . 205 parts In-Stock

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205

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 286 parts In-Stock

1+ parts

$20.717

100+ parts

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1k+ parts

$18.646

10k+ parts

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286

$20.717

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$18.646

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MKK Technologies

India . 1,363 parts In-Stock

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$38.958

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1,363

$38.958

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DigiPath Technology Company

USA . 1,363 parts In-Stock

1+ parts

$38.958

100+ parts

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1,363

$38.958

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Corohmni

South Africa . 1,116 parts In-Stock

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$62.212

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1,116

$62.212

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Corphita

USA . 622 parts In-Stock

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622

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Parana Technologies

USA . 281 parts In-Stock

1+ parts

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$24.771

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281

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$24.771

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Overview

Elevate your security solutions with the ST33HTPH2E28AHB3 from STMicroelectronics, a leader in innovative technology. This cutting-edge cryptographic authenticator delivers unmatched reliability and performance, ensuring your applications run seamlessly across various environments. Its compact design and robust temperature range make it ideal for diverse uses, empowering your devices with advanced authentication capabilities that boost user trust and enhance overall system integrity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent durability and resistance to environmental factors, making this component reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and lower assembly costs, making it suitable for modern electronics with limited space.

Package Shape: RECTANGULAR

The rectangular shape ensures efficient use of PCB space, facilitating denser circuit layouts.

No. of Terminals: 28

With 28 terminals, the component supports versatile connections necessary for complex functionalities, including cryptographic operations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile enable integration into space-constrained designs, ideal for portable devices.

Maximum Operating Temperature: 105 °C

Rated for high temperatures, this component is suitable for applications in harsh environments without risking performance.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliability in extreme conditions, making this product suitable for automotive and industrial applications.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in PCB design and improves the reliability of connections.

Maximum Seated Height: 1.2 mm

The low seated height helps maintain a slim profile in design, contributing to more compact electronic assemblies.

Width: 4.4 mm

A narrow width allows for high-density integration, beneficial in optimizing space on PCBs.

Length: 9.7 mm

The streamlined length supports efficient layouts while maintaining accessibility for soldering and testing.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

As a cryptographic authenticator, it enhances security in electronic systems, crucial for applications requiring data protection.

Technology: CMOS

CMOS technology offers low power consumption and high speed, enabling efficient performance for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and are reliable for surface mount applications, ensuring strong mechanical connections.

Nominal Supply Voltage: 1.8 V

Operating on a low voltage of 1.8 V supports energy-efficient designs, crucial for portable and battery-operated devices.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch enables high-density layouts, accommodating more functionalities without increasing the overall footprint.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ST33HTPH2E28AHB3 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

ST33HTPH2E28AHB3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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