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ST33HTPH2E28AAF1

STMicroelectronics

ST33HTPH2E28AAF1 by STMicroelectronics

ST33HTPH2E28AAF1 by STMicroelectronics is a cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 105°C, suitable for industrial applications. This small outline IC has 28 terminals, gull wing form, and a package size of 4.4x9.7 mm for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,278 parts In-Stock

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6,278

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Anansix

USA . 2,492 parts In-Stock

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2,492

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Digiode

USA . 1,887 parts In-Stock

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1,887

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,349 parts In-Stock

1+ parts

$2.280

100+ parts

-

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1,349

$2.280

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AZTECH Wire

Italy . 756 parts In-Stock

1+ parts

$10.838

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-

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756

$10.838

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Ampacity Inc.

Singapore . 580 parts In-Stock

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$16.000

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580

$16.000

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Corohmni

South Africa . 1,009 parts In-Stock

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$20.779

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1,009

$20.779

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IDEA Electronic Components Group

UK . 1,560 parts In-Stock

1+ parts

$74.951

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$67.456

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1,560

$74.951

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$67.456

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MKK Technologies

India . 531 parts In-Stock

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$140.941

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531

$140.941

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DigiPath Technology Company

USA . 531 parts In-Stock

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$140.941

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531

$140.941

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Microchip USA

USA . 5,192 parts In-Stock

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Corphita

USA . 4,959 parts In-Stock

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4,959

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Continental Prestige Electronics

USA . 2,777 parts In-Stock

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Argo Parts USA

USA . 855 parts In-Stock

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Parana Technologies

USA . 636 parts In-Stock

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$89.616

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636

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$89.616

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Bastille Electronics

Australia . 56 parts In-Stock

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56

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Overview

Experience cutting-edge technology with the ST33HTPH2E28AAF1 by STMicroelectronics. This innovative cryptographic authenticator offers unparalleled security and performance, making it the ideal choice for various applications. With a focus on quality and reliability, STMicroelectronics ensures that every product meets the highest standards. Discover the value and benefits of this product, designed to meet the demanding requirements of industrial environments. Trust STMicroelectronics to provide you with the best solutions for your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective, durable, and provides good protection for the internal components of the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic circuits, making the product more reliable and compact.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to integrate the product into different electronic systems and designs.

No. of Terminals: 28

With a sufficient number of terminals, the product can support complex functionalities and interfaces.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures the product can withstand harsh environmental conditions and perform reliably.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function in cold environments without any issues.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves the robustness of the product's connections.

Maximum Seated Height: 1.2 mm

Low seated height makes the product suitable for applications where space is limited or height constraints exist.

Width: 4.4 mm

Compact width allows for easy integration and placement of the product in tight spaces or on small PCBs.

Length: 9.7 mm

Short length ensures the product can be accommodated in various electronic devices without taking up too much space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can operate reliably in demanding industrial environments.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

The use of cryptographic authenticator technology enhances the security of the product, making it suitable for applications requiring secure communications or data protection.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage helps in reducing power consumption and heat dissipation, extending the product's operational life.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density packaging and integration of multiple components on a small PCB, making the product suitable for compact designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ST33HTPH2E28AAF1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

ST33HTPH2E28AAF1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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