Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MPFS095TLS-FCSG325I by Microchip Tech is a 325-terminal IC with CMOS tech. Operates b/w -40 to 100°C, voltage range of 0.97-1.03V. Ideal for SoC programming applications due to its rectangular shape and bottom terminal position.
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$468.645
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NIA Electronics
Ledger Components
LOOK Integrated Logistics
Argo Parts USA
LMD Electronica
Montano Global Distributors
PLASTIC/EPOXY - Lightweight and durable material choice for packaging.
YES - Easy and convenient installation process for circuit boards.
1.03 V - Ability to handle high voltage inputs for enhanced performance.
RECTANGULAR - Space-efficient design for compact electronic devices.
325 - Versatile connectivity options for various components and peripherals.
0.97 V - Reliable operation even with low voltage power sources.
100 °C - Suitable for use in various environmental conditions.
40 °C - Wide temperature range ensures consistent performance in extreme conditions.
BOTTOM - Facilitates easy and efficient PCB layout and assembly.
PROGRAMMABLE SoC - Flexibility and customization options for specific applications.
CMOS - Low power consumption and high noise immunity for energy-efficient operation.
BALL - Secure and reliable connection between the IC and the PCB.
1 V - Standard voltage level for compatibility with different power sources.
Other Function uPs,uCs & Peripheral ICs MPFS095TLS-FCSG325I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology
Additional Features:
JESD-30 Code:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Shape:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
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Terminal Position:
Peripheral IC Type:
MPFS095TLS-FCSG325I Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Obsolescence/ EOL - Software 19/Apr/2023
PCN Design/Specification - MPFxxx/RTPF 10/May/2023 Software 19/Apr/2023
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
ABS25-32.768KHZ-1-T
Abracon
Abracon's ABS25-32.768KHZ-1-T crystal oscillator offers 10 ppm frequency tolerance, 126% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal operating frequency, such as IoT devices and precision timing systems.
LL4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
SMBJ18CA
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
LM358N
Kec
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
BAV99
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Taitron Components
SS14
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Good-ark Electronics
Gec Plessey Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM2675M-ADJ/NOPB
SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
1N4148
Rochester Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MC7805CTG
Onsemi
MC7805CTG by Onsemi is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation. The package style is flange mount with through-hole terminals, ensuring easy installation and reliability in diverse electronic designs.
1N4148WS
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Lite-on Semiconductor
XAZU7EV-1FBVB900Q
Xilinx
Xilinx XAZU7EV-1FBVB900Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in automotive grade temperature range (-40 to 125 °C) and supports CAN, I2C, SPI, UART bus compatibility. The package has 900 terminals in a GRID ARRAY style suitable for surface mount applications.
MGM210PB32JIA2R
Silicon Labs
SYSTEM ON CHIP;
MCIMX6Q5EYM12AD
NXP Semiconductors
MCIMX6Q5EYM12AD by NXP Semiconductors is a System on Chip with 624 terminals, operating at -20 to 105 °C. It features a low profile grid array package style and CMOS technology, suitable for various applications requiring high performance and low power consumption.
XCC1312R1F3RGZR
Texas Instruments
XCC1312R1F3RGZR by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for INDUSTRIAL applications requiring high performance in compact spaces.
XCZU4CG-1FBVB900I
XCZU4CG-1FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.
XCZU4EV-2FBVB900I
XCZU4EV-2FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package. Suitable for industrial use, it requires a supply voltage of 0.825V to 0.876V and can withstand peak reflow temperature of 245C.
AM6441BSEFHAALV
AM6441BSEFHAALV by Texas Instruments is a 441-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring fine pitch grid array package style and surface mount compatibility.
ESP32-S3-WROOM-1U-N4
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1U-N4 by Espressif Systems is a surface mount SoC with 41 terminals. It operates at a voltage range of 3V to 3.6V and has a compact size of 18mm x 19.2mm. This versatile IC is commonly used in various applications such as IoT devices, wearables, and smart home automation systems.
XC7Z015-1CLG485C
XC7Z015-1CLG485C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.
AM6234ATCGGAALW
AM6234ATCGGAALW by Texas Instruments is a SoC peripheral IC with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.715V to 0.79V. With 425 terminals in a grid array package, it's ideal for applications requiring high-speed processing in compact spaces.
AM6231ATGGHAALW
AM6231ATGGHAALW by Texas Instruments is a CMOS SoC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high-density integration and low-profile design.
DA14682-00F08A92
Renesas Electronics
SoC; Peak Reflow Temperature (C): 255; Moisture Sensitivity Level (MSL): 3;
MIMX8MM6DVTLZAAR
The NXP Semiconductors MIMX8MM6DVTLZAAR is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and uses CMOS technology. Ideal for applications requiring high processing power in compact spaces.
CY8C3866AXI-040T
Infineon Technologies
CY8C3866AXI-040T by Infineon Technologies is a 100-terminal, square-shaped IC with a supply voltage range of 1.71V to 5.5V. It operates in industrial temperatures from -40°C to 85°C and features a ROM size of 65536 bits. This programmable SoC is ideal for applications requiring low-profile, fine-pitch packages in various industries.
AM6234ATCGHAALW
AM6234ATCGHAALW by Texas Instruments is a SoC peripheral IC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring fine pitch and low profile components.
CY8C6136BZI-F34
CY8C6136BZI-F34 by Infineon is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. With a very thin profile and fine pitch, it's ideal for applications requiring high-performance microcontrollers in compact spaces.
CY8C4146LQI-S422
PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Finish: PURE TIN; Moisture Sensitivity Level (MSL): 3;
ESP32-C3-MINI-1-H4
ESP32-C3-MINI-1-H4 by Espressif Systems is a SoC with 53 terminals, operating at 3.3V, suitable for applications requiring a compact design. With a max supply voltage of 3.6V and operating temperature range from -40 to 105°C, it is ideal for IoT devices and embedded systems needing low power consumption.
TMS320DM368ZCEF
TMS320DM368ZCEF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating b/w 0-85 °C. It supports I2C, SPI, UART, USB buses and has a terminal pitch of 0.65 mm. Ideal for applications requiring low profile, fine pitch package style in CMOS technology.
MSP430F6777AIPZ
MSP430F6777AIPZ by Texas Instruments is a 16-bit microprocessor circuit with 262144 ROM words and 32 RAM words. It has 6 ADC channels, 3 DMA channels, and offers connectivity through I2C, IRDA, SPI, and UART. This IC is commonly used in industrial applications due to its temperature grade of -40 to +85 °C.
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MPFS250TFCVG484I
Microchip Technology
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
MPFS250T-FCSG536I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
MPFS250T-1FCVG484E
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
MPFS250T-FCG1152E
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
MPFS250T-FCG1152I
MPFS250T-FCG1152I by Microchip Tech is a 1152-terminal programmable SoC with CMOS tech. Operates b/w -40 to 100 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high-density integration in compact spaces.
MPFS250TS-1FCVG484I
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Minimum Supply Voltage: .97 V;
MPFS250T-1FCSG536E
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; Width: 16 mm;
MPFS250T-1FCG1152E
Microchip Technology's MPFS250T-1FCG1152E is a programmable SoC with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.97-1.03V. This square GRID ARRAY package has 1152 terminals and is suitable for various Other Function uPs,uCs applications.
MPFS250T-1FCG1152I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA1152,34X34,40;
MPFS250TS-FCG1152I
MPFS250TS-FCG1152I by Microchip Technology is a programmable SoC with a package style of grid array and 1152 terminals. It operates at a voltage range of 0.97V to 1.03V and has a max seated height of 2.99mm. This IC is commonly used in applications requiring other function uPs, uCs, and peripheral devices.
MPFS250T-1FCSG536I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm;
MPFS250T-1FCVG784I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;
MPFS250TFCVG484E
MPFS250TFCVG484E by Microchip Tech features 484 terminals, operates b/w 0-100°C, and has a supply voltage range of 0.97-1.03V. This SoC peripheral IC in a grid array package is ideal for applications requiring fine pitch technology and CMOS design.
MPFS095TLS-FCVG484I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA484,22X22,32;
MPFS095T-1FCVG784I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
MPFS025T-1FCSG325E
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 325; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: BOTTOM;
MPFS025T-1FCVG484E
MPFS025T-1FCVG484E by Microchip Tech is a 484-terminal IC with CMOS tech. Operates b/w 0-100°C, voltage range of 0.97-1.03V. Ideal for applications requiring a programmable SoC in a compact 19x19mm grid array package.
MPFS025T-1FCVG484I
Microchip Technology's MPFS025T-1FCVG484I is a 484-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.97V to 1.03V. This square-shaped IC in grid array package is ideal for various applications requiring fine pitch surface mount technology.
MPFS025T-FCSG325E
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 325; Package Shape: RECTANGULAR; Surface Mount: YES; JESD-30 Code: R-PBGA-B325;
MPFS095TLS-FCSG536I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;
Supply Digital Components
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