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CY8C6137BZI-F34

Infineon Technologies

CY8C6137BZI-F34 by Infineon Technologies

CY8C6137BZI-F34 by Infineon is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. With a grid array package style, it's ideal for applications requiring fine pitch and thin profile designs.

Median Price

$9.730

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 260 parts In-Stock

1+ parts

$5.940

100+ parts

$5.580

1k+ parts

$5.050

10k+ parts

-

260

$5.940

$5.580

$5.050

-

Farnell

UK . 1,267 parts In-Stock

1+ parts

$7.180

100+ parts

$4.890

1k+ parts

$4.810

10k+ parts

-

1,267

$7.180

$4.890

$4.810

-

Mouser Electronics

USA . 546 parts In-Stock

1+ parts

$9.730

100+ parts

$6.460

1k+ parts

$5.870

10k+ parts

-

546

$9.730

$6.460

$5.870

-

DigiKey

USA . 298 parts In-Stock

1+ parts

$9.730

100+ parts

$6.459

1k+ parts

$6.000

10k+ parts

$5.862

298

$9.730

$6.459

$6.000

$5.862

Newark

USA . 795 parts In-Stock

1+ parts

$10.020

100+ parts

$6.650

1k+ parts

$6.370

10k+ parts

-

795

$10.020

$6.650

$6.370

-

RS (Exports)

UK . 100 parts In-Stock

1+ parts

$10.992

100+ parts

$7.895

1k+ parts

-

10k+ parts

-

100

$10.992

$7.895

-

-

Element14

Singapore . 1,267 parts In-Stock

1+ parts

$876.140

100+ parts

$654.530

1k+ parts

$626.310

10k+ parts

-

1,267

$876.140

$654.530

$626.310

-

Flip Electronics (Authorized)

USA . 272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

272

-

-

-

-

Verical

USA . 272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.656

10k+ parts

-

272

-

-

$5.656

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2 parts In-Stock

1+ parts

$5.643

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$5.643

-

-

-

Vyrian

USA . 695 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

695

-

-

-

-

Flip Electronics

USA . 272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

272

-

-

-

-

Nova Conductors

Japan . 41 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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41

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 442 parts In-Stock

1+ parts

$5.050

100+ parts

$4.924

1k+ parts

$4.898

10k+ parts

-

442

$5.050

$4.924

$4.898

-

Ampacity Inc.

Singapore . 220 parts In-Stock

1+ parts

$5.050

100+ parts

-

1k+ parts

-

10k+ parts

-

220

$5.050

-

-

-

Corphita

USA . 523 parts In-Stock

1+ parts

$5.346

100+ parts

-

1k+ parts

-

10k+ parts

-

523

$5.346

-

-

-

Continental Prestige Electronics

USA . 1,278 parts In-Stock

1+ parts

$7.030

100+ parts

$5.100

1k+ parts

-

10k+ parts

-

1,278

$7.030

$5.100

-

-

Aztec Data Supply Inc.

USA . 3,127 parts In-Stock

1+ parts

$16.879

100+ parts

-

1k+ parts

-

10k+ parts

-

3,127

$16.879

-

-

-

Modulus Dynamics

Lithuania . 2,920 parts In-Stock

1+ parts

$23.147

100+ parts

$22.221

1k+ parts

$21.295

10k+ parts

-

2,920

$23.147

$22.221

$21.295

-

Corohmni

South Africa . 3,208 parts In-Stock

1+ parts

$73.869

100+ parts

-

1k+ parts

-

10k+ parts

-

3,208

$73.869

-

-

-

Argo Parts USA

USA . 828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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828

-

-

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-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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300

-

-

-

-

Overview

Unlock endless possibilities with the CY8C6137BZI-F34 by Infineon Technologies. Crafted with precision and cutting-edge technology, this versatile programmable SoC offers unparalleled performance in a compact package. Ideal for a wide range of applications, this peripheral IC is designed to elevate your projects to new heights. Experience seamless integration and reliable operation with this innovative solution. Upgrade your designs and bring your ideas to life with the CY8C6137BZI-F34.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides a lightweight and durable housing for the IC, ensuring long-term reliability.

Surface Mount:

YES - Allows for easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage:

3.6 V - Supports a wide range of applications, making it versatile for various electronic devices.

Package Shape:

SQUARE - Offers a compact design that optimizes space on PCBs, ideal for small and portable devices.

No. of Terminals:

124 - Provides ample connectivity options for interfacing with other components, enhancing functionality.

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH - Facilitates high-density packaging, enabling more features in a smaller footprint.

Minimum Supply Voltage:

1.7 V - Allows for operation in low-power environments, conserving energy and increasing efficiency.

Maximum Operating Temperature:

85 °C - Ensures reliable performance in a wide range of operating conditions, suitable for various environments.

Minimum Operating Temperature:

40 °C - Enables operation in extreme cold temperatures, making it suitable for outdoor or industrial applications.

Terminal Finish:

TIN SILVER COPPER - Provides a reliable and corrosion-resistant finish for long-term connectivity and signal integrity.

Terminal Position:

BOTTOM - Simplifies the PCB layout and routing, enhancing overall system design and ease of assembly.

Maximum Seated Height:

1 mm - Offers a low profile design that saves vertical space in compact electronic devices.

Width:

9 mm - Compact width dimension ensures compatibility with a variety of PCB sizes and layouts.

Length:

9 mm - Compact length dimension helps optimize space utilization on the PCB, particularly in constrained layouts.

Peripheral IC Type:

PROGRAMMABLE SoC - Combines peripheral functionality and processing power in one chip, offering enhanced capabilities for the end-product.

Technology:

CMOS - Utilizes low power consumption and high noise immunity, improving overall performance and efficiency.

Terminal Form:

BALL - Enables easy soldering and rework, simplifying assembly and maintenance processes.

Nominal Supply Voltage:

1.8 V - Optimal voltage for stable and efficient operation, enhancing the reliability of the IC.

Terminal Pitch:

0.65 mm - Provides fine pitch spacing for high-density routing, suitable for complex and advanced PCB designs.

Moisture Sensitivity Level (MSL):

3 - Indicates a moderate level of sensitivity to moisture, requiring standard handling and storage precautions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CY8C6137BZI-F34 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PBGA-B124

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

124

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA124,13X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

CY8C6137BZI-F34 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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