Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MCIMX6Q6AVT10AE by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a grid array package. It operates b/w -40 to 125 °C and supports supply voltages from 1.35V to 1.5V. Ideal for applications requiring high-performance processing in compact electronic devices.
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$105.990
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$106.730
DigiKey
$139.870
$108.546
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$99.750
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$104.910
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$19.667
Semicontronic
$84.750
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Ampacity Inc.
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$107.665
Microchip USA
$171.765
Lixinc
A-Z Elektronik GmbH
iodParts Technologies Inc.
UNI Independent Distributors
Argo Parts USA
Component Connect
The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-lasting performance.
Being surface mountable makes integration into electronic systems easier and more efficient.
The higher maximum supply voltage allows for flexibility in power input requirements.
The square package shape helps in easy placement and orientation during assembly.
The high number of terminals provides extensive connectivity options for various applications.
The grid array and fine pitch package style enables compact design and efficient use of space on a PCB.
The lower minimum supply voltage helps in reducing power consumption and increasing efficiency.
The high maximum operating temperature ensures reliable performance even in harsh environments.
The low minimum operating temperature allows for use in a wide range of temperature conditions.
The bottom terminal position simplifies PCB layout and connection with other components.
The low maximum seated height facilitates compact and slim device designs.
The moderate width enables easy handling and installation in various electronic systems.
The specified time at peak reflow temperature ensures proper soldering and reliability during assembly.
The high peak reflow temperature allows for robust soldering and connection for long-term usage.
The moderate length complements the width and seated height specifications for a balanced package design.
The System-on-Chip (SoC) design integrates multiple functions into a single chip, reducing component count and complexity.
Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity for efficient operation.
The ball terminal form provides reliable solder connections and simplifies the assembly process.
The small terminal pitch enables high-density mounting on PCBs, saving space and allowing for more functionality in a compact design.
The MSL 3 rating indicates that the product can withstand moderate exposure to moisture during storage and handling.
Other Function uPs,uCs & Peripheral ICs MCIMX6Q6AVT10AE attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors
JESD-30 Code:
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MCIMX6Q6AVT10AE Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - Manual Updates 14/Jul/2019 Mult Dev 26/May/2023
PCN Assembly/Origin - COO/Label 15-apr-2022
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
EU2B-YS2J03C
Idec
ROTARY SWITCH;
NC7WZ07P6X
Onsemi
The Onsemi NC7WZ07P6X is a logic gate with 2 functions, featuring a propagation delay of 4.8 ns at 1.8V supply voltage. With open-drain output characteristics, it operates in industrial temperatures from -40 to 85°C. Ideal for applications requiring fast signal processing and low power consumption in compact designs.
2N2222A
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
2N7002
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
Vishay Sprague
NPN; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JEDEC-95 Code: TO-18; Maximum Collector-Emitter Voltage: 40 V;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Bharat Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
RC0603FR-071KL
Yageo
Yageo's RC0603FR-071KL is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in electronics, it operates b/w -55 to 155 °C with a temperature coefficient of 100 ppm/°C.
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
LL4148-GS08
Vishay Intertechnology
The Vishay Intertechnology LL4148-GS08 is a glass diode with fast recovery time of 0.008 us and max reverse current of 5 uA. Ideal for applications requiring rectification, it has a breakdown voltage of 100 V and can handle a peak forward current of 2 A.
MMBT2222ALT1G
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
BSS138
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
LM107H
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
Sensitron Semiconductor
XC7Z007S-2CLG225E
Xilinx
The Xilinx XC7Z007S-2CLG225E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring low profile and fine pitch grid array packages.
AR1100T-I/SS
Microchip Technology's AR1100T-I/SS is a CMOS microprocessor circuit with 20 terminals in a small outline package. It operates at temperatures from -40 to 85 °C and has a supply voltage range of 3.135V to 3.465V, making it ideal for industrial applications requiring precise control and processing capabilities.
AR1100-I/MQ
Microchip Technology's AR1100-I/MQ is a CMOS microprocessor circuit with 20 terminals in a square chip carrier package. It operates b/w -40 to 85 °C with supply voltage range of 3.135V to 3.465V, suitable for industrial applications requiring very thin profile and surface mount capability.
DA14682-00F08A92
Renesas Electronics
SoC; Peak Reflow Temperature (C): 255; Moisture Sensitivity Level (MSL): 3;
ATSHA204A-XHDA-T
ATSHA204A-XHDA-T by Microchip Technology is a cryptographic authenticator IC with 8 terminals. It operates b/w -40 to 85°C, with supply voltage ranging from 2V to 5.5V. This small outline package is ideal for secure applications in automotive and industrial sectors.
ATSAMA5D27-WLSOM1
ATSAMA5D27-WLSOM1 by Microchip: Operates at 3-5.5V, -40 to 85°C. With 188 terminals, it's a CMOS microprocessor circuit ideal for various applications requiring high-performance computing in a compact square package.
XCZU4EV-1FBVB900I
XCZU4EV-1FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Suitable for industrial applications, it requires a supply voltage of 0.825V to 0.876V.
XC7Z015-3CLG485E
The Xilinx XC7Z015-3CLG485E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in Other Function uPs,uCs & Peripheral ICs.
AS5140H-ASSM
Ams Ag
SYSTEM ON CHIP; Terminal Finish: TIN; JESD-609 Code: e3;
XC7Z014S-1CLG400C
The Xilinx XC7Z014S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 400 terminals in a low profile grid array package, it's ideal for various embedded applications.
CY8C4127LQI-BL453
Infineon Technologies
Infineon's CY8C4127LQI-BL453 is an Industrial-grade Programmable SoC with Pure Tin finish. It can withstand peak reflow temp of 260°C for 30s. Ideal for applications requiring versatile peripheral ICs in harsh environments.
MCIMX515DJM8C
NXP Semiconductors
MCIMX515DJM8C by NXP Semiconductors is a SYSTEM ON CHIP with 529 terminals, operating at 1.05-1.15V. It features a CMOS technology, low profile GRID ARRAY package style suitable for applications requiring high performance in a compact form factor and temperature range of -20 to 85°C.
CY8C6347BZI-BLD33
PROGRAMMABLE SoC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3;
A5000R2HQ1/Z016UZ
NXP Semiconductors A5000R2HQ1/Z016UZ is a cryptographic authenticator IC with 20 terminals, CMOS technology, and 1.8V nominal voltage. It operates b/w -40 to 105 °C and has a max supply voltage of 3.6V. Ideal for secure applications requiring high-level encryption in compact designs.
FT800Q-R
Bridgetek
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
MSP430F6779IPZR
Texas Instruments
MSP430F6779IPZR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32 RAM words. Operating at a max frequency of 25 MHz, it's ideal for industrial applications requiring low power consumption and high performance. With I2C, SPI, and UART compatibility, this microprocessor offers versatile connectivity options in a compact FLATPACK package.
ATSAMA5D27-SOM1
ATSAMA5D27-SOM1 by Microchip: Operates at 3-3.6V, -40 to 85°C temp range, with 176 terminals. Ideal for industrial applications, supports CAN(2), I2C, SPI interfaces. Compact MICROELECTRONIC ASSEMBLY package style at 38x40mm size.
XCZU4CG-1SFVC784I
XCZU4CG-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with a supply voltage of 0.85 V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.
ESP32-WROOM-32UE-N16
Espressif Systems (Shanghai)
ESP32-WROOM-32UE-N16 by Espressif Systems is a 38-terminal SoC with 3.3V nominal voltage, CMOS technology, and -40 to 85°C operating temperature range. Ideal for IoT applications requiring low power consumption and compact design in microelectronic assemblies.
EFR32MG24B310F1536IM48-B
Silicon Labs
EFR32MG24B310F1536IM48-B by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
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MCIMX287CVM4B
MCIMX287CVM4B by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.35V to 1.55V. With a grid array package style, it's ideal for industrial applications requiring low profile and fine pitch components.
Freescale Semiconductor
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX535DVV1C
MCIMX535DVV1C by NXP Semiconductors is a System on Chip with 529 terminals, operating at -20 to 85°C. It has a supply voltage range of 0.9/1.25-1.3V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact form factors.
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;
MCIMX535DVV1CR2
MCIMX535DVV1CR2 by NXP Semiconductors is a SYSTEM ON CHIP with 529 terminals, operating at -20 to 85 °C. It has a supply voltage range of 0.9/1.25-1.3 V and uses BALL terminal form for various applications in Other Function uPs,uCs & Peripheral ICs.
MCIMX7D5EVM10SD
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q6AVT10AD
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
MCIMX6Q7CVT08AD
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
MCIMX6Q7CVT08AD by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.275V to 1.5V. Ideal for industrial applications requiring fine-pitch grid array package style.
MCIMX6Q6AVT10ADR
MCIMX6Q6AVT10ADR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With 624 terminals in a GRID ARRAY package style, it has a low supply voltage range of 1.35-1.5 V for power efficiency.
MCIMX535DVV2C
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.325V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
MCIMX6Q5EYM10AD
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q5EYM10AD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 105 °C, with a supply voltage range of 1.35V to 1.5V. This IC has a grid array package style, 624 terminals, and is suitable for various uP and uC applications.
MCIMX6Y2DVM09AB
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX7D3EVK10SD
MCIMX7D3EVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating b/w -20 to 105°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.
MCIMX6S7CVM08AC
MCIMX6S7CVM08AC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.275V to 1.5V. This low-profile, fine-pitch IC with 624 terminals is ideal for industrial applications requiring high performance in a compact form factor.
MCIMX6Q7CVT08AE
MCIMX6Q7CVT08AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring fine pitch grid array package style.
MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
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