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XC7Z030-1FBG484C

Xilinx

XC7Z030-1FBG484C by Xilinx

XC7Z030-1FBG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0°C to 85°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, making it suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

Median Price

$271.700

Lifecycle Status

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Newark

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$258.640

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Mouser Electronics

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DigiKey

USA . 40 parts In-Stock

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Farnell

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Element14

Singapore . 16 parts In-Stock

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IBS Electronics

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Digiode

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VNN

France . 499 parts In-Stock

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Nova Conductors

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Vyrian

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AZTECH Wire

Italy . 797 parts In-Stock

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MARBEL Systems

Belgium . 3,269 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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$110.962

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Modulus Dynamics

Lithuania . 350 parts In-Stock

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$121.758

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Vigor

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Ampacity Inc.

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Semicontronic

India . 38 parts In-Stock

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Continental Prestige Electronics

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Corohmni

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Microchip USA

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Supply Digital

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Lixinc

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Argo Parts USA

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Overview

Unlock the power of cutting-edge technology with the XC7Z030-1FBG484C by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality products that exceed expectations. This versatile System on Chip is perfect for a wide range of applications, offering unmatched performance and reliability. Whether you're looking to optimize your system's capabilities or streamline your operations, this product is sure to deliver exceptional value and benefits. Experience the advantages of Xilinx technology and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage tolerance provides flexibility in power supply options.

Package Shape: SQUARE

The square package shape ensures efficient use of space on the PCB.

No. of Terminals: 484

The high number of terminals allows for a wide range of connectivity options, making this product versatile.

Package Style (Meter): GRID ARRAY

The grid array package style offers a secure and reliable connection to the PCB.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement helps in reducing power consumption.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures proper functionality even in cold environments.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and assembly process.

Maximum Seated Height: 2.54 mm

The low maximum seated height allows for a compact overall design of the product.

Width: 23 mm

The moderate width of the product ensures compatibility with standard PCB layout designs.

Length: 23 mm

The moderate length of the product ensures compatibility with standard PCB layout designs.

Peripheral IC Type: SYSTEM ON CHIP

Being a system-on-chip design integrates multiple functions into a single chip, reducing overall system complexity and cost.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

The use of ball terminal form ensures reliable and secure connections on the PCB.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V is a common standard for many applications, ensuring compatibility.

Terminal Pitch: 1 mm

The compact terminal pitch of 1mm allows for high-density mounting on the PCB.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z030-1FBG484C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B484

Length:

23 mm

No. of Terminals:

484

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA484,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XC7Z030-1FBG484C Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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