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MIMX8MM3CVTKZAA

NXP Semiconductors

MIMX8MM3CVTKZAA by NXP Semiconductors

The NXP Semiconductors MIMX8MM3CVTKZAA is a SoC with 486 terminals, operating b/w -40 to 105°C. It has a supply voltage range of 0.9V to 1V and uses CMOS technology. This low-profile, fine-pitch IC is suitable for applications requiring high performance in compact spaces.

Median Price

$31.500

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 631 parts In-Stock

1+ parts

$26.790

100+ parts

$21.590

1k+ parts

$21.350

10k+ parts

$21.350

631

$26.790

$21.590

$21.350

$21.350

Chip1Stop

Japan . 152 parts In-Stock

1+ parts

$31.500

100+ parts

$20.900

1k+ parts

-

10k+ parts

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152

$31.500

$20.900

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-

Mouser Electronics

USA . 155 parts In-Stock

1+ parts

$36.960

100+ parts

$25.510

1k+ parts

$23.430

10k+ parts

-

155

$36.960

$25.510

$23.430

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DigiKey

USA . 137 parts In-Stock

1+ parts

$39.760

100+ parts

$30.527

1k+ parts

$27.356

10k+ parts

-

137

$39.760

$30.527

$27.356

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EBV Elektronik

Germany . 2,128 parts In-Stock

1+ parts

-

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2,128

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Verical

USA . 912 parts In-Stock

1+ parts

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$22.344

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912

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-

$22.344

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 408 parts In-Stock

1+ parts

$22.990

100+ parts

-

1k+ parts

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408

$22.990

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-

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Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$31.650

100+ parts

-

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39

$31.650

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Vyrian

USA . 5,533 parts In-Stock

1+ parts

-

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5,533

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Anansix

USA . 2,409 parts In-Stock

1+ parts

-

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2,409

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 537 parts In-Stock

1+ parts

$21.780

100+ parts

-

1k+ parts

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537

$21.780

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Ampacity Inc.

Singapore . 318 parts In-Stock

1+ parts

$22.770

100+ parts

-

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318

$22.770

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Semicontronic

India . 199 parts In-Stock

1+ parts

$22.770

100+ parts

$22.201

1k+ parts

$22.087

10k+ parts

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199

$22.770

$22.201

$22.087

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$31.017

100+ parts

-

1k+ parts

$29.776

10k+ parts

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1,000

$31.017

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$29.776

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$31.374

100+ parts

$28.550

1k+ parts

$25.727

10k+ parts

-

5,000

$31.374

$28.550

$25.727

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Continental Prestige Electronics

USA . 6,005 parts In-Stock

1+ parts

$31.650

100+ parts

-

1k+ parts

-

10k+ parts

$31.017

6,005

$31.650

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-

$31.017

Aztec Data Supply Inc.

USA . 1,485 parts In-Stock

1+ parts

$48.200

100+ parts

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1,485

$48.200

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Microchip USA

USA . 2,845 parts In-Stock

1+ parts

$69.468

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2,845

$69.468

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Corohmni

South Africa . 296 parts In-Stock

1+ parts

$81.850

100+ parts

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296

$81.850

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UNI Independent Distributors

Spain . 4,836 parts In-Stock

1+ parts

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4,836

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Argo Parts USA

USA . 3,102 parts In-Stock

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3,102

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Infinite Electronics LLP (Excess)

. 1,990 parts In-Stock

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1,990

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Overview

Unlock the potential of your next project with the MIMX8MM3CVTKZAA by NXP Semiconductors. This cutting-edge product in the Other Function uPs,uCs & Peripheral ICs category offers unparalleled quality and reliability, thanks to its manufacturer's reputation for excellence. With a wide range of applications, this versatile device provides unmatched value and benefits to customers looking to innovate and stay ahead in today's fast-paced world. Experience the advantages of this powerful technology and take your projects to new heights with the MIMX8MM3CVTKZAA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 1 V

The maximum supply voltage of 1V ensures safe operation and protection of the device.

Package Shape: SQUARE

The square shape of the package allows for easy integration into various electronic systems.

No. of Terminals: 486

The high number of terminals provides ample connectivity options for different peripherals and components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high-density integration, low profile for space-constrained applications, and fine pitch for better signal integrity.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage allows for energy-efficient operation and flexibility in power sources.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in extreme cold environments.

Terminal Finish: TIN SILVER

The terminal finish of tin silver provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position is convenient for soldering and ensures a secure connection to the PCB.

Maximum Seated Height: 1.25 mm

The low seated height reduces the overall profile of the product, making it suitable for compact designs.

Width: 14 mm

The narrow width of 14mm allows for efficient placement on a PCB and saves space in the overall system design.

Maximum Time At Peak Reflow Temperature (s): 40

The short reflow time of 40 seconds reduces the risk of thermal damage to the components during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and reliability of the connections.

Length: 14 mm

The compact length of 14mm allows for versatile placement and integration into various electronic systems.

Peripheral IC Type: SoC

The System on Chip (SoC) configuration integrates multiple functions into a single IC, reducing board space and simplifying design.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form facilitates easy soldering and provides a reliable connection to the PCB.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage of 0.95V is well-suited for low-power applications and ensures stable operation.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and efficient use of PCB space.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product can withstand moderate levels of moisture exposure during storage and assembly.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMX8MM3CVTKZAA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B486

JESD-609 Code:

e2

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

486

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA486,27X27,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.25 mm

Maximum Supply Voltage:

1 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMX8MM3CVTKZAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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