Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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A2F200M3F-FG484 by Microchip Technology is a SoC FPGA with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 1.425-1.575 V. This package has 484 terminals in a grid array shape, suitable for various uPs and uCs applications.
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This material is durable and cost-effective, making the product reliable and affordable.
Surface mount technology allows for easy and efficient assembly of the product onto PCBs.
The high maximum supply voltage allows for flexibility in power requirements for different applications.
Square packages are space-efficient and provide a stable mounting platform for the product.
Having a large number of terminals enables the product to interface with multiple components and peripherals.
Grid array packages offer high density of connections, reducing signal interference and improving performance.
The low minimum supply voltage ensures efficient power consumption and compatibility with various power sources.
With a high maximum operating temperature, the product can withstand harsh environmental conditions.
The low minimum operating temperature ensures reliable performance even in cold environments.
Tin lead finish provides good solderability and conductivity, ensuring a reliable electrical connection.
Bottom terminal position facilitates easy and secure mounting of the product onto PCBs.
System-on-Chip FPGA offers versatility and integration of functions, making the product suitable for a wide range of applications.
CMOS technology provides low power consumption and high noise immunity, enhancing the performance and efficiency of the product.
Ball terminal form enables easy installation and removal of the product, making it user-friendly.
The nominal supply voltage is optimized for performance and efficiency, ensuring stable operation of the product.
MSL level 3 indicates that the product can withstand moderate exposure to moisture during handling and assembly processes.
Other Function uPs,uCs & Peripheral ICs A2F200M3F-FG484 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology
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A2F200M3F-FG484 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - Smartfusion Datasheet Chg 14/Nov/2018 Mult Dev Software Chg 8/Oct/2018
PCN Assembly/Origin - Manufacturing Change 23/Feb/2021
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
SS14
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
AT90CAN128-16AUR
Microchip Technology
AT90CAN128-16AUR by Microchip: 16 MHz clock, 8-bit data RAM, and 131072 ROM words. Ideal for industrial applications with CAN, SPI, TWI connectivity and low power mode. Contains 4 timers, 8 ADC channels, and supports up to 10-bit analog to digital conversion.
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
LAN8720A-CP-TR
LAN8720A-CP-TR by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at 3.3V, and consumes 54mA max supply current. Ideal for network interfaces in commercial applications due to its small size (4x4mm) and low power consumption.
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
2N7002
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
STM8S003F3P6TR
STMicroelectronics
STM8S003F3P6TR by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 1024 RAM bytes, 128 data EEPROM size, and 5-ch 10-bit ADC channels. Ideal for industrial applications requiring low power mode and connectivity via I2C, SPI, and UART interfaces.
1N4148WS
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; No. of Elements: 1; Maximum Output Current: .2 A; Config: SINGLE;
SMBJ18CA
Micro Commercial Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CMX
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
ULN2803ADWRG4
Texas Instruments
ULN2803ADWRG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output, and built-in transient protection. It operates b/w -40 to 85 °C with a max supply voltage of 3 V. Ideal for applications requiring sink current flow direction in a small outline package style.
2N7002DWH6327XTSA1
Infineon Technologies
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
2N2222A
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
1554216002
Molex
WIRE AND CABLE;
B340A-13-F
B340A-13-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 3A max output current, and 0.5V max forward voltage. It is used for efficiency applications in electronics due to its small outline package and high operating temperature range of -55°C to 150°C.
43025-0400
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
1N4148
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
LTC4263IS#PBF
Analog Devices
LTC4263IS#PBF by Analog Devices is a CMOS microprocessor circuit with 14 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 4.5-5.5V and comes in a small outline package suitable for industrial applications requiring peripheral ICs.
XC7Z035-L2FBG676I
Xilinx
The Xilinx XC7Z035-L2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.
CC1310F128RGZT
CC1310F128RGZT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring a microprocessor circuit in a compact chip carrier package style.
CC2543RHBR
CC2543RHBR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32 terminals, operating b/w -40 to 85 °C. It supports I2C, SPI, UART, and USART bus compatibility at 3V nominal voltage. Ideal for industrial applications requiring CMOS technology in a compact square package style.
MCIMX515DJM8C
NXP Semiconductors
MCIMX515DJM8C by NXP Semiconductors is a SYSTEM ON CHIP with 529 terminals, operating at 1.05-1.15V. It features a CMOS technology, low profile GRID ARRAY package style suitable for applications requiring high performance in a compact form factor and temperature range of -20 to 85°C.
AM4376BZDNA100
AM4376BZDNA100 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105°C, has 491 terminals in a GRID ARRAY package style, and supports a supply voltage range of 1.272V to 1.378V. Ideal for industrial applications requiring low profile and fine pitch components.
MCIMX6S5DVM10AC
Freescale Semiconductor
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
DA14531-00000FX2
Renesas Electronics
SoC; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 1;
XCZU3CG-1SFVA625E
XCZU3CG-1SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. With 625 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.
MCIMX6Q7CVT08AD
MCIMX6Q7CVT08AD by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.275V to 1.5V. Ideal for industrial applications requiring fine-pitch grid array package style.
XC7Z045-2FBG676E
XC7Z045-2FBG676E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.
OMAPL138EZWTD4E
OMAPL138EZWTD4E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates in an INDUSTRIAL temperature grade range of -40 to 90 °C, suitable for applications requiring high-speed processing and connectivity via I2C, SPI, UART, and USB interfaces.
CY8C4025AZI-S413
Cypress Semiconductor
PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
MCP2221-I/P
MCP2221-I/P by Microchip Technology is a CMOS peripheral IC with 14 terminals, operating at 3-5.5V. Ideal for industrial applications, it features a max supply current of 15mA and operates in temperatures ranging from -40 to 85°C.
MCIMX6Q5EYM10AC
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
XC7Z035-3FFG900E
XC7Z035-3FFG900E by Xilinx is a 900-terminal programmable SoC with CMOS technology. Operating at 0-100°C, it has a supply voltage range of 0.95-1.05 V and terminal pitch of 1 mm. Ideal for applications requiring high-performance computing in compact spaces.
ATWINC1500-MR210PB
ATWINC1500-MR210PB by Microchip operates at 3-4.2V, with temp range -40 to 85°C. It's a CMOS microprocessor circuit for industrial applications, featuring 28 terminals in a rectangular package style. Ideal for IoT devices requiring low power consumption and reliable wireless connectivity.
MCIMX27VOP4A
MCIMX27VOP4A by NXP Semiconductors is a 404-terminal System on Chip with CMOS technology. It operates b/w -20 to 85 °C and has a supply voltage range of 1.38-1.52 V. Ideal for applications requiring low profile, fine pitch grid array packages.
MCIMX6U5DVM10ACR
MCIMX6U5DVM10ACR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.35-1.5 V. Ideal for applications requiring low profile and fine pitch package style in a square shape with 624 terminals.
MCIMX286CVM4B
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
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A2F200M3F-CSG288I
Actel
SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.425 V;
SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B288;
Microsemi
SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; Technology: CMOS;
A2F200M3F-FGG256I
SoC FPGA; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Surface Mount: YES;
A2F200M3F-1FG484I
SoC FPGA; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B484;
A2F200M3F-FG256I
SoC FPGA; Terminal Finish: TIN LEAD; Moisture Sensitivity Level (MSL): 3;
A2F200M3F-1FGG256I
SoC FPGA; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250; Maximum Time At Peak Reflow Temperature (s): 30;
A2F200M3F-CS288I
SoC FPGA; Terminal Finish: TIN LEAD SILVER;
A2F200M3F-1FGG484I
SoC FPGA; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
A2F200M3F-FG256YI
SoC FPGA; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
A2F200M3B-1FGG256
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
A2F200M3C-1CSG288
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE;
A2F200M3C-1FG256
A2F200M3D-1FGG256
A2F200M3D-CSG288
A2F200M3E-1CS288
A2F200M3G-1FG484
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
A2F200M3F-1CS288
SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; Terminal Finish: TIN LEAD SILVER;
A2F200M3F-1CSG288
SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; Surface Mount: YES;
A2F200M3F-1FG484
SoC FPGA; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Supply Digital Components
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